EEWORLDEEWORLDEEWORLD

Part Number

Search

1-583718-3

Description
TW-LEAF CRP HSG 30 POS 100 C/L
CategoryThe connector    The connector   
File Size142KB,8 Pages
ManufacturerTE Connectivity
Websitehttp://www.te.com
Environmental Compliance
Download Datasheet Parametric View All

1-583718-3 Online Shopping

Suppliers Part Number Price MOQ In stock  
1-583718-3 - - View Buy Now

1-583718-3 Overview

TW-LEAF CRP HSG 30 POS 100 C/L

1-583718-3 Parametric

Parameter NameAttribute value
Brand NameAMP
Is it lead-free?Lead free
Is it Rohs certified?conform to
Reach Compliance Codecompliant
ECCN codeEAR99
Factory Lead Time12 weeks
Is SamacsysN
Other featuresCOMPATIBLE CONTACTS: 583616-4; 583616-2; 583853-5; 583853-3; 1-583616-0
body width0.35 inch
subject depth0.75 inch
body length3.3 inch
Connector typeCARD EDGE CONNECTOR
Contact to complete cooperationNOT SPECIFIED
Contact point genderFEMALE
Contact materialNOT SPECIFIED
contact modeRECTANGULAR
Contact resistance10 mΩ
DIN complianceNO
Dielectric withstand voltage1000VAC V
Durability250 Cycles
Filter functionNO
IEC complianceNO
maximum insertion force2.78 N
Insulation resistance1000000000 Ω
Insulator colorBLACK
insulator materialGLASS FILLED POLYESTER
MIL complianceNO
Plug contact pitch0.1 inch
Mixed contactsNO
Installation typeCABLE
Number of rows loaded2
Maximum operating temperature105 °C
Minimum operating temperature-55 °C
OptionsGENERAL PURPOSE
Rated current (signal)5 A
GuidelineUL, CSA
reliabilityCOMMERCIAL
Termination typeCRIMP
Total number of contacts60
UL Flammability Code94V-0
Evacuation force-minimum value.1946 N
Base Number Matches1
Series Type
Specification
108-9031
11 Mar 11 Rev D
Twin Leaf Crimp Snap Connector
1.
1.1.
SCOPE
Content
This specification covers the performance, tests and quality requirements for Crimp Snap Twin Leaf
Connector assemblies, used to provide a connection method between discrete wiring and printed circuit
boards. Contacts are crimp type, wrap in design. These multi-contact connectors have .100, .125 and
.156 inch centerline spacing between adjacent contacts.
1.2.
Qualification
When tests are performed on the subject product line, the procedures specified in 109-Series Test
Specifications shall be used. All inspections shall be performed using the applicable inspection plan
and product drawing.
2.
APPLICABLE DOCUMENTS
The following documents form a part of this specification to the extent specified herein. In the event of
conflict between the requirements of this specification and the product drawing, the product drawing
shall take precedence. In the event of conflict between the requirements of this specification and the
referenced documents, this specification shall take precedence.
2.1.
TE Connectivity (TE) Documents
A.
B.
C.
D.
109-1:
114-:
501- :
General Requirements for Test Specifications
Test Specifications as indicated in Figure 1.
Application Specification
Test Report
109 Series:
3.
3.1.
REQUIREMENTS
Design and Construction
Connectors shall be of the design, construction and physical dimensions specified on the applicable
product drawing.
3.2.
Ratings
A.
B.
Current: 5 amperes maximum per contact
Operating Temperature: -550 to 1050C
3.3.
Performance and Test Description
Connectors shall be designed to meet the electrical, mechanical and environmental performance
requirements specified in Figure 1.
©2011 Tyco Electronics Corporation,
a TE Connectivity Ltd. Company
All Rights Reserved
TE logo is a trademark.
| Indicates Change
*Trademark
For latest revision, visit out website at www.te.com/documents
For Regional Customer service, visit our website at www.te.com
Other products, logos, and company names might be trademarks of their respective owners.
1 of 8
LOC B

Recommended Resources

Problems in PCB design
I would like to ask what does Ground plane removed under Vin- mean in this picture? Does it mean that V- should be separated when laying ground in PCB design? Why should it be separated?...
星星brisk PCB Design
Please share the installation package of modelsim10.4 or other versions
Please share the installation package of modelsim10.4 or other versions Or are there any FPGA learning websites or materials?...
1nnocent Download Centre
ATE1133 audio decoding solution, USB sound card solution, TYPE C audio adapter chip solution
USB audio solution, USB sound card solution1. Product description ATE1133 is a chip that includes an audio codec, a HIFI-level single microphone input, and a stereo headphone output solution. It integ...
ate1133 Download Centre
What kind of LCD screen is suitable for use in a vibration environment
Customers often ask us, because the terminal is used in a harsh environment and is basically constantly vibrating, what kind of LCD screen should be used for a long time in a vibrating environment? Wh...
罗姆液晶技术站 Integrated technical exchanges
Baobaobao~~~After the Chinese New Year, what new developments are there in the evaluation industry? Hurry up and take a look at the Evaluation Intelligence Bureau~
Welcome the New Year, everyone has a happy New Year~ I am here to report to the admin~ I started working today~ After the New Year, what new developments are there in the evaluation industry? Let's ta...
okhxyyo Special Edition for Assessment Centres
[NUCLEO-L552ZE Review] Small thermometer
The NTC on the expansion board is connected to the A0 interface of the development board, which corresponds to the PA3 pin, the ADC of the 8th channel. This time we use the ADC_MultiChannelSingleConve...
hzz592788 Special Edition for Assessment Centres

Popular Articles

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号