OCL: Open Circuit Inductance test parameters: 100 kHz, 0.1 Vrms, 0.0 Adc. OCL@-40 °C can
be lower than OCL@+20 °C by 15% max.
2)
Irms: DC current for an approximate DT of 40 °C without core loss. Derating is necessary for
AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat
generating components will affect the temperature rise. It is recommended that the
temperature of the part not exceed
+125
°C under worst case operating conditions verified in
the end application.
3)
Isat1: Amperes Peak for approximately 30% rolloff (@+25 °C)
4)
Isat2: Amperes Peak for approximately 30% rolloff (@+125 °C)
5) K-factor: Used to determine B p-p for core loss (see graph). B p-p = K*L*∆I
B p-p:(mT), K: (K factor from table), L: (Inductance in µH),
∆I
(Peak to peak ripple current in
Amps).
Part number definition:
HCF1305-XXX-R
HCF1305 = Product code and size
XXX = Inductance value in uH.
R = Decimal point. If no R is present, third character = #of zeros -R suffix
indicates RoHS compliant
Dimensions-
mm
TOP V IEW
A
BOTTOM VI EW
F
FRONT VIEW
DIMENSION TABLE
RECOMMENDED PCBLAYOU T
L
SCHEMAT IC
1
HCF1305-XXX
wwllyy R
B
2
D
C
3
A: 12.5max
G: 4.00 Ref
.
B: 12.5max
H: 5.40 Ref.
C: 5.0max
I: 3.00 Ref.
D: 2.00 ref
J: 4.00 Ref.
E: 2.40 +/- 0.10 K: 4.00 Ref.
F: 6.90 +/- 0.30 L: 3.4 Ref.
K
H
G
J
1
2
wwllyy=Date code, R=Revision Level
I
I
E
Do not route traces or vias underneath the inductor
Packaging
information
- mm
1.5 dia
+0.1/-0.0
2.0
4.0
1.5 dia
min
A
1.75
11.5
24.0
+/-0.3
HCF 1305-X X X
wwlly y-R
B0
K0
A0
16.00
A
SECTION A-A
A0= 12.60 mm
B0= 12.60 mm
K0= 5.50 m
m
User direction of feed
Parts packaged on a 13" Diameter reel.
600 parts per reel.
2
www.eaton.com/electronics
HCF1305
High frequency, high current power inductor
Temperature rise
vs
total loss
Technical Data
4133
Effective
July
2017
100
Temperature Rise (ºC)
80
60
40
20
0
0
0.4
0.8
1.2
1.6
2
Total Pow er Loss (W)
Core
loss
vs Bp-p
10
1 MHz
500
kHz
300
kHz
200
kHz
100 kHz
Core Loss (W)
1
0.1
0.01
0.001
0.0001
1
10
Bp-p (m T)
100
1000
Inductance characteristics
Normalized Rollo Curves at 25 Deg. C
100.0%
100.0%
90.0%
80.0%
70.0%
60.0%
50.0%
40.0%
30.0%
0.0%
R47, 1R0, 1R8 , 3R0 and 4R0
R56, 1R2 and 2R2
3R3 and 4R7
Normali
Curves at 125 Deg. C
90.0%
80.0%
% of OC L
70.0%
R47, 1R0, 1R8, 3R0 and 4R0
R56, 1R2 and 2R2
3R3 and 4R7
60.0%
50.0%
40.0%
0.0%
% of OCL
20.0%
40.0%
20.0%
40.0%
60.0%
80.0%
% of I
SAT1
100.0%
120.0%
140.0%
60.0%
80.0%
% of I
SAT2
100.0%
120.0%
140.0%
www.eaton.com/electronics
3
Technical Data
4133
Effective
July
2017
HCF1305
High frequency, high current power inductor
Solder Reflow Profile
T
P
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
T
L
Preheat
A
t
t
P
T
C
-5°C
T
ab
l
e
1 -
S
t
a
n
da
r
d S
nP
b S
ol
de
r (T c)
Package
Thickness
<2.5mm
_
>2.5mm
Volume
mm
3
<350
235°C
220°C
Volume
mm
3
_
>350
220°C
220°C
Temperature
T
smax
T
ab
l
e
2 - L
ead
(P
b
) Fr
ee S
ol
de
r (T c)
T
smin
t
s
Package
Thickness
<1.6mm
1.6 – 2.5mm
>2.5mm
Time
Volume
mm
3
<350
260°C
260°C
250°C
Volume
mm
3
350 - 2000
260°C
250°C
245°C
Volume
mm
3
>2000
260°C
245°C
245°C
25°C
Time 25°C to Peak
Reference JDEC J-STD-020
Profile Feature
Preheat
and Soak
• T
e
mperature min. (Tsmin)
• Temperature max. (Tsmax)
• Time (Tsmin to Tsmax) (ts)
Average ramp up rate Tsmax to Tp
Liquidous temperature (T
L
)
Time
at
liquidous (tL)
Peak package
body
temperature (TP)*
Time (tp)** within 5 °C of the specified classification temperature (Tc)
Average ramp-down rate (Tp to Tsmax)
Time 25°C to Peak Temperature
Standard SnPb Solder
100°C
150°C
60-120 Seconds
3°C/
Second
Max.
183°C
60-150 Seconds
Table 1
20
Seconds**
6°C/ Second
Max.
6
Minutes Max.
Lead (Pb) Free Solder
150°C
200°C
60-120 Seconds
3°C/
Second
Max.
217°C
60-150 Seconds
T
able
2
30
Seconds**
6°C/ Second
Max.
8 Minutes Max.
*
Tolerance for peak profile temperature (Tp) is
defined as a
supplier minimum
and a
user maximum.
**
Tolerance for time
at
peak profile temperature (tp) is
defined as a
supplier minimum
and a
user maximum.
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
1. Introduction
FM33LG048 has an LCD display driver module for driving segment code LCD screens. It can support up to 8 COMs, 8*40, 6*42, 4*44 display segments, 16 levels of adjustable grayscale, and ...
MaixSense R329 is a development board designed by Sipeed based on Allwinner R329. The official introduction and EEWorld introduction are very detailed. Here is an unboxing and subjective introduction....
UVC stands for USB Video Class, which is a protocol standard defined for USB video capture devices. It is a protocol standard defined for USB video capture devices jointly launched by Microsoft and se...
Hello teachers, this is what I did. I used an l298n dual H-bridge to control a reduction motor, and the motor drove a pipe switch with a movable range of 90 degrees. Then I used a limit switch with tw...
The drive for higher performance per watt in artificial intelligence (AI) algorithms is driving the development of specific hardware design techniques, including in-memory computing for system-on-chip...
Functional testing is a high-stakes certification to verify overall functionality and calibration information. Functional testing is constrained by factors such as throughput, unit design, and built-i...[Details]
Technological innovation in the workplace, especially the widespread use of new technologies such as artificial intelligence,
robots
and trackers, has triggered deep thinking about the qual...[Details]
At present, with the continuous increase of LED display industry in China, there are more and more LED large-screen display screens in the streets and alleys of major cities. People's consumption lev...[Details]
Benefiting from the pull of the new energy vehicle market, the power lithium battery industry has also become a new outlet in recent years. As new energy vehicles change and develop in the directio...[Details]
The format of the packet control field is shown in Table 2. The data length flag is only valid when the dynamic data length option is enabled. The 6 bits can indicate the number of bytes in the transm...[Details]
When memory chips began to experience a "historic collapse" and GPUs and CPUs fell in price and were destocked, automotive chips were always accompanied by structural shortages, and the supply of key...[Details]
Xiaomi Youpin has now launched the Haylou Solar smart sports watch, which supports health monitoring, sleep protection and instant messaging. The crowdfunding price is 149 yuan. IT Home lea...[Details]
OFweek Cup · OFweek 2023 China
Robot
Industry Annual Selection (abbreviated as OFweek Robot Awards 2023) is jointly organized by OFweek, China's high-tech industry portal, and its authorita...[Details]
01Hashida booth information
Exhibition Name
The 25th Shenzhen International Industrial Manufacturing Technology and Equipment Exhibition
Exhibition Date
March ...[Details]
1. Introduction to the application of LED light sources: The LED lighting industry is an emerging industry, and it is deeply favored by people for its unique advantages. Nowadays, in optoelectron...[Details]
Electronic skin is a complete and complex sensor array that can sense weak signals from various environmental stimuli. In order to mimic the multifunctional characteristics of human skin, electronic ...[Details]
The following is the timer logic diagram of STM32 , which helps to understand: TIM3's ARR register and PSC register, Determine the PWM frequency. The two timers configured here determine t...[Details]
Apple is working on ways to take a key out of the MacBook Pro keyboard and use it as a precision mouse, and a newly revealed patent application details just how simple it would be. Apple's patent...[Details]
On June 13, Zhang Jianfeng, President of Alibaba Cloud Intelligence, officially released CIPU (Cloud infrastructure Processing Units) at the summit. This is a dedicated processor designed for new clo...[Details]
Require: Collect 16 analog voltage values (0~5V) plan: Interface: Connect to the computer USB port. Use USB to serial port chip to convert into serial port, which is convenient for developing board...[Details]
Domestic Chip Exchange
京公网安备 11010802033920号
EEWORLD
