analog switch ics quad spst cmos analog switch
| Parameter Name | Attribute value |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Maker | Maxim |
| Parts packaging code | DIP |
| package instruction | DIP, |
| Contacts | 14 |
| Reach Compliance Code | compli |
| ECCN code | EAR99 |
| Factory Lead Time | 6 weeks |
| Analog Integrated Circuits - Other Types | SPST |
| JESD-30 code | R-PDIP-T14 |
| JESD-609 code | e3 |
| length | 19.05 mm |
| Humidity sensitivity level | 1 |
| Number of channels | 1 |
| Number of functions | 4 |
| Number of terminals | 14 |
| On-state resistance matching specifications | 0.3 Ω |
| Maximum on-state resistance (Ron) | 75 Ω |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | 260 |
| Certification status | Not Qualified |
| Maximum seat height | 4.572 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| Maximum disconnect time | 75 ns |
| Maximum connection time | 125 ns |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Matte Tin (Sn) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 7.62 mm |
| MAX4066CPD+ | MAX4066CSD+T | MAX4066ACEE+ | MAX4066AESD+ | MAX4066CEE+T | |
|---|---|---|---|---|---|
| Description | analog switch ics quad spst cmos analog switch | analog switch ics quad spst cmos analog switch | analog switch ics quad spst cmos analog switch | analog switch ics quad spst cmos analog switch | analog switch ics quad spst cmos analog switch |
| Is it lead-free? | Lead free | Lead free | Lead free | Lead free | Lead free |
| Is it Rohs certified? | conform to | conform to | conform to | conform to | conform to |
| Maker | Maxim | Maxim | Maxim | Maxim | Maxim |
| Parts packaging code | DIP | SOIC | SOIC | SOIC | SOIC |
| package instruction | DIP, | 0.150 INCH, SOP-14 | QSOP-16 | 0.150 INCH, SOP-14 | SSOP, SSOP16,.25 |
| Contacts | 14 | 14 | 16 | 14 | 16 |
| Reach Compliance Code | compli | compliant | compli | compli | compli |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Factory Lead Time | 6 weeks | 6 weeks | 6 weeks | 6 weeks | 6 weeks |
| Analog Integrated Circuits - Other Types | SPST | SPST | SPST | SPST | SPST |
| JESD-30 code | R-PDIP-T14 | R-PDSO-G14 | R-PDSO-G16 | R-PDSO-G14 | R-PDSO-G16 |
| JESD-609 code | e3 | e3 | e3 | e3 | e3 |
| length | 19.05 mm | 8.65 mm | 4.89 mm | 8.65 mm | 4.89 mm |
| Humidity sensitivity level | 1 | 1 | 1 | 1 | 1 |
| Number of channels | 1 | 1 | 1 | 1 | 1 |
| Number of functions | 4 | 4 | 4 | 4 | 4 |
| Number of terminals | 14 | 14 | 16 | 14 | 16 |
| On-state resistance matching specifications | 0.3 Ω | 0.3 Ω | 0.3 Ω | 0.3 Ω | 0.3 Ω |
| Maximum on-state resistance (Ron) | 75 Ω | 75 Ω | 75 Ω | 75 Ω | 75 Ω |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 85 °C | 70 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | SOP | SSOP | SOP | SSOP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | SMALL OUTLINE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, SHRINK PITCH |
| Peak Reflow Temperature (Celsius) | 260 | 260 | 260 | 260 | 260 |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 4.572 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | YES | YES | YES | YES |
| Maximum disconnect time | 75 ns | 75 ns | 75 ns | 75 ns | 75 ns |
| Maximum connection time | 125 ns | 125 ns | 125 ns | 125 ns | 125 ns |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL |
| Terminal surface | Matte Tin (Sn) | Matte Tin (Sn) | Tin (Sn) | Matte Tin (Sn) | Tin (Sn) |
| Terminal form | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | GULL WING |
| Terminal pitch | 2.54 mm | 1.27 mm | 0.635 mm | 1.27 mm | 0.635 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | 30 | 30 | 30 | 30 |
| width | 7.62 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm |
| Base Number Matches | - | 1 | 1 | 1 | 1 |
| Is Samacsys | - | - | N | N | N |
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