S71PL129JB0BFI9Z0 datasheet, PDF

S71PL129JB0BFI9Z0: DescriptionStacked Multi-Chip Product (MCP) Flash Memory; Categorystorage storage; File Size1MB，149 Pages; ManufacturerSPANSION; Websitehttp://www.spansion.com/; Environmental Compliance

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S71PL129JB0BFI9Z0 Overview

Stacked Multi-Chip Product (MCP) Flash Memory

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Parts packaging code	BGA
package instruction	8 X 11.60 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-64
Contacts	64
Reach Compliance Code	unknow
Other features	PSEUDO STATIC RAM IS ORGANIZED AS 2M X 16
JESD-30 code	R-PBGA-B64
JESD-609 code	e1
length	11.6 mm
memory density	134217728 bi
Memory IC Type	MEMORY CIRCUIT
memory width	16
Humidity sensitivity level	3
Number of functions	1
Number of terminals	64
word count	8388608 words
character code	8000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	8MX16
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum supply voltage (Vsup)	3.1 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	40
width	8 mm
Base Number Matches	1

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