PIC16LF1507-E/P datasheet, PDF

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Datasheet> All Categories > The embedded processor and controller> Microcontrollers and processors> PIC16LF1507-E/P

PIC16LF1507-E/P: Description8-bit microcontrollers - mcu 3.5kb flash 128b ram 18i/O 10bit adc; CategoryThe embedded processor and controller Microcontrollers and processors; File Size3MB，278 Pages; ManufacturerMicrochip; Websitehttps://www.microchip.com; Environmental Compliance

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PIC16LF1507-E/P Overview

8-bit microcontrollers - mcu 3.5kb flash 128b ram 18i/O 10bit adc

PIC16LF1507-E/P Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Microchip
Parts packaging code	DIP
package instruction	DIP-20
Contacts	20
Reach Compliance Code	compli
ECCN code	EAR99
Factory Lead Time	5 weeks
Has ADC	YES
Address bus width
bit size	8
CPU series	PIC
maximum clock frequency	20 MHz
DAC channel	NO
DMA channel	NO
External data bus width
Integrated cache	NO
JESD-30 code	R-PDIP-T20
JESD-609 code	e3
length	26.162 mm
Number of I/O lines	17
Number of terminals	20
Number of timers	3
On-chip data RAM width	8
On-chip program ROM width	14
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
PWM channel	YES
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP20,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	2/3.3 V
Certification status	Not Qualified
RAM (bytes)	128
RAM (number of words)	128
rom(word)	2048
ROM programmability	FLASH
Maximum seat height	5.334 mm
speed	20 MHz
Maximum slew rate	1.8 mA
Maximum supply voltage	3.6 V
Minimum supply voltage	2.5 V
Nominal supply voltage	3.3 V
surface mount	NO
technology	CMOS
Temperature level	AUTOMOTIVE
Terminal surface	Matte Tin (Sn)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC

PIC16LF1507-E/P Related Products

	PIC16LF1507-E/P	PIC16LF1507-E/SS	PIC16LF1507-I/SO	AP2305GN-HF_14	PIC16LF1507T-I/ML	PIC16LF1507T-I/SS
Description	8-bit microcontrollers - mcu 3.5kb flash 128b ram 18i/O 10bit adc	8-bit microcontrollers - mcu 3.5kb flash 128b ram 18i/O 10bit adc	8-bit microcontrollers - mcu 3.5kb flash 128b ram 18i/O 10bit adc	Simple Drive Requirement	8-bit microcontrollers - mcu 3.5kb flash 128b ram 18i/O 10bit adc	8-bit microcontrollers - mcu 3.5kb flash 128b ram 18i/O 10bit adc
Is it Rohs certified?	conform to	conform to	conform to	-	conform to	conform to
Maker	Microchip	Microchip	Microchip	-	Microchip	Microchip
Parts packaging code	DIP	SSOP	SOIC	-	QFN	SSOP
package instruction	DIP-20	SSOP, SSOP20,.3	SOIC-20	-	HVQCCN, LCC20,.16SQ,20	SSOP-20
Contacts	20	20	20	-	20	20
Reach Compliance Code	compli	compliant	compli	-	compliant	compliant
Factory Lead Time	5 weeks	9 weeks	5 weeks	-	6 weeks	5 weeks
Has ADC	YES	YES	YES	-	YES	YES
bit size	8	8	8	-	8	8
CPU series	PIC	PIC	PIC	-	PIC	PIC
maximum clock frequency	20 MHz	20 MHz	20 MHz	-	20 MHz	20 MHz
DAC channel	NO	NO	NO	-	NO	NO
DMA channel	NO	NO	NO	-	NO	NO
Integrated cache	NO	NO	NO	-	NO	NO
JESD-30 code	R-PDIP-T20	R-PDSO-G20	R-PDSO-G20	-	S-PQCC-N20	R-PDSO-G20
JESD-609 code	e3	e3	e3	-	e3	e3
length	26.162 mm	7.2 mm	12.8 mm	-	4 mm	7.2 mm
Number of I/O lines	17	17	17	-	17	17
Number of terminals	20	20	20	-	20	20
Number of timers	3	3	3	-	3	3
On-chip data RAM width	8	8	8	-	8	8
On-chip program ROM width	14	14	14	-	14	14
Maximum operating temperature	125 °C	125 °C	85 °C	-	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-	-40 °C	-40 °C
PWM channel	YES	YES	YES	-	YES	YES
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	SSOP	SOP	-	HVQCCN	SSOP
Encapsulate equivalent code	DIP20,.3	SSOP20,.3	SOP20,.4	-	LCC20,.16SQ,20	SSOP20,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	-	SQUARE	RECTANGULAR
Package form	IN-LINE	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE	-	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	260	260	-	260	260
power supply	2/3.3 V	2/3.3 V	2/3.3 V	-	2/3.3 V	2/3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified
RAM (bytes)	128	128	128	-	128	128
RAM (number of words)	128	128	128	-	128	128
rom(word)	2048	2048	2048	-	2048	2048
ROM programmability	FLASH	FLASH	FLASH	-	FLASH	FLASH
Maximum seat height	5.334 mm	2 mm	2.65 mm	-	1 mm	2 mm
speed	20 MHz	20 MHz	20 MHz	-	20 MHz	20 MHz
Maximum slew rate	1.8 mA	1.8 mA	1.8 mA	-	1.8 mA	1.8 mA
Maximum supply voltage	3.6 V	3.6 V	3.6 V	-	3.6 V	3.6 V
Minimum supply voltage	2.5 V	2.5 V	2.5 V	-	2.5 V	2.5 V
Nominal supply voltage	3.3 V	3.3 V	3.3 V	-	3.3 V	3.3 V
surface mount	NO	YES	YES	-	YES	YES
technology	CMOS	CMOS	CMOS	-	CMOS	CMOS
Temperature level	AUTOMOTIVE	AUTOMOTIVE	INDUSTRIAL	-	INDUSTRIAL	INDUSTRIAL
Terminal surface	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	-	Matte Tin (Sn)	Matte Tin (Sn)
Terminal form	THROUGH-HOLE	GULL WING	GULL WING	-	NO LEAD	GULL WING
Terminal pitch	2.54 mm	0.65 mm	1.27 mm	-	0.5 mm	0.65 mm
Terminal location	DUAL	DUAL	DUAL	-	QUAD	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	40	40	-	40	40
width	7.62 mm	5.3 mm	7.5 mm	-	4 mm	5.3 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	-	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC
Humidity sensitivity level	-	1	1	-	1	1

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