Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature ..........................................................(Note 6)
Thermal properties are specified with product mounted on the PC board with one square-inch of copper area and still air.
This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the
device can be exposed to during board level solder attach and rework. Maxim recommends the use of the solder profiles
recommended in the industry standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and Convection
reflow processes. Preheating, per this standard, is required. Hand or wave soldering is not recommended.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
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1. Overview
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0 Introduction
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Oscillator
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