IC,PROM,512X8,TTL,DIP,24PIN,CERAMIC
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Objectid | 101288577 |
package instruction | DIP, DIP24,.6 |
Reach Compliance Code | not_compliant |
ECCN code | EAR99 |
Maximum access time | 85 ns |
JESD-30 code | R-XDIP-T24 |
memory density | 4096 bit |
Memory IC Type | OTP ROM |
memory width | 8 |
Number of terminals | 24 |
word count | 512 words |
character code | 512 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
organize | 512X8 |
Package body material | CERAMIC |
encapsulated code | DIP |
Encapsulate equivalent code | DIP24,.6 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Certification status | Not Qualified |
Filter level | MIL-STD-883 Class C |
Maximum slew rate | 0.155 mA |
surface mount | NO |
technology | TTL |
Temperature level | MILITARY |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |