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PIC12F509T-I/SN

Description
8-bit microcontrollers - mcu 2 KB 41 ram 6 I/O
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size71KB,4 Pages
ManufacturerMicrochip
Websitehttps://www.microchip.com
Environmental Compliance
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PIC12F509T-I/SN Overview

8-bit microcontrollers - mcu 2 KB 41 ram 6 I/O

PIC12F509T-I/SN Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerMicrochip
Parts packaging codeSOIC
package instructionSOP, SOP8,.25
Contacts8
Reach Compliance Codecompli
ECCN codeEAR99
Factory Lead Time8 weeks
Has ADCNO
Address bus width
bit size8
CPU seriesPIC
maximum clock frequency4 MHz
DAC channelNO
DMA channelNO
External data bus width
JESD-30 codeR-PDSO-G8
JESD-609 codee3
length4.9 mm
Humidity sensitivity level1
Number of I/O lines6
Number of terminals8
On-chip program ROM width12
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
PWM channelNO
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeSOP8,.25
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)260
power supply2/5.5 V
Certification statusNot Qualified
RAM (bytes)41
rom(word)1024
ROM programmabilityFLASH
Maximum seat height1.75 mm
speed4 MHz
Maximum supply voltage3 V
Minimum supply voltage2 V
Nominal supply voltage2.5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceMatte Tin (Sn) - annealed
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperature40
width3.9 mm
uPs/uCs/peripheral integrated circuit typeMICROCONTROLLER, RISC
Base Number Matches1
PIC12F508/509
PIC12F508/509 Rev. B0 Silicon/Data Sheet Errata
The PIC12F508/509 parts you have received conform
functionally to the Device Data Sheet (DS41236E),
except for the anomalies described below.
All problems listed here will be addressed in future
revisions of the
PIC12F508/509 silicon.
Where noted,
problems apply to listed revision only.
2. Module: PIC12F509 Debugging with ICD2
(PIC16F505-ICD Silicon) –
Invalid FSR Power-Up
Initialization
The FSR on the PIC16F505-ICD debugger silicon
initializes to an invalid state. When using the ICD to
debug software with the PIC16F505-ICD, bit 5 in the
FSR register must be manually cleared to ‘0’ prior to
saving data in user RAM space. The power-up default
is ‘1’, which causes the device to Access Bank 1. The
power-up defaults are correct on the non-ICD version
of the PIC12F509 devices.
Work around:
Add the following line of code to the top of your
program;
BCF FSR,5 ;set bank pointers to bank 0
This will have no effect on non-ICD devices, but will
correct for the initialization errata on ICD devices.
1. Module: MPLAB
®
IDE, Revision 6.61 and
Earlier
MPLAB IDE 6.61 does not look for or set the
Configuration Word in the hex file at the conven-
tional logical location of 0xFFF.
Work around:
The
CONFIG
data must be assigned in two
locations within the assembly code to ensure
proper Configuration Word placement in the hex
file. This is only required for MPLAB IDE version
6.61 and earlier.
Fixed Code
org
data
__CONFIG
.config
data
__CONFIG
0xYYYY
_CP_OFF & _WDT_ON & etc.
_CP_OFF & _WDT_ON & etc.
3. Module: I
PD
, Power-Down Base Current
On the PIC12F508/509 silicon, revisions earlier
than A3, the power-down base current may remain
higher than the specification for a short time when
entering Sleep.
The following graph illustrates the device current
upon entering Sleep:
Re-locatable Code
code 0xYYYY
data _CP_OFF & _WDT_ON &
etc.
data _CP_OFF & _WDT_ON &
etc.
FIGURE 1:
I
DD
Configuration Word Address
Device
PIC12F508
PIC12F509
Note:
YYYY
03FF
07FF
YYYY
is the address of the Configuration
Word for the part.
I
PD
Time
Device enters
Sleep
Device current
reaches I
PD
The length of time between the device entering
Sleep mode and the device current reaching I
PD
increases as both temperature and voltage
decrease.
Work around
This issue is fixed in Revisions A3 and later.
2007-2016 Microchip Technology Inc.
DS80000190H-page 1

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