ST2225N272G102CG datasheet, PDF

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ST2225N272G102CG: DescriptionCeramic Capacitor, Ceramic,; CategoryPassive components capacitor; File Size434KB，17 Pages; ManufacturerHitano Enterprise Corp; Environmental Compliance

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ST2225N272G102CG Overview

Ceramic Capacitor, Ceramic,

ST2225N272G102CG Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Objectid	7005901716
package instruction	,
Reach Compliance Code	compliant
ECCN code	EAR99
Capacitor type	CERAMIC CAPACITOR
dielectric materials	CERAMIC
Manufacturer's serial number	ST
Number of terminals	2

ST2225N272G102CG Preview

7F-7, No. 3, Wu Chuan 1

Road, New Taipei Industrial Park,

New Taipei City, Taiwan, R.O.C.

Tel.：886-2-22991331

Fax：886-2-22982466

1. INTRODUCTION

HITANO Multilayer Ceramic Chip Capacitors supplied in bulk or tape & reel package are ideally suitable for thick-film hybrid

circuits and automatic surface mounting on any printed circuit boards.

ST series use a special material between nickel-barrier and ceramic body. It provides excellent performance to withstand bending

stress occurred during process and provide more security for PCB process.

The nickel-barrier terminations are consisted of a nickel barrier layer over the silver metallization and then finished by

electroplated solder layer to ensure the terminations have good solderability. The nickel barrier layer in terminations prevents the

dissolution of termination when extended immersion in molten solder at elevated solder temperature.

2. FEATURES

High performance to withstanding 5mm of substrate bending

test guarantee.

A wide selection of sizes is available (0603 to 2225).

High capacitance in given case size.

Capacitor with lead-free termination (pure Tin).

Reduction in PCB bend failure.

High reliability and stability.

RoHS & HALOGEN compliant.

3. APPLICATIONS

For general digital circuit.

For power supply bypass capacitors.

For consumer electronics.

For telecommunication.

DC to DC converter

4.HOW TO ORDER

Series

0603

Size

Inch (mm)

0603

(1608)

0805

(2012)

1206

(3216)

1210

(3225)

1808

(4520)

1812

(4532)

1825

(4563)

2220

(5750)

2225

(5763)

100=10x10

=10pF

Dielectric

100

Capacitance

Tolerance

500

Rated voltage

Termination Packaging

T=7”

reeled

G=13”

reeled

N: C0G(NPO) Two significant digits

B=±0.1pF

followed by no. of

zeros. and R is in

C=±0.25pF

X: X7R

place of decimal

point.

D=±0.5pF

eg.:

R47=0.47pF

0R5=0.5pF

1R0=1.0pF

F=±1%

G=±2%

J=±5%

K=±10%

M=±20%

Z=-20/+80%

Two significant

L=Ag/Ni/Sn

digits followed by

no. of zeros. And R

C=Cu/Ni/Sn

is in place of

(Note 1)

decimal point.

500=

50 VDC

101=

100 VDC

201=

200 VDC

251=

250 VDC

501=

500 VDC

631=

630 VDC

102=

1000 VDC

202=

2000 VDC

302=

3000 VDC

Note 1: Please see below product range to find right ter mination code.

Page 1 of 17

7F-7, No. 3, Wu Chuan 1

Road, New Taipei Industrial Park,

New Taipei City, Taiwan, R.O.C.

Tel.：886-2-22991331

Fax：886-2-22982466

5. EXTERNAL DIMENSIONS

Size

Inch (mm)

0603 (1608)

L (mm)

W (mm)

0.80±0.10

1.60±0.20

0.80±0.15

Thickness

0.80±0.07

0.80

+0.15/-0.10

0.80±0.10

0805 (2012)

2.10±0.20

1.25±0.20

1.25±0.10

0.80±0.10

1206 (3216)

3.30±0.30

1.60±0.20

1.25±0.10

0.95±0.10

1.60±0.20

0.95±0.10

1.25±0.10

1210 (3225)

3.30±0.30

2.50±0.30

1.60±0.20

2.00±0.20

2.50±0.30

1.25±0.10

1808 (4520)

4.50±0.50

2.00±0.20

1.60±0.20

2.00±0.20

1.25±0.10

1812 (4532)

4.60±0.50

3.20±0.30

1.60±0.20

2.00±0.20

2.50±0.30

1825 (4563)

2220 (5750)

4.60±0.50

5.70±0.40

6.30±0.40

5.00±0.40

2.00±0.20

2.50±0.30

2.00±0.20

2.50±0.30

2225 (5763)

5.70±0.40

6.30±0.40

2.00±0.20

2.50±0.30

0.26

0.30

0.26

0.30

Fig. 1 The outline of MLCC

Symbol

min (mm)

0.20

0.30

6.GENERAL ELECTRICAL DATA

Dielectric

Size

Rated voltage (WVDC)

Capacitance range*

Capacitance tolerance

Tan

δ*

Insulation resistance at 500Vdc for 60 seconds

Operating temperature

Temperature coefficient

Termination

X7R:

Rated vol. D.F.

50V

Exception of D.F.

0603≥0.047μF; 0805≥0.18μF,

≤2.5% ≤3%

1206≥0.47μF

NP0

0603, 1206, 1210, 1812,

1808, 1825, 2220, 2225

50V, 100V, 200V, 250V, 500V,

630V, 1KV, 2KV, 3KV

1.5pF ~ 6800pF

X7R

0603, 1206, 1210, 1812,

1808, 1825, 2220, 2225

50V, 100V, 200V, 250V, 500V,

630V, 1KV, 2KV, 3KV

100pF ~ 10μF

Cap≤5pF: B (±0.1pF), C (±0.25pF)

5pF<Cap<10pF: C (±0.25pF), D (±0.5pF)

J (±5%), K (±10%), M (±20%)

Cap≥10pF: F (±1%), G (±2%), J (±5%),K (±10%)

Cap<30pF: Q≥400+20C

50V

≤

2.5%**

Cap≥30pF: Q≥1000

100V ~ 3KV

≤

2.5%

≥100GΩ

or R·C≥1000 whichever is smaller

≥10GΩ

or R·C≥ 500Ω-F whichever is smaller

-55 to +125°C

±30ppm

℃

±15%

Ag (or Cu)/Ni/Sn (lead-free termination)

* Measured at 1.0±0.2Vrms, 1.0kHz±10% for C≤10μF; 0.5±0.2Vrms, 120Hz±20% for C>10µF, 30~70% related humidity, 25°C ambient temperature.

Page 2 of 17

7F-7, No. 3, Wu Chuan 1

Road, New Taipei Industrial Park,

New Taipei City, Taiwan, R.O.C.

Tel.：886-2-22991331

Fax：886-2-22982466

7. Typical Bending Cracks of MLCC

MLCC ceramic body is consisted of rigidity material. It will be suffered compressive and tensional stress when the carried

board is bended. If the suffered stress is over ceramic body strength, the bending crack is occurred.

Therefore, the bending crack

will be only occurred after soldering process.

8.The stress v.s. position on PCB during bending

Chip mounting close to board separation point

Magnitude of stress

1>2

≈

3>4>5

Page 3 of 17

7F-7, No. 3, Wu Chuan 1

Road, New Taipei Industrial Park,

New Taipei City, Taiwan, R.O.C.

Tel.：886-2-22991331

Fax：886-2-22982466

HITANO ST series is added a special termination material (Ultra-Buffer or Anti-Bend)between ceramic

body and Ni-barrier that can absorb mechanical stress to prevent bending crack occurred.

Page 4 of 17

7F-7, No. 3, Wu Chuan 1

Road, New Taipei Industrial Park,

New Taipei City, Taiwan, R.O.C.

Tel.：886-2-22991331

Fax：886-2-22982466

11.Comparison of Bending Test Result

Resistance to Substrate Bending

100%

90%

80%

0805, X7R, 22nF, 250V (MA sereis)

0805,X7R,22nF,250V (C series)

0805, X7R, 22nF, 250V (FP

series)

0805,X7R,22nF,250V (ST

series)

1206, X7R, 100nF, 100V (MA sereis)

1206,X7R,100nF,100V (C series)

1206, X7R, 100nF, 100V (FP

series)

1206,X7R,100nF,100V (ST

series)

Failure Ratio (%)

70%

60%

50%

40%

30%

20%

10%

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0 9.5 10.0

Bending (mm)

Size

0603

0805

1206

1210

1808

1812

1825

2220

2225

PCB TEST RESULT

Mean Bend

C series(mm)

ST series.(mm)

≥

Improvement

with Ultra-buffer

300%

140%

117%

114%

Page 5 of 17

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