HWTF-9-AT-23200F-NT datasheet, PDF

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HWTF-9-AT-23200F-NT: DescriptionFixed Resistor, Thin Film, 0.75W, 2320ohm, 1% +/-Tol, -150,150ppm/Cel, 1505,; CategoryPassive components The resistor; File Size291KB，2 Pages; ManufacturerMini-Systems Inc (MSI); Websitehttp://www.mini-systemsinc.com

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HWTF-9-AT-23200F-NT Overview

Fixed Resistor, Thin Film, 0.75W, 2320ohm, 1% +/-Tol, -150,150ppm/Cel, 1505,

HWTF-9-AT-23200F-NT Parametric

Parameter Name	Attribute value
Objectid	271172278
Reach Compliance Code	compliant
ECCN code	EAR99
structure	Chip
Number of terminals	2
Maximum operating temperature	150 °C
Minimum operating temperature	-55 °C
Package height	0.254 mm
Package length	3.886 mm
Package form	SMT
Package width	1.27 mm
Rated power dissipation(P)	0.75 W
resistance	2320 Ω
Resistor type	FIXED RESISTOR
series	HWTF
size code	1505
technology	THIN FILM
Temperature Coefficient	150 ppm/°C
Tolerance	1%

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MICROWAVE CHIP RESISTORS

MSMW

Mini-Systems, Inc.

Top Contact Microwave Chip Resistor

series is designed to fit a wide variety of applications operating in the Microwave Bands. All

sizes offer the

high stability, flat frequency response

and

low noise

of Mini-Systems, Inc. Thin Film materials.

Specialized LASER trim

techniques

specifically designed for this series guarantee operation up to

40 GHz.

Microwave Chip Resistors can be attached to associated circuitry through ribbon

or wire bonding, conductive epoxy, soldering to terminations or mounted as flip-chips.

Wire bondable gold

OR Solderable gold with nickel barrier

OR Nickel barrier pre-soldered

GENERAL CHARACTERISTICS

Resistance Range

Resistance Tolerance

Termination

Backing Material

Operating Temperature

Storage Temperature

Operating Voltage

VSWR

(G) Non-Solderable Gold, (NU) Soldereable Au w/ Ni barrier, (NT) Nickel with Solder

Bare Substrate (Standard), Gold (Optional)

-55°C to +150°C

-65°C to +150°C

10 to 20GHz

1.3:1

100V Max.

±0.5% to ±10%

2Ω to 5kΩ

SUBSTRATE CHARACTERISTICS

SUBSTRATE

99.6% Alumina

Beryllium Oxide

Aluminum Nitride

Quartz

Soldered or Solderable Gold require a Nickel Barrier

Achieving operating characteristics is dependent on attachment methods in order to minimize parasitics

0.005" - 0.025"

0.010" - 0.025"

0.005” - 0.010”

Available

Thickness

Dielectric

Constant

@ 1MHz

6.7

9.9

9.0

Thermal

Conductivity

W/m• K

140 - 177

1.3

±150 ppm/°C

±25 ppm/°C

300

101Ω to 5kΩ

-35dB

DC to 10GHz

1.2:1

20-40GHz

1.5:1

Current Noise

≤ 100Ω

-30dB

±25 ppm/°C

±5 ppm/°C

GGB

0.010" - 0.025"

RESISTOR CHARACTERISTICS

RESISTOR FILM

Tatalum Nitride

NiChrome

3.75

-40dB

-30dB

(Self Passivating)

Passivation

SiO

Standard TCR

TCR Optional to:

PART NUMBER DESIGNATION

MSMW

STYLE

MSMW

TYPE

SEE

TABLE

110

SUBSTRATE

A = Alumina

B = BeO

N = AlN

Q = Quartz

EXAMPLE: MSMW-110 - AN - 10000F - GGB

MSMW-110 Series, Alumina Substrate, NiChrome Resistor Film, 1kΩ, ±1% Tol., Non-Solderable Gold,

Gold Backside

Quartz available as wire bondable only

ISO 9001 CERTIFIED

20 DAVID ROAD

NORTH ATTLEBORO, MA 02760

EMAIL: msithin@Mini-SystemsInc.com

WEB:

www.Mini-SystemsInc.com

PHONE: 508-695-0203 FAX:508-695-6076

RESISTOR FILM

OHMIC VALUE

T = Tantalum Nitride

5-Digit Number:

N = NiChrome

1st 4 digits are significant

with "R" as decimal point

when required. 5th digit

represents number of zeros.

10000

TOLERANCE

D = ±0.5%

F = ±1%

G = ±2%

J = ±5%

K = ±10%

MINI SYSTEMS INC.

MADE IN AMERICA

SINCE 1968

8041 Rev. A

THIN FILM DIVISION

NT3

OPTION

±5ppm/°C

±10ppm/°C

±25ppm/°C

±50ppm/°C

±100ppm/°C

Non-Solderable Gold

Soldereable Au w/ Ni barrier

Nickel w/ Sn62 Solder

Nickel w/ SAC305 Solder

Gold Back

Tape & Reel

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