|
74AHCT2G32DC,125 |
74AHC2G32DP,125 |
74AHC2G32DC,125 |
74AHCT2G32GD,125 |
74AHC2G32GD,125 |
74AHCT2G32DP,125 |
Description |
logic gates dual 2-input OR gate |
logic gates dual 2-input OR gate |
logic gates dual 2-input OR gate |
logic gates dual 2-input OR gate |
logic gates OR 2circuit 5.5V |
logic gates dual 2-input OR gate |
Brand Name |
NXP Semiconductor |
NXP Semiconduc |
NXP Semiconduc |
NXP Semiconduc |
NXP Semiconduc |
NXP Semiconductor |
Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
conform to |
conform to |
Maker |
NXP |
NXP |
NXP |
NXP |
NXP |
NXP |
Parts packaging code |
SSOP |
TSSOP |
SSOP |
SON |
SON |
TSSOP |
package instruction |
2.30 MM, PLASTIC, MO-187, SOT765-1, VSSOP-8 |
3 MM, PLASTIC, SOT505-2, TSSOP-8 |
2.30 MM, PLASTIC, MO-187, SOT765-1, VSSOP-8 |
3 X 2 MM, 0.50 MM HEIGHT, 0.50 MM PITCH, PLASTIC, SOT996-2, SON-8 |
3 X 2 MM, 0.50 MM HEIGHT, 0.50 MM PITCH, PLASTIC, SOT996-2, SON-8 |
3 MM, PLASTIC, SOT505-2, TSSOP-8 |
Contacts |
8 |
8 |
8 |
8 |
8 |
8 |
Manufacturer packaging code |
SOT765-1 |
SOT505-2 |
SOT765-1 |
SOT996-2 |
SOT996-2 |
SOT505-2 |
Reach Compliance Code |
compliant |
compli |
compli |
compli |
compli |
compliant |
series |
AHCT/VHCT/VT |
AHC/VHC/H/U/V |
AHC/VHC/H/U/V |
- |
- |
AHCT/VHCT/VT |
JESD-30 code |
R-PDSO-G8 |
S-PDSO-G8 |
R-PDSO-G8 |
- |
- |
S-PDSO-G8 |
JESD-609 code |
e4 |
e4 |
e4 |
- |
- |
e4 |
length |
2.3 mm |
3 mm |
2.3 mm |
- |
- |
3 mm |
Load capacitance (CL) |
50 pF |
50 pF |
50 pF |
- |
- |
50 pF |
Logic integrated circuit type |
OR GATE |
OR GATE |
OR GATE |
- |
- |
OR GATE |
MaximumI(ol) |
0.008 A |
0.008 A |
0.008 A |
- |
- |
0.008 A |
Humidity sensitivity level |
1 |
1 |
1 |
- |
- |
1 |
Number of functions |
2 |
2 |
2 |
- |
- |
2 |
Number of entries |
2 |
2 |
2 |
- |
- |
2 |
Number of terminals |
8 |
8 |
8 |
- |
- |
8 |
Maximum operating temperature |
125 °C |
125 °C |
125 °C |
- |
- |
125 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
- |
- |
-40 °C |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
- |
- |
PLASTIC/EPOXY |
encapsulated code |
VSSOP |
TSSOP |
VSSOP |
- |
- |
TSSOP |
Encapsulate equivalent code |
TSSOP8,.12,20 |
TSSOP8,.16 |
TSSOP8,.12,20 |
- |
- |
TSSOP8,.16 |
Package shape |
RECTANGULAR |
SQUARE |
RECTANGULAR |
- |
- |
SQUARE |
Package form |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
- |
- |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
Peak Reflow Temperature (Celsius) |
260 |
260 |
260 |
- |
- |
260 |
power supply |
5 V |
2/5.5 V |
2/5.5 V |
- |
- |
5 V |
propagation delay (tpd) |
10 ns |
14.5 ns |
14.5 ns |
- |
- |
10 ns |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
- |
- |
Not Qualified |
Schmitt trigger |
NO |
NO |
NO |
- |
- |
NO |
Maximum seat height |
1 mm |
1.1 mm |
1 mm |
- |
- |
1.1 mm |
Maximum supply voltage (Vsup) |
5.5 V |
5.5 V |
5.5 V |
- |
- |
5.5 V |
Minimum supply voltage (Vsup) |
4.5 V |
2 V |
2 V |
- |
- |
4.5 V |
Nominal supply voltage (Vsup) |
5 V |
5 V |
5 V |
- |
- |
5 V |
surface mount |
YES |
YES |
YES |
- |
- |
YES |
technology |
CMOS |
CMOS |
CMOS |
- |
- |
CMOS |
Temperature level |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
- |
- |
AUTOMOTIVE |
Terminal surface |
NICKEL PALLADIUM GOLD |
NICKEL PALLADIUM GOLD |
NICKEL PALLADIUM GOLD |
- |
- |
NICKEL PALLADIUM GOLD |
Terminal form |
GULL WING |
GULL WING |
GULL WING |
- |
- |
GULL WING |
Terminal pitch |
0.5 mm |
0.65 mm |
0.5 mm |
- |
- |
0.65 mm |
Terminal location |
DUAL |
DUAL |
DUAL |
- |
- |
DUAL |
Maximum time at peak reflow temperature |
30 |
30 |
30 |
- |
- |
30 |
width |
2 mm |
3 mm |
2 mm |
- |
- |
3 mm |
Base Number Matches |
1 |
1 |
1 |
- |
1 |
- |