Express-CBR
Type 2
Extreme Rugged™ COM Express
®
Basic Size
Type 2 Module with Intel
®
Core™ i7 Processor
Features
Intel
®
Core™ i7 Processor with Mobile Intel
®
QM57 Express Chipset
Dual Channel DDR3 SODIMM up to 8GB
Onboard Gigabit Ethernet
Embedded DisplayPort (eDP) or
PCI Express x8
Dual Channel 18/24-bit LVDS, VGA and SDVO
Extreme Rugged™ operating temperature:
-40°C to +85°C (optional)
Specifications
Core System
CPU
Memory
BIOS
Hardware Monitor
Watchdog Timer
Expansion Busses
Intel Core™ i7-620LE 2.0 GHz, 4MB L2 cache, 25W
Intel
®
Core™ i7-620UE 1.06 GHz, 4MB L2 cache, 18W
Dual channel 800/1066 MHz DDR3 memory up to 8 GB in
dual SODIMM sockets
AMI EFI with CMOS backup in 16 Mb SPI flash
Supply voltages and CPU temperature
Programmable timer range to generate RESET
6 PCI Express x1, 32-bit PCI at 33MHz, LPC bus, SMBus, I
2
C,
PCI Express x8 (multiplexed w/ eDP)
®
Super I/O
Connected to LPC bus on carrier if needed
TPM (optional)
Chipset
Type
Atmel AT97SC3204-U1A190
TPM 1.2
Power
Input Power
Power States
Smart Battery Support
AT mode (12 V +/- 5%) and ATX mode
(12 V and 5 Vsb +/- 5%)
Supports S0, S1, S3, S4, S5
Yes
Video
Integrated in Processor Gen5.75 with 12 execution units
Integrated Video Feature DirectX 10 and OpenGL 2.1
Support
Intel
®
Dynamic Video Memory Technology (Intel
®
DVMT 5.0)
High performance MPEG-2 decoding
Hardware acceleration for MPEG-2 VLD/iDCT
Blu-ray support @ 40 Mb/s
WMV9 (VC-1) and H.264 (AVC) support
VGA Interface
Analog VGA support with 300 MHz DAC
Analog monitor support up to QXGA (2048 x 1536)
LVDS Interface
Dual channel 18/24-bit LVDS
Digital Display Interface Embedded DisplayPort (eDP) (multiplexed w/ PCI Express x8,
SDVO)
Mechanical and Environmental
Dimension
Basic size: 125 mm x 95mm
Board Thickness
0.093” (2.3mm)
Operating Temperature Standard: 0°C to +60°C
Extreme Rugged™: -40°C to +85°C (optional)
Storage Temperature
-55°C to +85°C
Humidity
90% at +60°C
Shock
50G peak-to-peak, 11ms duration, MIL-STD-202G Method
213B
Vibration
Operating: 11.96 Grms, 50-20,000 Hz, each axis, MIL-STD-
202G Method 214A
Compatibility
PICMG COM Express
®
Type 2
Certifications
CE, FCC, HALT
Audio
Chipset
Audio Codec
Integrated in Mobile Intel
®
QM57 Express Chipset
Implemented on carrier board
Operating Systems
Standard Support
Windows XPe, Windows 7, Linux
Extended Support (BSP) Windows XP Embedded, WinCE 6.0, VxWorks 6.x, QNX,
AIDI Library
Ethernet
Chipset
Speed
Intel
®
GbE PHY 82574IT
10/100/1000 Mbps Ethernet
I/O Interfaces
Chipset
USB
SATA
Integrated in Mobile Intel
®
QM57
Eight USB 2.0 ports
Four SATA ports at 3 Gb/s
http://www.adlinktech.com/Computer-on-Module
Functional Diagram
CPU
Intel
®
Core™ i7
DDR3
Memory
Controller
with
ECC
Channel A
DDR3 SODIMM
with or without
ECC
800/1066 MHz
Channel B
DDR3 SODIMM
with or without
ECC
800/1066 MHz
PEG (x16):
1st 8 Lanes for SDVO
2nd 8 Lanes for
HDMI/PCIex8/eDP
Embedded
Graphics Core
VGA
LVDS
Audio
DMI
FDI
CRT VGA
LVDS
dual 18/24-bit
HD Audio
LAN
Intel
PHY
82574IT
®
LAN
(occupies PCIe x1 port 6)
GbE
MAC
PCIe x1
PCH
Mobile Intel
®
QM57
Express Chipset
SATA
(1 port)
PCIe x1
(port 0/1/2/3/4/5)
JM330
SATA to PATA
PATA IDE
SATA
(4 ports)
SATA
SSD
SATA
(1 port)
SMBus
GPIO
6x
SATA 2
8x
USB
2.0
PCI
33 MHz
v2.3
SPI
LPC
PCI
USB
SMBus
GPIO
I C to GPIO
2
BIOS
MAX6621
Mon(T)
LM87
Mon(T/V)
Test
Header
TPM
BC
I
2
C
LPC
Ordering Information
Modules
Model Number
Express-CBR-R-10
Express-CBR-R-20
Description/Configuration
COM Express
®
Basic Size Type 2 Module with Intel
®
Core™ i7-620UE, 1.06GHz, Dual Core, no RAM
COM Express
®
Basic Size Type 2 Module with Intel
®
Core™ i7-620LE, 2.0GHz, Dual Core, no RAM
Note: All specifications are subject to change without further notice.
CD
AB
SDVO
HDMI (3x)
DVI (3x)
DisplayPort (3x)