XPC850ZT50BU datasheet, PDF - EEWORLD Datasheet

XPC850ZT50BU: DescriptionIC,MICROPROCESSOR,32-BIT,CMOS,BGA,256PIN,PLASTIC; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，72 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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XPC850ZT50BU Overview

IC,MICROPROCESSOR,32-BIT,CMOS,BGA,256PIN,PLASTIC

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	NXP
Parts packaging code	BGA
package instruction	BGA, BGA256,16X16,50
Contacts	256
Reach Compliance Code	not_compliant
ECCN code	5A991
Address bus width	26
bit size	32
boundary scan	YES
maximum clock frequency	50 MHz
External data bus width	32
Format	FIXED POINT
Integrated cache	YES
JESD-30 code	S-PBGA-B256
length	23 mm
low power mode	YES
Humidity sensitivity level	3
Number of terminals	256
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Encapsulate equivalent code	BGA256,16X16,50
Package shape	SQUARE
Package form	GRID ARRAY
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3.3 V
Certification status	Not Qualified
Maximum seat height	2.35 mm
speed	50 MHz
Maximum supply voltage	3.465 V
Minimum supply voltage	3.135 V
Nominal supply voltage	3.3 V
surface mount	YES
technology	CMOS
Terminal form	BALL
Terminal pitch	1.27 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	23 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC

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