R1LP0408CSP-5SI datasheet, PDF

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R1LP0408CSP-5SI: Description512K X 8 STANDARD SRAM, 55 ns, PDSO32; Categorystorage; File Size75KB，14 Pages; ManufacturerHitachi （Renesas ）; Websitehttp://www.renesas.com/eng/

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R1LP0408CSP-5SI Overview

512K X 8 STANDARD SRAM, 55 ns, PDSO32

R1LP0408CSP-5SI Parametric

Parameter Name	Attribute value
Number of functions	1
Number of terminals	32
Maximum operating temperature	85 Cel
Minimum operating temperature	-40 Cel
Maximum supply/operating voltage	5.5 V
Minimum supply/operating voltage	4.5 V
Rated supply voltage	5 V
maximum access time	55 ns
Processing package description	0.525 INCH, Plastic, SOP-32
Lead-free	Yes
EU RoHS regulations	Yes
state	DISCONTINUED
Craftsmanship	CMOS
packaging shape	Rectangle
Package Size	SMALL OUTLINE
surface mount	Yes
Terminal form	GULL WING
Terminal spacing	1.27 mm
terminal coating	NOT SPECIFIED
Terminal location	pair
Packaging Materials	Plastic/Epoxy
Temperature level	INDUSTRIAL
memory width	8
organize	512K × 8
storage density	4.19E6 deg
operating mode	ASYNCHRONOUS
Number of digits	524288 words
Number of digits	512K
Memory IC type	Standard memory
serial parallel	parallel

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R1LP0408C-I Series

Wide Temperature Range Version

4 M SRAM (512-kword

8-bit)

REJ03C0067-0100Z

Rev. 1.00

Aug.01.2003

Description

The R1LP0408C-I is a 4-Mbit static RAM organized 512-kword

8-bit. R1LP0408C-I Series has realized

higher density, higher performance and low power consumption by employing CMOS process technology

(6-transistor memory cell). The R1LP0408C-I Series offers low power standby power dissipation;

therefore, it is suitable for battery backup systems. It has packaged in 32-pin SOP, 32-pin TSOP II.

Features

•

Single 5 V supply: 5 V

10%

•

Access time: 55/70 ns (max)

•

Power dissipation:



Active: 10 mW/MHz (typ)



Standby: 4

µW

(typ)

•

Completely static memory.



No clock or timing strobe required

•

Equal access and cycle times

•

Common data input and output.



Three state output

•

Directly TTL compatible.



All inputs and outputs

•

Battery backup operation.

•

Operating temperature:

−40

to +85°C

Rev.1.00, Aug.01.2003, page 1 of 13

R1LP0408CSP-5SI Related Products

	R1LP0408CSP-5SI	R1LP0408C	R1LP0408CSB-5SI	R1LP0408CSB-7LI	R1LP0408CSC-5SI	R1LP0408CSC-7LI	R1LP0408CSP-7LI
Description	512K X 8 STANDARD SRAM, 55 ns, PDSO32	512K X 8 STANDARD SRAM, 55 ns, PDSO32	512K X 8 STANDARD SRAM, 55 ns, PDSO32	512K X 8 STANDARD SRAM, 55 ns, PDSO32	512K X 8 STANDARD SRAM, 55 ns, PDSO32	512K X 8 STANDARD SRAM, 55 ns, PDSO32	512KX8 STANDARD SRAM, 70ns, PDSO32
Number of functions	1	1	1	1	1	1	1
Number of terminals	32	32	32	32	32	32	32
Maximum operating temperature	85 Cel	85 Cel	85 Cel	85 Cel	85 Cel	85 Cel	85 Cel
Minimum operating temperature	-40 Cel	-40 Cel	-40 Cel	-40 Cel	-40 Cel	-40 Cel	-40 Cel
Maximum supply/operating voltage	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply/operating voltage	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Rated supply voltage	5 V	5 V	5 V	5 V	5 V	5 V	5 V
maximum access time	55 ns	55 ns	55 ns	55 ns	55 ns	55 ns	70 ns
Processing package description	0.525 INCH, Plastic, SOP-32	0.400 INCH, Plastic, TSOP2-32	0.400 INCH, Plastic, TSOP2-32	0.400 INCH, Plastic, TSOP2-32	0.400 INCH, Plastic, TSOP2-32	0.400 INCH, Plastic, TSOP2-32	0.525 INCH, PLASTIC, SOP-32
Lead-free	Yes	Yes	Yes	Yes	Yes	Yes	Yes
EU RoHS regulations	Yes	Yes	Yes	Yes	Yes	Yes	Yes
state	DISCONTINUED	DISCONTINUED	DISCONTINUED	DISCONTINUED	DISCONTINUED	DISCONTINUED	TRANSFERRED
Craftsmanship	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
packaging shape	Rectangle	Rectangle	Rectangle	Rectangle	Rectangle	Rectangle	RECTANGULAR
Package Size	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE
surface mount	Yes	Yes	Yes	Yes	Yes	Yes	Yes
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
Terminal spacing	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
terminal coating	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Terminal location	pair	pair	pair	pair	pair	pair	DUAL
Packaging Materials	Plastic/Epoxy	Plastic/Epoxy	Plastic/Epoxy	Plastic/Epoxy	Plastic/Epoxy	Plastic/Epoxy	PLASTIC/EPOXY
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
memory width	8	8	8	8	8	8	8
organize	512K × 8	512K × 8	512K × 8	512K × 8	512K × 8	512K × 8	512K X 8
storage density	4.19E6 deg	4.19E6 deg	4.19E6 deg	4.19E6 deg	4.19E6 deg	4.19E6 deg	4.19E6 deg
operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Memory IC type	Standard memory	Standard memory	Standard memory	Standard memory	Standard memory	Standard memory	STANDARD SRAM
serial parallel	parallel	parallel	parallel	parallel	parallel	parallel	PARALLEL
Number of digits	512K	512K	512K	512K	512K	512K	512K

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