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LM4808MM

Description
Dual 105 mW Headphone Amplifier
CategoryAnalog mixed-signal IC    Consumption circuit   
File Size675KB,13 Pages
ManufacturerNational Semiconductor(TI )
Websitehttp://www.ti.com
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LM4808MM Overview

Dual 105 mW Headphone Amplifier

LM4808MM Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerNational Semiconductor(TI )
package instructionMSOP-8
Reach Compliance Codenot_compliant
ECCN codeEAR99
Nominal bandwidth20 kHz
Commercial integrated circuit typesAUDIO AMPLIFIER
JESD-30 codeS-PDSO-G8
JESD-609 codee0
length3 mm
Humidity sensitivity level1
Number of channels2
Number of functions1
Number of terminals8
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Nominal output power0.15 W
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Encapsulate equivalent codeTSSOP8,.19
Package shapeSQUARE
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)260
power supply2/5.5 V
Certification statusNot Qualified
Maximum seat height1.1 mm
Maximum slew rate3 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)2 V
surface mountYES
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationDUAL
Maximum time at peak reflow temperature40
width3 mm

LM4808MM Related Products

LM4808MM LM4808M LM4808
Description Dual 105 mW Headphone Amplifier Dual 105 mW Headphone Amplifier Dual 105 mW Headphone Amplifier
Is it Rohs certified? incompatible incompatible -
Maker National Semiconductor(TI ) National Semiconductor(TI ) -
package instruction MSOP-8 SOIC-8 -
Reach Compliance Code not_compliant not_compliant -
ECCN code EAR99 EAR99 -
Nominal bandwidth 20 kHz 20 kHz -
Commercial integrated circuit types AUDIO AMPLIFIER AUDIO AMPLIFIER -
JESD-30 code S-PDSO-G8 R-PDSO-G8 -
JESD-609 code e0 e0 -
length 3 mm 4.9 mm -
Humidity sensitivity level 1 1 -
Number of channels 2 2 -
Number of functions 1 1 -
Number of terminals 8 8 -
Maximum operating temperature 85 °C 85 °C -
Minimum operating temperature -40 °C -40 °C -
Nominal output power 0.15 W 0.15 W -
Package body material PLASTIC/EPOXY PLASTIC/EPOXY -
encapsulated code TSSOP SOP -
Encapsulate equivalent code TSSOP8,.19 SOP8,.25 -
Package shape SQUARE RECTANGULAR -
Package form SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE -
Peak Reflow Temperature (Celsius) 260 235 -
power supply 2/5.5 V 2/5.5 V -
Certification status Not Qualified Not Qualified -
Maximum seat height 1.1 mm 1.75 mm -
Maximum slew rate 3 mA 3 mA -
Maximum supply voltage (Vsup) 5.5 V 5.5 V -
Minimum supply voltage (Vsup) 2 V 2 V -
surface mount YES YES -
Temperature level INDUSTRIAL INDUSTRIAL -
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) -
Terminal form GULL WING GULL WING -
Terminal pitch 0.65 mm 1.27 mm -
Terminal location DUAL DUAL -
Maximum time at peak reflow temperature 40 30 -
width 3 mm 3.9 mm -

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