IS61QDP2B21M18A2-333M3I datasheet, PDF

IS61QDP2B21M18A2-333M3I: DescriptionQDR SRAM, 1MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LFBGA-165; Categorystorage storage; File Size796KB，33 Pages; ManufacturerISSI(Integrated Silicon Solution Inc.); Websitehttp://www.issi.com/

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IS61QDP2B21M18A2-333M3I Overview

QDR SRAM, 1MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LFBGA-165

Parameter Name	Attribute value
Objectid	8065716409
package instruction	LBGA,
Reach Compliance Code	unknown
ECCN code	3A991.B.2.A
Maximum access time	0.45 ns
JESD-30 code	R-PBGA-B165
length	17 mm
memory density	18874368 bit
Memory IC Type	QDR SRAM
memory width	18
Number of functions	1
Number of terminals	165
word count	1048576 words
character code	1000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	1MX18
Package body material	PLASTIC/EPOXY
encapsulated code	LBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, LOW PROFILE
Parallel/Serial	PARALLEL
Maximum seat height	1.4 mm
Maximum supply voltage (Vsup)	1.89 V
Minimum supply voltage (Vsup)	1.71 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
width	15 mm

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