This is the PDF file of catalog No.C02E-5.
No.C02E5.pdf 99.8.13
MONOLITHIC CERAMIC CAPACITOR
GRM
Series for General Electronic Equipment
!FEATURES
1. Terminations are made of metal highly resistant to
migration.
2. The GRM series is a complete line of chip ceramic
capacitors in 6.3V, 10V, 16V, 25V, 50V, 100V, 200V and
500V ratings. These capacitors have temperature
characteristics ranging from C0∆ to Y5V.
3. A wide selection of sizes is available, from the miniature
GRM36 (LZWZT : 1.0Z0.5Z0.5mm) to the larger sized
GRM44-1 (LZWZT : 5.7Z5.0Z2.0mm).
GRM39, GRM40 and GRM42-6 types are suited to flow
and reflow soldering.
GRM36, GRM42-2 and larger types are suited to reflow
soldering.
4. Stringent dimensional tolerances allow highly reliable,
high speed automatic chip placements on PCBs.
5. The GRM series is available in both paper and plastic
embossed tape and reel packaging for automatic
placement. Bulk case packaging is also available.
(GRM 36, GRM39, GRM40 (T : 0.6, 1.25))
1
2
3
wTEMPERATURE
CHARACTERISTICS
#
Temperature Compensating Type
Code
C0G
C0H
Temp. range
Y55
to
W125D
Temp. coeff.
0T30
(ppm/D)
P2H
R2H
S2H
T2H
Y55
to
W85D
U2J
SL
W350
to
Y
1000
0T60
Y150T60 Y220T60 Y330T60 Y470T60 Y750T120
#
High Dielectric Constant Type
X5R
Code
Temp. range
Y55
to
W85D
Cap. change
(%)
T15
X7R
Y55
to
W125D
T15
Z5U
W10
to
W85D
W22
Y56
Y5V
Y30
to
W85D
W22
Y82
!APPLICATION
General electronic equipment.
4
5
6
7
8
9
!PART
NUMBERING
(*Please specify the part number when ordering)
(Ex.)
eCAPACITANCE
(Ex.)
Code
0R5
R75
010
Capacitance (pF)
0.57
0.75
1.57
Code
100
101
103
Capacitance (pF)
10
100
10,000
GRM40
q
X7R
w
102
e
K
r
50
t
y
PT
u
qType
wTemperature
Characteristics
eCapacitance
rCapacitance
Tolerance
tRated
Voltage
yMurata's
Control No.
uPackaging
rCAPACITANCE
TOLERANCE
Code
C
D
J
K
M
Z
Tol.
T0.25pF
T0.50pF
T5%0
T10%
T20%
W80, Y20%
Capacitance range
10pF and below
qTYPE
AND DIMENSIONS
e
g
e
More than 10pF
Q
,
QQ
,,
T
L
W
(in mm)
tRATED
VOLTAGE
Code
11116.3
10
16
25
50
100
200
500
DC Rated voltage (V)
1 116.3
10
16
25
50
100
200
500
Type (EIA Code)
L
W
T
e
g min.
GRM36 (0402)
GRM39
*
(0603)
1.0T0.05
1.6T0.1
GRM40 (0805)
GRM42-6 (1206)
GRM42-2 (1210)
GRM43-2 (1812)
GRM44-1 (2220)
0.4
0.5T0.05 0.15 to 0.3
0.5
0.8T0.10 0.2 to 0.5
0.6T0.10
0.7
2.0T0.1 1.25T0.10 0.85T0.10 0.2 to 0.7
1.25T0.10
0.85T0.10
3.2T0.15 1.6T0.15
1.5
1.15T0.10 0.3 to 0.8
3.2T0.2
1.6T0.20 1.6T0.20
0.85T0.10
1.15T0.10
3.2T0.3
2.5T0.20 1.35T0.15
1.0
0.3 min.
1.8T0.20
2.5T0.20
4.5T0.4
3.2T0.30 2.0 max.
2.0
0.3 min.
5.7T0.4
5.0T0.40 2.0 max.
2.0
0.3 min.
*Bulk
case packaging is L=1.6T0.07, W,T=0.8T0.07
0.5T0.05
0.8T0.10
uPACKAGING
CODE
Code
PB
PT
PC
Packaging
Bulk packaging in a bag
Tape carrier packaging
Bulk case packaging
1
This is the PDF file of catalog No.C02E-5.
No.C02E5.pdf 99.8.13
FOR FLOW AND REFLOW SOLDERING
High Dielectric Constant Type
50V/25V/16V/10V/6.3V Char. X7R/X5R
Type (EIA Code)
GRM36 (0402)
*4
GRM39 (0603)
Char.
X7R
X5R
X7R
Volt.
50 25 16 10 16 10 50 25 16 10
Cap. (pF)
220
270
330
390
470
560
680
820
1,000
1,200
1,500
1,800
2,200
2,700
3,300
3,900
4,700
5,600
6,800
8,200
10,000
12,000
15,000
18,000
22,000
27,000
33,000
39,000
47,000
56,000
68,000
82,000
100,000
120,000
150,000
180,000
220,000
270,000
330,000
390,000
470,000
560,000
680,000
820,000
1,000,000
1,500,000
2,200,000
3,300,000
3,900,000
4,700,000
5,600,000
6,800,000
8,200,000
10,000,000
*7
*8
*5
*5
*5
*5
*6
*6
GRM40 (0805)
X7R
50
25
16
10
X5R
10 6.3
50
GRM42-6 (1206)
X7R
X5R
25
16 10 16
10
6.3
!THICKNESS
AND PACKAGING TYPES/QUANTITY
Type
GRM36
GRM39
Taping
Bulk
Bulk Case
(pcs./φ178mm
Thickness : T (mm)
(pcs./case)
(pcs./bag)
reel)
*2
: 0.5T0.05
: 0.8T0.1
*3
: 0.6T0.1
GRM40
: 0.85T0.1
: 1.25T0.1
: 0.85T0.1
GRM42-6
: 1.15T0.1
: 1.6T0.2
1,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
10,000
4,000
4,000
4,000
3,000
4,000
3,000
2,000
50,000
15,000
10,000
-
5,000
-
-
-
1
2
3
*2
φ330mm
reel is available on request.
*3
Bulk case packaging is T=0.8T0.07
4
5
6
7
*4
GRM36 series is suited to only reflow soldering.
*5
Only for taping
*6
Type : GRM40-034 (L : 2T0.15, W : 1.25T0.15, T : 1.25T0.15)
*7
L : 3.2T0.2, W : 1.6T0.2, T : 1.15T0.15
W0
*8
Type : GRM42-631 (L : 3.2T0.2, W : 1.6T0.2, T : 1.3
Y0.2
)
8
9
4
!CAPACITANCE
TOLERANCE
X7R/X5R Characteristics
K :
T10%
(E12 Series)
M :
T20%
(E6 Series)
This is the PDF file of catalog No.C02E-5.
No.C02E5.pdf 99.8.13
!CHARACTERISTICS
(REFERENCE DATA)
#
Capacitance- DC Voltage Characteristics
Measuring condition Z5U
: 1kHz, 0.5Vr.m.s.
X7R, Y5V : 1kHz, 1Vr.m.s.
C0G
: 1MHz, 1Vr.m.s.
#
SELECTION OF CERAMIC CAPACITORS
When selecting capacitors, consider the voltage
characteristics (AC & DC) and aging characteristics.
Capacitance Change (%)
+40
+20
#
Capacitance-Temperature Characteristics
10
Measuring condition : 1MHz, 1Vr.m.s.
0
-20
-40
C0G 50V
X7R 50V
-60
-80
Z5U 50V
Y5V 50V
0
10
20
30
40
50
1
2
3
3
Capacitance Change (%)
5
0
C0G
P2H
R2H
S2H
T2H
U2J
-100
DC Voltage (Vdc)
-5
#
Capacitance- AC Voltage Characteristics
120
Measuring condition C0G
: 1MHz
X7R, Z5U, Y5V :1kHz
-10
-60
-40
-20
0
20
40
60
80
100
Temperature (D)
+80
Capacitance Change (%)
+60
+40
+20
20
0
Capacitance Change (%)
Measuring condition Z5U
: 1kHz, 0.5Vr.m.s.
X7R, Y5V : 1kHz, 1Vr.m.s.
Z5U 50V
Y5V 50V
X7R 50V
C0G 50V
0
1
AC Voltage (Vr.m.s.)
2
X7R
-20
-40
Z5U
-60
-80
-100
-60
-40
-20
0
20
40
60
80
100
120
Temperature (D)
Y5V
0
-20
#
Impedance- Frequency Characteristics
C0G (GRM40)
100
1 [pF]
10
Impedance (Ω)
10 [pF]
100 [pF]
1000 [pF]
4
5
#
Capacitance Change- Aging
+10
Capacitance Change (%)
0
-10
-20
-30
-40
0
50
100
1000
Time (Hr)
10
Impedance (Ω)
10000
Y5V, Z5U
C0G
X7R
1
100m
10m
1M
10M
100M
Frequency (Hz)
1G
X7R, Y5V (GRM40)
100
6
1000 [pF]
0.01 [µF]
0.1 [µF]
1
100m
7
10M
100M
1G
10m
1k
100k
1M
Frequency (Hz)
8
9
14
This is the PDF file of catalog No.C02E-5.
No.C02E5.pdf 99.8.13
NOTICE
!NOTICE
Process
1. Storage of
Chips
Cautions
#
Chip monolithic ceramic capacitors
(chips) can experience degradation
of termination solderability when
subjected to high temperature or
humidity, or if exposed to sulfur or
chlorine gases.
Control Points
#
Storage environment must be at an ambient temperature of 5-40D and an
ambient humidity of 20-70% RH.
Use chips within 6 months. If 6 months or more have elapsed, check
solderability before use.
#
For GR series and GR500 series, do not unpack the minimum package until
immediately before use. After unpacking, re-seal promptly or store with a
desiccant.
#
Avoid mechanical shock (ex. falling) to the capacitor to prevent mechanical
cracking inside of the ceramic dielectric due to its own weight.
Reference Data
Data 1
Solderability
1
2
2. Circuit
Design
3. PCB
Design
Placing of chip
components
and leaded
components
#
These capacitors on this catalog are
not safety recognized products.
#
Unlike leaded components, chip
components are susceptible to
flexing stresses since they are
mounted directly on the substrate.
They are also more sensitive to
mechanical and thermal stresses
than leaded components.
Excess solder fillet height can
multiply these stresses and cause
chip cracking.
#
When designing substrates, take land patterns and dimensions into consideration
to eliminate the possibility of excess solder fillet height.
#
[Pattern Forms]
Incorrect
Lead wire
Solder resist
Data 2
Board bending
strength for
solder fillet height
Data 3
Temperature
cycling for solder
fillet height
Data 4
Board bending
strength for
board material
Correct
3
Chassis
Placing close
to chassis
Solder (Ground)
Solder
resist
Electrode pattern
Soldering iron
Lead wire
Solder resist
Placing of leaded
Lateral mounting components after
chip components
4
Solder resist
5
Land
Chip Capacitor
Solder Resist
[Land Dimensions]
c
6
7
(in mm)
b
a
Table 1 Flow soldering method
GRM390
GRM420
Dimen-
sions
a
b
c
L
W
1.6
0.8
0.6-1.0
0.8-0.9
0.6-0.8
GRM400
GRM425
2.00
1.25
1.0-1.2
0.9-1.0
0.8-1.1
GRM42-6
GRM430-
3.2
1.6
2.2-2.6
1.0-1.1
1.0-1.4
LL0508
1.25
2.00
0.4-0.7
0.5-0.7
1.4-1.8
LL0612
1.6
3.2
0.6-1.0
0.8-0.9
2.6-2.8
GRH706
1.25
1.00
0.4-0.6
0.6-0.8
0.8-1.0
GRH708
2.00
1.25
1.0-1.2
0.9-1.0
0.8-1.0
GRH110
1.4
1.4
0.5-0.8
0.8-0.9
1.0-1.2
8
9
84
This is the PDF file of catalog No.C02E-5.
No.C02E5.pdf 99.8.13
NOTICE
Process
Cautions
Table 2 Reflow soldering method
GRM33
Dimen-
sions
a
b
c
L
W
Control Points
Reference Data
(in mm)
1
2
3
3. PCB
Design
GRM390 GRM400 GRM42-6 GRM42-2
GRM36
GRM43-2
GRM420 GRM425 GRM430- GRM235
GRM44-1 LL0306
GRM615
GRM240
GRM220 GRM225 GRM230- GRM435-
2.01
1.25
1.0-1.2
0.6-0.7
0.8-1.1
3.2
1.6
2.2-2.4
0.8-0.9
1.0-1.4
3.2
2.5
2.0-2.4
1.0-1.2
1.8-2.3
4.5
3.2
3.0-3.5
1.2-1.4
2.3-3.0
5.7
5.0
4.0-4.6
1.4-1.6
3.5-4.8
0.8
1.6
0.2-0.4
0.3-0.4
1.0-1.4
LL0508
1.25
2.01
0.4-0.6
0.3-0.5
1.4-1.8
LL0612 GRH706
1.6
3.2
0.6-0.8
0.6-0.7
2.6-2.8
1.25
1.00
0.4-0.6
0.6-0.8
0.8-1.0
1.0
1.6
0.6
0.5
0.8
0.3
0.2-0.30 0.30-0.50 0.6-0.8
0.2-0.35 0.35-0.45 0.6-0.7
0.2-0.40 0.40-0.60 0.6-0.8
GRH708 GRH710 GRH110 GRH111
Dimen-
sions
a
b
c
L
W
2.01
1.25
1.0-1.2
0.6-0.8
0.8-1.0
3.2
2.5
2.2-2.5
0.8-1.0
1.9-2.3
1.4
1.4
0.4-0.8
0.6-0.8
1.0-1.2
2.8
2.8
1.8-2.1
0.7-0.9
2.2-2.6
GR530
4.5
3.8
3.2-3.4
0.9-1.2
3.0-3.8
GR535
5.6
5.0
4.2-4.5
0.9-1.2
4.0-5.0
GR540
10.6
15.0
8.5-9.0
1.3-1.5
4.0-5.0
GR545
GR550
GR555
GR580
10.6
11.8
16.0
28.1
10.0
10.6
05.0
13.2
8.5-09.0 9.0-9.50 13.0-13.5 25.0-25.5
1.3-01.5 1.8-2.00
01.8-02.0 02.2-02.4
8.0-10.0 8.0-10.0
04.0-05.0
10.0-13.0
Table 3 GNM Series for reflow soldering method
Chip Capacitor
a
b
Land
Type
GNM30-401
L
3.2
W
1.6
Dimensions (mm)
a
b
0.8-1.0 0.7-0.9
c
0.3-0.4
d
0.4-0.5
c d
4
5
6
7
8
9
85
4. Solder
Paste
Printing
#
Choose a mounting position that minimizes the stress imposed on the chip during
flexing or bending of the board.
[Component Direction]
Locate chip horizontal
to the direction in
which stress acts
[Chip Mounting Close to Board Separation point]
Perforation
C
B
Chip arrangement
Worst A-C-(B ~ D) Best
--
-
A
Slit
D
Q
,
Q
,
Q
,
#
Make sure the solder has been applied smoothly to the end surface to a height of
#
Overly thick application of solder
0.2mm min.
paste results in excessive fillet height
solder.
[Optimum Solder Amount for Reflow Soldering]
This makes the chip more
susceptible to mechanical and
thermal stress on the board and may
0.2mm min.
cause cracked chips.
#
Too little solder paste results in a
lack of adhesive strength on the
outer electrode, which may result in
chips breaking loose from the PCB.
RF/Wirelessly
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