Fixed Resistor, Metal Glaze/thick Film, 0.063W, 2000ohm, 50V, 1% +/-Tol, -100,100ppm/Cel, 0402,
Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Objectid | 895269429 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
structure | Chip |
JESD-609 code | e4 |
Number of terminals | 2 |
Maximum operating temperature | 155 °C |
Minimum operating temperature | -55 °C |
Package height | 0.35 mm |
Package length | 1 mm |
Package form | SMT |
Package width | 0.5 mm |
method of packing | TR, Paper, 7 Inch |
Rated power dissipation(P) | 0.063 W |
resistance | 2000 Ω |
Resistor type | FIXED RESISTOR |
series | D-AP |
size code | 0402 |
technology | METAL GLAZE/THICK FILM |
Temperature Coefficient | 100 ppm/°C |
Terminal surface | Silver/Palladium (Ag/Pd) |
Tolerance | 1% |
Operating Voltage | 50 V |
D10AP1002K01%P0 | D10AP1002K01%PZ | |
---|---|---|
Description | Fixed Resistor, Metal Glaze/thick Film, 0.063W, 2000ohm, 50V, 1% +/-Tol, -100,100ppm/Cel, 0402, | Fixed Resistor, Metal Glaze/thick Film, 0.063W, 2000ohm, 50V, 1% +/-Tol, -100,100ppm/Cel, 0402, |
Is it Rohs certified? | conform to | conform to |
Objectid | 895269429 | 895269430 |
Reach Compliance Code | unknown | unknown |
ECCN code | EAR99 | EAR99 |
structure | Chip | Chip |
JESD-609 code | e4 | e4 |
Number of terminals | 2 | 2 |
Maximum operating temperature | 155 °C | 155 °C |
Minimum operating temperature | -55 °C | -55 °C |
Package height | 0.35 mm | 0.35 mm |
Package length | 1 mm | 1 mm |
Package form | SMT | SMT |
Package width | 0.5 mm | 0.5 mm |
method of packing | TR, Paper, 7 Inch | TR, Paper, 13 Inch |
Rated power dissipation(P) | 0.063 W | 0.063 W |
resistance | 2000 Ω | 2000 Ω |
Resistor type | FIXED RESISTOR | FIXED RESISTOR |
series | D-AP | D-AP |
size code | 0402 | 0402 |
technology | METAL GLAZE/THICK FILM | METAL GLAZE/THICK FILM |
Temperature Coefficient | 100 ppm/°C | 100 ppm/°C |
Terminal surface | Silver/Palladium (Ag/Pd) | Silver/Palladium (Ag/Pd) |
Tolerance | 1% | 1% |
Operating Voltage | 50 V | 50 V |