Wirewound Chip Inductors
FEATURES
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CERAMIC BODY, WIRE WOUND CHIP INDUCTOR
includes all homogeneous materials
SIZES K (0402) and J (0603)
HIGH CURRENT AND LOW DCR
*See Part Number System for Details
REFLOW SOLDERING APPLICABLE
TAPE & REEL PACKAGING FOR AUTOMATIC PICK-PLACE
Specifications
Inductance Range
Inductance Tolerance
Operating Temperature Range
Test
0402 (K)
0603 (J)
1.0nH ~ 220nH
1.8nH ~ 390nH
±0.2nH (C), ±0.3nH (S), ±0.5nH (D), ±2% (G), ±3% (H), ±5% (J), ±10% (K)
-40°C ~ +125°C (including self-heating)
Specifications
90% Min. Coverage
Case Size Code
NIN-Z Series
RoHS
Compliant
ENVIRONMENTAL CHARACTERISTICS
Solderability
Resistance to Soldering Heat
Humidity Resistance (no load)
High Temperature Resistance (no load)
Low Temperature Resistance (no load)
High Temperature Load Life
Humidity Load Life
Test Method & Condition
Flux: 25% Resin, 75% Ethanol (by weight)
Solder: Sn/Ag3.0/Cu0.5,
Solder Temp.: 245 ± 5°C, Immersion: 3 ± 0.5 sec.
Device reflowed on pcb for 10 seconds at +260°C
± 5°C in solder Sn/Ag3.0/Cu0.5. Test time 6 min.
After 1000 hours at +60°C ± 2°C and 90 ~ 95% RH
(1) No mechanical damage
(2) Inductance change ±5% of initial value
(3) Q factor within ±20% of initial value.
Measure after chip is stablized at room
temperature for 1 ~ 2 hours.
After 1000 +24/-0 hours at +125°C ± 2°C
After 1000 +24/-0 hours at -40°C ± 2°C
After 1000 hrs at +125°C ± 2°C and rated current
After 1000 hrs at +60°C ± 2°C, 90~95% RH
and rated current
COMPONENT DIMENSIONS (mm):
Type
NIN-ZK
NIN-ZJ
Case Size
0402
0603
A
1.10 ± 0.10
1.70 ± 0.20
B
0.60 ± 0.10
1.10 ± 0.20
B
B
C
0.60 ± 0.10
0.90 ± 0.20
C
D ref.
0.20
0.38
E
F
E
0.50 ± 0.10
0.76 ± 0.10
F
0.15 ± 0.10
0.30 ± 0.10
A
D
PART NUMBER SYSTEM
NIN-Z K 22N J TR F
Pb-free/RoHS compliant
Taped & Reeled
Tolerance Code:
±0.2nH (C), ±0.3nH (S), ±0.5nH (D), ±2% (G),
±3% (H), ±5% (J) and ±10% (K)
Inductance Value in Nanohenries
(see standard values table for appropriate value codes)
Case Code (K = 0402, J = 0603)
Series
1
NIC COMPONENTS CORP.
www.niccomp.com
SPECIFICATIONS ARE SUBJECT TO CHANGE
F
PCB Design
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