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LE82GME965 S LJ9Z

Description
chipsets gme965 express chip set mobile fcbga1299
Categorysemiconductor    Other integrated circuit (IC)   
File Size3MB,504 Pages
ManufacturerIntel
Websitehttp://www.intel.com/
Environmental Compliance
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LE82GME965 S LJ9Z Overview

chipsets gme965 express chip set mobile fcbga1299

LE82GME965 S LJ9Z Parametric

Parameter NameAttribute value
ManufactureIntel
Product CategoryChipsets
RoHSYes
ProducMobile Chipsets
Chipset SeriesGME965
TypeGMCH
Code NameCrestline
Embedded OptionsEmbedded
PCIe Revisi1.1
PCIe Configurations1 x16
Integrated GraphicsWith Graphics
TDP - Max13.5 W
Maximum Operating Temperature+ 105 C
Package / CaseFCBGA-1299
PackagingReel
CPU Configuration - Max1
FSB ParityNo Parity
FSB Supported - Max800 MHz
Graphics OutpuLVDS, SDVO, VGA
Length35 mm
Memory Size4 GB
Memory TypeDDR2-533, DDR2-667
Mounting StyleSMD/SMT
Number of Memory Channels2
Factory Pack Quantity360
Width35 mm
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