AHC SERIES, QUAD 2-INPUT NOR GATE, CDIP14, CERAMIC, DIP-14
Parameter Name | Attribute value |
Maker | Texas Instruments |
Parts packaging code | DIP |
package instruction | DIP, |
Contacts | 14 |
Reach Compliance Code | unknown |
series | AHC |
JESD-30 code | R-GDIP-T14 |
length | 19.56 mm |
Load capacitance (CL) | 50 pF |
Logic integrated circuit type | NOR GATE |
Number of functions | 4 |
Number of entries | 2 |
Number of terminals | 14 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Package body material | CERAMIC, GLASS-SEALED |
encapsulated code | DIP |
Package shape | RECTANGULAR |
Package form | IN-LINE |
propagation delay (tpd) | 13 ns |
Certification status | Not Qualified |
Maximum seat height | 5.08 mm |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 2 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | NO |
technology | CMOS |
Temperature level | MILITARY |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
width | 7.62 mm |
SN54AHC02J | SN54AHC02W | SN54AHC02FK | |
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Description | AHC SERIES, QUAD 2-INPUT NOR GATE, CDIP14, CERAMIC, DIP-14 | AHC SERIES, QUAD 2-INPUT NOR GATE, CDFP14, CERAMIC, FP-14 | AHC SERIES, QUAD 2-INPUT NOR GATE, CQCC20, CERAMIC, CC-20 |
Maker | Texas Instruments | Texas Instruments | Texas Instruments |
Parts packaging code | DIP | DFP | QFN |
package instruction | DIP, | DFP, | QCCN, |
Contacts | 14 | 14 | 20 |
Reach Compliance Code | unknown | unknown | unknown |
series | AHC | AHC | AHC |
JESD-30 code | R-GDIP-T14 | R-GDFP-F14 | S-CQCC-N20 |
length | 19.56 mm | 9.21 mm | 8.89 mm |
Load capacitance (CL) | 50 pF | 50 pF | 50 pF |
Logic integrated circuit type | NOR GATE | NOR GATE | NOR GATE |
Number of functions | 4 | 4 | 4 |
Number of entries | 2 | 2 | 2 |
Number of terminals | 14 | 14 | 20 |
Maximum operating temperature | 125 °C | 125 °C | 125 °C |
Minimum operating temperature | -55 °C | -55 °C | -55 °C |
Package body material | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | DIP | DFP | QCCN |
Package shape | RECTANGULAR | RECTANGULAR | SQUARE |
Package form | IN-LINE | FLATPACK | CHIP CARRIER |
propagation delay (tpd) | 13 ns | 13 ns | 13 ns |
Certification status | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 5.08 mm | 2.03 mm | 2.03 mm |
Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage (Vsup) | 2 V | 2 V | 2 V |
Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V |
surface mount | NO | YES | YES |
technology | CMOS | CMOS | CMOS |
Temperature level | MILITARY | MILITARY | MILITARY |
Terminal form | THROUGH-HOLE | FLAT | NO LEAD |
Terminal pitch | 2.54 mm | 1.27 mm | 1.27 mm |
Terminal location | DUAL | DUAL | QUAD |
width | 7.62 mm | 6.29 mm | 8.89 mm |