Bussmann
®
SMT Chip Fuse
Subminiature Surface Mount Fuses
125V AC/DC
Dimensions - mm (inches)
3.20
±
0.2
(0.126
±
0.008)
R
3216LV
.75
0.50
±
0.25
(0.020
±
0.010)
1.60
±
0.2
(0.063
±
0.008)
0.90 + 0.20, -0.15
(0.035 + 0.008, -0.006)
Construction
1.
2.
3.
4.
5.
6.
1
2
3
4
8
5
6
7
Catalog Symbol:
3216LV
Voltage Rating:
125V AC/DC
Interrupting Rating:
50 Amp AC/DC
Physical Size:
EIA SOCM-3216AC (Equivalent to 1206)
3.2
≈
1.6
≈
0.90mm
0.126
≈
0.063
≈
0.035 in.
Agency Approvals:
UL Recognized, Std. 248-14, File E19180, Guide JDYX2
CSA Component Acceptance, File 53787, Class 1422-30
General Information:
• Bussmann SMT Chip Fuses utilize thick and thin metal film
technologies for superior fusing action and enhanced
reliability.
• The fuse element is bonded to a ceramic substrate and
encapsulated with glass, providing excellent short-circuit
performance and environmental integrity. Predicted reliability
of the 3216LV chip fuse is 30 times greater than that of the
typical chip capacitor (consult Bussmann for details).
• Substrate and coating thermal expansion coefficients are
closely matched to that of FR-4 epoxy-glass circuit board
for superior solder joint reliability.
• The end terminations are over-plated with nickel and tin-lead.
Drawing is not to scale.
Ceramic Substrate
Glass Cover
Termination Pad
Metal Film Element
Silver End Termination
Nickel Barrier
(5.1–10.2µm)
7. 90/10 Tin-lead Plating
(7.6–12.7 µm)
8. Marking
Time-Current Characteristics:
Fast-acting fuse: Will carry 100% of rated current for a mini-
mum of 4 hours, and will open within 5 seconds at 250% of
rated current.
Packaging and Ordering Information:
•
Tape and Reel:
Standard 8mm tape, in compliance with
EIA-RS481 (equivalent to IEC 286, Part 3).
•
Fuses are orientated in embossed pockets with ceramic
side facing up to facilitate proper mounting (See “Electrical
Characteristics”, General Note 4).
3216LV
Product
Symbol
(See Table)
Rated Current
Package Code
TR
= 3,000 pieces on tape on a 178mm reel.
TR1
= 15,000 pieces on tape on a 330mm reel.
SP
= 50 pieces on tape in a plastic box.
Contact Bussmann if other package quantities are required.
CE logo denotes compliance with European Union Low Voltage Directive
(50-1000 VAC, 75-1500 VDC). Refer to BIF document #8002 or contact
Bussmann Application Engineering at 314-527-1270 for more information.
Electrical Characteristics
Part Number
Current
Rating
(Ampere)
Mark
Appearing
On Part
Typical Melting
Integral @ 50A
(A
2
* sec)
Typical Total
Clearing Integral
@ 50A (A
2
* sec)
AC
.00017
.0010
.0016
.0033
.022
.038
.044
DC
.0001
.0009
.0026
.0042
.0098
.027
.033
Typ. Resistance Typ. Voltage
@
²
10% Rated Drop @ Rated
Current (Ohms) Current (Volts)
4.50
1.80
1.15
.75
.52
.40
.26
1.4
.73
.66
.63
.63
.62
.49
(XX=Package Code)
AC
DC
XX/3216LV-250mA
.250
.25
.00016
.000084
XX/3216LV-375mA
.375
White Dot
.001
.0002
XX/3216LV-500mA
.500
0.5
.0014
.0019
XX/3216LV-750mA
.750
.75
.0033
.00095
XX/3216LV-1A
1
1
.020
.0084
XX/3216LV-1.25A
1.25
White
Æ
.035
.021
XX/3216LV-1.5A
1.5
1.5
.038
.024
General Notes:
1.
AC interrupting rating, melting integral and total clearing integral measured at 125V, unity power factor.
2.
DC interrupting rating, melting integral and total clearing integral measured at 125V with a battery source.
3.
Voltage drop measured at 23 ± 3°C ambient temperature with the device mounted on a suitable circuit board trace.
4.
It is recommended that fuses be mounted with ceramic (white) side facing up.
5.
Device designed to carry rated current for four hours minimum. An operating current of 80% or less of rated current is
with further derating required at elevated ambient temperatures.
6.
Contact Bussmann if higher ampere ratings are needed.
recommended,
12-16-98
SB98107 Rev. A
Form No. 3216LV
Page 1 of 2
BIF Doc #3006
Bussmann
®
SMT Chip Fuse
Subminiature Surface Mount Fuses
125V AC/DC
Time-Current Characteristic Curve
(Full Size Curves Available)
R
3216LV
E
D
0
375mA
500mA
750mA
1A
1.25A
1.5A
250mA
CURRENT
RATING
10
F
A
0
B
0
W
1
W
F
E
P
2
P
0
P
1
A
0
B
0
D
0
P
1
Carrier Dimensions - mm
8.0 + 0.3 / -0.1
3.5 ± 0.05
1.75 ± 0.1
2.0 ± 0.05
4.0 ± 0.1
4.0 ± 0.1
1.73 ± 0.2
3.56 ± 0.2
1.5 + 0.1 / -0.0
P
2
P
0
TIME IN SECONDS
.1
Recommended Land Pattern - mm (inches)
.01
2.80
.001
.1
10
CURRENT IN AMPERES
40
1
1.80 to
2.00
Environmental Specifications
Operating Temperature Range:
-65 to +125°C, with proper derating.
Thermal Shock:
MIL-STD-202, Method 107, Test Condition B (-65 to 125°C),
1000 cycles, fuses soldered to FR-4 glass-epoxy circuit
board.
Vibration:
MIL-STD-202, Method 204, Test Condition C (55 to 2000 HZ, 10G).
Solderability:
Withstands 60 seconds above 200°C, 260°C maximum.
Moisture Resistance:
MIL-STD-202, Method 106, 10 day cycle.
Solder Leach Resistance & Terminal Adhesion:
EIA-576 (30 seconds submersion in 260°C tin-lead solder).
1.20 to 1.40
4.20 to 4.40
1.60
NOTE: Trace geometry may affect fuse performance (time-cur-
rent characteristics
²
300% of rated current and voltage drop at
rated current).
The only controlled copy of this BIF document is the electronic read-only version located on the Bussmann Network Drive. All other copies of this BIF document are by definition uncontrolled. This bulletin
is intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Bussmann reserves the right, without notice, to change
design or construction of any products and to discontinue or limit distribution of any products. Bussmann also reserves the right to change or update, without notice, any technical information contained in
this bulletin. Once a product has been selected, it should be tested by the user in all possible applications.
12-16-98
SB98107 Rev. A
Form No. 3216LV
Page 2 of 2
BIF Doc #3006
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