1420D125M0000CB datasheet, PDF

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1420D125M0000CB: DescriptionACMOS Output Clock Oscillator,; CategoryPassive components oscillator; File Size410KB，20 Pages; ManufacturerVectron International, Inc.; Websitehttp://www.vectron.com/

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1420D125M0000CB Overview

ACMOS Output Clock Oscillator,

1420D125M0000CB Parametric

Parameter Name	Attribute value
Objectid	7190711474
Reach Compliance Code	compliant
maximum descent time	3 ns
Frequency Adjustment - Mechanical	NO
frequency stability	50%
Installation features	SURFACE MOUNT
Nominal operating frequency	125 MHz
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Oscillator type	ACMOS
Output load	10 KOHM, 15 pF
physical size	16.51mm x 16.51mm x 4.32mm
longest rise time	3 ns
Maximum supply voltage	2.625 V
Minimum supply voltage	2.375 V
Nominal supply voltage	2.5 V
surface mount	YES
maximum symmetry	60/40 %

1420D125M0000CB Preview

REV

DESCRIPTION

CO-28745

DATE

1/31/18

PREP

DF/SM

APPD

Oscillator Specification, Hybrid Clock

For

MOUNT HOLLY SPRINGS, PA 17065

THE RECORD OF APPROVAL FOR THIS

DOCUMENT IS MAINTAINED ELECTRONICALLY

WITHIN THE ERP SYSTEM

Hi-Rel Standard, High Frequency CMOS

CODE IDENT NO

SIZE

DWG. NO.

REV

00136

DOC204900

UNSPECIFIED TOLERANCES: N/A

SHEET 1 0F 20

1.1

SCOPE

General. This specification defines the design, assembly and functional evaluation of high

reliability, hybrid clock oscillators produced by Vectron International. Devices delivered to

this specification represent the standardized Parts, Materials and Processes (PMP) Program

developed, implemented and certified for advanced applications and extended environments.

Applications Overview. The designs represented by these products were primarily developed

for the MIL-Aerospace community. The lesser Design Pedigrees and Screening Options

imbedded within DOC204900 bridge the gap between Space and COTS hardware by providing

custom hardware with measures of mechanical, assembly and reliability assurance needed for

Military or Ruggedized COTS environments.

APPLICABLE DOCUMENTS

Specifications and Standards. The following specifications and standards form a part of this

document to the extent specified herein. The issue currently in effect on the date of quotation

will be the product baseline, unless otherwise specified. In the event of conflict between the

texts of any references cited herein, the text of this document shall take precedence.

Military

MIL-PRF-55310

MIL-PRF-38534

Standards

MIL-STD-202

MIL-STD-883

Other

DOC204951

QSP-90100

DOC011627

DOC203982

QSP-91502

1.2

2.1

Oscillators, Crystal Controlled, General Specification For

Hybrid Microcircuits, General Specification For

Test Method Standard, Electronic and Electrical Component Parts

Test Methods and Procedures for Microelectronics

Test Specification, High Frequency CMOS XO, Hi-Rel Standard

Quality Systems Manual, Vectron International

Identification Common Documents, Materials and Processes, Hi-Rel XO

DPA Specification

Procedure for Electrostatic Discharge Precautions

3.1

GENERAL REQUIREMENTS

Classification. All devices delivered to this specification are of hybrid technology conforming

to Type 1, Class 2 of MIL-PRF-55310. Primarily developed as a Class S equivalent

specification, options are imbedded within it to also produce Class B, Engineering Model and

Ruggedized COTS devices. Devices carry a Class 2 ESDS classification per MIL-PRF-38534.

Item Identification. Unique model number series are utilized to identify device package

configurations as listed in Table 1.

Absolute Maximum Ratings.

a. Supply Voltage Range (V

UNSPECIFIED TOLERANCES

3.2

3.3

SIZE

-0.5Vdc to +7.0Vdc

DWG NO.

REV.

SHEET

CODE IDENT NO.

00136

N/A

DOC204900

b. Storage Temperature Range (T

STG

c. Junction Temperature (T

d. Lead Temperature (soldering, 10 seconds):

e. Output Source/Sink Current:

3.4

3.4.1

-65°C to +125°C

+150°C

+300°C

±50 mA

Design, Parts, Materials and Processes, Assembly, Inspection and Test.

Design. The ruggedized designs implemented for these devices are proven in military and

space applications under extreme environments. Designs utilize 4-point crystal mounting in

compliment with Established Reliability (MIL-ER) componentry. When specified, radiation

lot acceptance testing up to 100krad(Si) (RHA level R) can be included without altering the

device’s internal topography.

3.4.1.1 Design and Configuration Stability. Barring changes to improve performance by reselecting

passive chip component values to offset component tolerances, there will not be fundamental

changes to the design or assembly or parts, materials and processes after first product delivery

of that item without written approval from the procuring activity.

3.4.1.2 Environmental Integrity. Designs have passed the environmental qualification levels of MIL-

PRF-55310. These designs have also passed extended dynamic levels of at least:

a. Sine Vibration: MIL-STD-202, Method 204, Condition G (30g pk.)

b. Random Vibration: MIL-STD-202, Method 214, Condition II-J (43.92g rms, three minute

duration in each of three mutually perpendicular directions)

c. Mechanical Shock: MIL-STD-202, Method 213, Condition F (1500g, 0.5ms)

3.4.2

Prohibited Parts, Materials and Processes. The items listed are prohibited for use in high

reliability devices produced to this specification.

a. Gold metallization of package elements without a barrier metal.

b. Zinc chromate as a finish.

c. Cadmium, zinc, or pure tin external or internal to the device.

d. Plastic encapsulated semiconductor devices.

e. Ultrasonically cleaned electronic parts.

f. Heterojunction Bipolar Transistor (HBT) technology.

g. ‘getter’ materials

Assembly. Manufacturing utilizes standardized procedures, processes and verification

methods to produce MIL-PRF-55310 Class S / MIL-PRF-38534 Class K equivalent devices.

MIL-PRF-38534 Group B Option 1 in-line inspection is included on radiation hardened part

numbers to further verify lot pedigree. Traceability of all components and production lots are

in accordance with MIL-PRF-38534, as a minimum. Tabulated records are provided as a part

of the deliverable data package. Devices are handled in accordance with Vectron document

QSP-91502 (Procedure for Electrostatic Discharge Precautions).

Inspection. The inspection requirements of MIL-PRF-55310 apply to all devices delivered to

this document. Inspection conditions and standards are documented in accordance with the

Quality Assurance, ISO-9001 and AS9100 derived, System of QSP-90100.

UNSPECIFIED TOLERANCES

3.4.3

3.4.4

SIZE

CODE IDENT NO.

DWG NO.

REV.

SHEET

00136

N/A

DOC204900

3.4.5

Test. The Screening test matrix of Table 5 is tailored for selectable-combination testing to

eliminate costs associated with the development/maintenance of device-specific documentation

packages while maintaining performance integrity.

Marking. Device marking shall be in accordance with the requirements of MIL-PRF-55310.

Ruggedized COTS Design Implementation. Design Pedigree “D” devices (see ¶ 5.2) use the

same robust designs found in the other device pedigrees. They do not include the provisions of

traceability or the Class-qualified componentry noted in paragraphs 3.4.3 and 4.1.

DETAIL REQUIREMENTS

Components

Crystals. Cultured quartz crystal resonators are used to provide the selected frequency for the

devices. The optional use of Premium Q swept quartz can, because of its processing to remove

impurities, be specified to minimize frequency drift when operating in radiation environments.

In accordance with MIL-PRF-55310, the manufacturer has a documented crystal element

evaluation program.

Passive Components. Passive components will have the same pedigree as the die

specified in paragraph 7.1. When required, Established Reliability (ER) failure level R

minimum passive components are used to the maximum extent possible and are procured

from QPL suppliers where possible. Lot evaluations are in accordance with MIL-PRF-

38534 or Enhanced Element Evaluation as specified in Table 7. When used, inductors

may be open construction and may use up to 46 gauge wire.

Class S Active Devices. Devices are assembled with bipolar semiconductors and an ACMOS

chip used to provide the ACMOS output. The bipolar semiconductors are procured from wafer

lots that have passed MIL-PRF-38534 Class K Lot Acceptance Tests for Class S devices. The

ACMOS microcircuit die is sourced in accordance with Standard Microcircuit Drawing

5962R8754903V9A, Class V (MIL-PRF-38535) qualified device. All active devices are

acceptable for use in environments of up to 100 krads total dose by design or Radiation Lot

Acceptance Testing of the individual components. In addition, bipolar semiconductors are

considered insensitive to Single Event Effects. SEE testing of the ACMOS device type has

shown that it is SEL and SET/SEU free to >90MeV-cm

/mg.

3.4.6

3.4.7

4.1

4.1.1

4.1.2

4.1.3

4.1.3.1 Class B Active Devices. Active devices for design Pedigree letters “B” and “C” are procured

from wafer lots that have passed MIL-PRF-55310 element evaluations for Class B devices, at a

minimum.

4.1.4

Packages. Packages are procured that meet the construction, lead materials and finishes as

specified in MIL-PRF-55310. All leads are Kovar with gold plating over a nickel underplate

Package lots are upscreened in accordance with the requirements of MIL-PRF-38534 as

applicable.

SIZE

CODE IDENT NO.

UNSPECIFIED TOLERANCES

DWG NO.

REV.

SHEET

00136

N/A

DOC204900

4.1.5

Traceability and Homogeneity. All design pedigrees except option D have active device lots

are homogenous and traceable to the manufacturer’s individual wafer; all other elements and

materials are traceable to their manufacturer and incoming inspection lots. Design pedigrees E,

R, V and X have homogenous material. In addition, swept quartz crystals are traceable to the

quartz bar and the processing details of the autoclave lot, as applicable.

Enhanced Element Evaluation. When Design Pedigree Option “E” is specified, semiconductors

and passive elements with Enhanced Element Evaluation as listed in Table 6 and 7 shall be

implemented. Since the microcircuit used is from a lot that has been qualified to Standard

Microcircuit Drawing 5962-87549, Class V (MIL-PRF-38535), additional element evaluation

is not performed.

Mechanical.

Package Outline. Table 1 links each Hi-Rel Standard Model Number of this specification to a

corresponding package style. Mechanical Outline information of each package style is found

in the referenced Figure.

Thermal Characteristics. The calculated thermal resistance and resulting junction temperature

rise is found in Table 4.

Electrical.

Input Power. Devices are available with an input voltage of either designed for standard +3.3

volt dc operation, ±10% or +2.5 volt dc operation, +/-5%. Current is measured, no load, at

maximum rated operating voltage.

Temperature Range. Operating range is -55°C to +125°C.

Frequency Tolerance. Initial accuracy at +23°C is ±15 ppm maximum. Frequency-

Temperature Stability is ±50 ppm maximum from +23°C reference. Frequency-Voltage

Tolerance is ±4 ppm maximum.

Frequency Aging. Aging limits, and when tested in accordance with MIL-PRF-55310 Group B

inspection, shall not exceed ±1.5 ppm the first 30 days, ±5 ppm Year 1 and ±2 ppm per year

thereafter.

4.1.6

4.2

4.2.1

4.2.2

4.3

4.3.1

4.3.2

4.3.3

4.3.4

4.3.4.1 Frequency Aging Duration Option. By customer request, the Aging test may be terminated

after 15 days if the measured aging rate is less than half of the specified aging rate. This is a

common method of expediting 30-Day Aging without incurring risk to the hardware and used

quite successfully for numerous customers. It is based on the ‘least squares fit’ determinations

of MIL-PRF-55310 paragraph 4.8.35. The ‘half the time/half the spec’ limit is generally

conservative as roughly 2/3 of a unit’s Aging deviation occurs within that period of time.

Vectron’s automated aging systems take about 6 data points per day, so a lot of data is

available to do very accurate projections, much more data than what is required by MIL-PRF-

55310. The delivered data would include the Aging plots projected to 30 days. If the units

would not perform within that limit then they would continue to full 30 Day term. Please

SIZE

CODE IDENT NO.

UNSPECIFIED TOLERANCES

DWG NO.

REV.

SHEET

00136

N/A

DOC204900

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