Film Chip Capacitors
How to Order, Dimensions and Construction
HOW TO ORDER
CB
04
2
G
0104
K
--
Type
CB: SMD Lead Free
CL
Size
01: 1206
02: 1210
03: 1812
04: 2220
05: 2824
95: 2840
16: 4030
17: 5040
18: 6054
Dielectric
2 = PET-HT
8 = PPS
7 = PEN
Voltage
B = 16V
C = 25V
D = 50/63V
E = 100V
G = 250V
I = 400V
K = 630V
Capacitance
1st digit: 0
2nd & 3rd: the 2nd
significant figures of the
capacitance value.
4th digit: the number of
zeros to be added to the
capacitance value.
Tolerance
EIA Code
G
(1)
= 2%
J = 5%
K = 10%
Suffix Packaging
-- = bulk
BA = tape & reel
diameter: 180mm
BC = tape & reel
diameter: 330mm
Example of an order:
How to order a chip film PET-HT 100nF ±10% 250V bulk packaging.
(1)
: Tolerance G available only for PPS Series.
W
H
T
L
CASE DIMENSIONS:
millimeters (inches)
Size Code
01
02
03
04
05
95
16
17
18
Equivalent size
1206
1210
1812
2220
2824
2840
4030
5040
6054
Length (L)
3.30±0.30
3.30±0.30
4.50±0.50
5.80±0.50
7.20±0.50
7.20±0.50
10.5±0.60
12.8±0.60
15.3±0.60
(0.130±0.012)
(0.130±0.012)
(0.177±0.020)
(0.228±0.020)
(0.283±0.020)
(0.283±0.020)
(0.413±0.024)
(0.504±0.024)
(0.602±0.024)
Width (W)
1.60±0.30
2.50±0.30
3.20±0.50
5.00±0.50
6.10±0.50
10.0±0.80
7.60±0.80
10.2±0.80
13.7±0.80
(0.063±0.012)
(0.098±0.012)
(0.126±0.020)
(0.197±0.020)
(0.240±0.020)
(0.343±0.031)
(0.299±0.031)
(0.401±0.031)
(0.539±0.031)
Termination Return
0.50±0.30
0.50±0.30
0.60±0.40
0.80±0.60
0.80±0.60
0.80±0.60
0.80±0.60
0.80±0.60
0.80±0.60
(0.020±0.012)
(0.020±0.012)
(0.024±0.157)
(0.032±0.024)
(0.032±0.024)
(0.032±0.024)
(0.032±0.024)
(0.032±0.024)
(0.032±0.024)
STACKED FILM CONSTRUCTION
Our SMD Film capacitors (CB series) are using stacked tech-
nology with metallized plastic film, which forms the basis for
the capacitive element. Combined with the nacked design
choice, it gives our products an again better self-healing
capability as well as a very good capacitance per volume
ratio. This also means that internal construction of the multi-
layer stack, usually hidden in encapsulated film capacitors
design, is visible at the cut edges in the surface mount con-
figuration. In a typical film capacitor stack, hundreds of film
layers are compacted during manufacture. Under a micro-
scope these have the appearance of pages in a book.
Subsequent manufacturing and pcb assembly processes
allow a small amount of relaxation in these layers. In some
cases, small gaps between layers may become visible. These
are referred to as microgaps, and their occurrence is a stan-
dard feature of this technology. Even if it can be considered
an cosmetic issue, presence of these gaps has no effect at all
on mechanical or electrical performance or reliability. (Detailed
report is available upon request.)
6
Film Chip Capacitors
Electrical Properties and Test Conditions – CB Series
STANDARDIZATION
Reference Standard is CECC 32201
Test
Capacitance C
Dissipation Factor DF
Insulation Resistance IR
Description
Measurement frequency 1 KHz 20°C
Measurement frequency 1 KHz 20°C
Voltage applied:
10V for Vr < 100V
100V for Vr > = 100V
Surge Voltage = 1.4Vr applied
for 1mm between terminals
Board = 1.6mm (0.063") thick epoxy
glass laminated or alumine substrate
Force of 5 N applied for 10 secs.
Bending of 1 mm(0.039")
for 90 mm (3.543") length
500 cycles –55/+125°C
Performance
Shall be within tolerance of the rated value
DF < 100.10
-4
IR > 1000 Mohms for C < = 0.33µF
IR x C > 400sec. For C > 0.33µF
There shall be no direct breakdown
C = within ± 2% of initial value
DF = < = 50.10
-4
at 1 KHz
IR = within initial limit
No visible damage
C = within ± 2% of initial value
No visible damage
C = within ± 5% of initial value
ESR = no more than 3 times initial value
IR = not less than 50% of the initial limit
C = within ± 7% of initial value
Delta DF = < 50.10
-4
at 1 KHz
IR = not less than 50% of the initial limit
C = within ± 7% of initial value
-4
Delta DF = < = 70.10 at 1 KHz
IR = not less than 50% of the initial limit
C = within ± 8% of initial value
Delta DF = < 50.10
-4
at 1 KHz
IR = not less than 50% of the initial limit
C = within ± 7% of initial value
Delta DF = < 50.10
-4
at 1 KHz
IR = not less than 50% of the initial limit
C = within ± 5% of initial value
DF = < 50.10
-4
at 1 KHz
IR = not less than 50% of the initial limit
Dielectric Strength
Mounting
Adhesion
Board Bending Test
Thermal Shock
Damp Heat
Steady State
Accelerated Damp Heat
(Load Humidity)
Life Test
40°C 93% RH / no voltage / 56 days
85ºC 85% RH 1.5V-500H
85ºC / 1.25Vr / 1000H
Life Test
105°C / Vr/1,000 Hours
125°C / Vr/1,000 Hours
10,000 cycle / Vr
Charge/Discharge
7
Film Chip Capacitors
Packaging – CB Series
TAPE & REEL DIMENSIONS
4.00 (0.157)
±
0.10 (0.004)
1.75 (0.069)
2.00 (0.079)
±
0.05 (0.002)
+0.10
±
0.15 (0.006)
1.50 (0.059)
-0
K
0
W
P
1
Direction of unreeling
W
2
13.0 (0.512)
±
0.50 (0.020)
A
W
1
TAPE & REEL CHARACTERISTICS
In accordance with IEC 286 and EIA 481, the material used:
Carrier tape: Antistatic Material
Cover tape: Polyester
Reel: Recyclable Material
Parts in bulk or on reel are packed in hermetically sealed
plastic bags.
RECOMMENDATIONS
Once the sealed bag is opened, the capacitors must be
stored in a dry atmosphere until soldering.
Recommended storage conditions are:
PET & PEN: < 30°C and R.H.<60% for a maximum of
168 hours
PPS:
< 30°C and R.H.<60% for a maximum of
4 weeks
The use-by date is 3 years if kept in origin plastic bags.
In case of storage outside the conditions recommended
above the capacitors must be dried prior to soldering.
Recommended drying conditions are:
48 hours minimum at 60°C and RH < 10%.
9
RF/Wirelessly
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