Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Reliability Surface Mount Capacitors, MIL-PRF-32535, 4 – 200 VDC (C0G and BP Dielectrics)
Packaging C-Spec Ordering Options Table
Packaging Type
1
Standard Packaging (Waffle Tray)
7" Tape & Reel
1
Packaging/Grade
Ordering Code (C-Spec)
Not required (blank)
Contact Sales
Default packaging with no C-Spec is “Waffle Tray,” and is recommended for order quantities of less than 250 pieces. See Waffle Tray packaging
information section for additional details.
1
See Tape & Reel Packaging information section of the datasheet for additional details.
Dimensions per MIL-PRF-32535 – Inches (Millimeters)
W
L
T
B
S
EIA
Size Code
0402
0603
0805
1
1206
2
1210
2
1812
2
2220
2
1
Metric
Size Code
1005
1608
2012
3216
3225
4532
5650
L
Length
0.040±0.004
(1.02±0.10)
0.063±0.006
(1.60±0.15)
0.079±0.010
(2.01±0.25)
0.126±0.010
(3.20±0.25)
0.126±0.010
(3.20±0.25)
0.178±0.012
(4.52±0.30)
0.224±0.016
(5.69±0.41)
W
Width
0.020±0.004
(0.51±0.10)
0.032±0.006
(0.81±0.15)
0.050±0.010
(1.27±0.25)
0.063±0.010
(1.60±0.25)
0.098±0.010
(2.49±0.25)
0.126±0.012
(3.20±0.30)
0.197±0.016
(5.00±0.41)
T
Thickness
0.024
(0.61)
0.039
(0.99)
0.060
(1.52)
0.070
(1.78)
0.110
(2.79)
0.110
(2.79)
0.110
(2.79)
B
Bandwidth
0.004 (0.100)
minimum
0.016±0.008
(0.41±0.20)
0.020±0.010
(0.51±0.25)
0.020±0.014
(0.51±0.36)
0.020±0.014
(0.51±0.36)
0.024±0.018
(0.61±0.46)
0.025±0.018
(0.64±0.46)
Maximum
Part Weight
(mg)
3
1.6
6.3
20
57
108
216
430
Mounting
Technique
Solder reflow
only
Solder wave or
solder reflow
Solder reflow
only
For EIA 0805 solder dipped termination finish, add 0.020 (0.51) to the positive length tolerance and 0.015 (0.38) to the positive width and thickness
tolerance.
2
For EIA 1206, 1210, 1812 and 2220 solder dipped termination finishes, add 0.025 (0.64) to the positive length tolerance and 0.015 (0.38) to the positive
width and thickness tolerance.
3
Maximum Part Weight represents the maximum weight in the given case size for all voltages.
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FPGA/CPLD
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