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214-320-2111

Description
IC Socket, PGA320, 320 Contact(s), 2.54mm Term Pitch, 0.05inch Row Spacing, Solder
CategoryThe connector    socket   
File Size1MB,6 Pages
ManufacturerMethode Electronics Inc.
Download Datasheet Parametric View All

214-320-2111 Overview

IC Socket, PGA320, 320 Contact(s), 2.54mm Term Pitch, 0.05inch Row Spacing, Solder

214-320-2111 Parametric

Parameter NameAttribute value
Reach Compliance Codeunknow
ECCN codeEAR99
Other featuresLEFT HAND ASSEMBLY
body width2.19 inch
subject depth0.32 inch
body length2.43 inch
Contact structure19X19
Contact to complete cooperationGOLD OVER NICKEL
Contact completed and terminatedTIN LEAD
Contact materialCU ALLOY
Contact styleRND PIN-SKT
current rating1 A
Device slot typeIC SOCKET
Type of equipment usedPGA320
Dielectric withstand voltage1500VAC V
Shell materialPLASTIC
Insulation resistance1000000000 Ω
JESD-609 codee0
Manufacturer's serial number214
Plug contact pitch0.1 inch
Installation methodSTRAIGHT
Number of contacts320
Maximum operating temperature105 °C
Minimum operating temperature-55 °C
PCB contact patternSTAGGERED
PCB contact row spacing0.05 mm
Terminal pitch2.54 mm
Termination typeSOLDER
Base Number Matches1
ZIF PGA Sockets
for Intel
Processors
Patent No. 5,762,511
Patent No. 5,597,319
Socket 2 (238 pin)
Socket 3 (237 pin)
Socket 6 (235 pin)
Specifications
Electrical:
Current Rating:
1 Amp max./contact
Voltage Rating:
250 VAC
Low Level Contact Resistance:
15 milliohms max., initial
30 milliohms max. after cond.
Insulation Resistance:
1000 megohms
Dielectric Withstanding Voltage:
1500 VAC
Capacitance:
1 picofarad max.
Mechanical:
Durability:
50 cycles
Operating Temperature:
-55°C to +105°C
Mating and Unmating Force:
Zero Insertion Force
Lever Actuating Force:
10 lbs. max.
Materials:
Insulator Material:
High temp-thermoplastic
Contact Material:
High performance copper alloy
Contact Finish:
Selective gold plate in contact area over
nickel plate overall, selective 90/10 tin/lead on solder tail
Features & Benefits
Patented for unique two point contact design and
torsional force design
Utilizes zero insertion force to protect the processor
from damage during insertion and removal
Offers optional location of actuating lever to aid in board
design
Consists of high performance copper alloy contacts
with selective gold to provide high reliability in all
environments
Compatible with high performance temperature
applications such as IR reflow or vapor phase soldering
techniques
Open center design to assist in chip cooling
Contains heat-sink clip features to allow ease in
applications
North and South America:
Methode Electronics, Inc. Connector Products
1700 Hicks Road • Rolling Meadows, IL 60008 USA
847-392-3500 • Toll Free: 800-323-6864 • Fax: 847-392-9404
Email: info@methode.com • Web: www.methode.com/connector/index.html
Europe:
Methode Electronics Ireland, Ltd.
Unit H, Crossagalla Business Park, Ballysimon Rd. • Limerick, Ireland
+353 (0) 61 401222 • Fax: +353 (0) 61 401942
Email: info@methode.ie • Web: ireland.methode.com/main.html
Far East:
Methode Electronics Far East, Pte. Ltd.
1 Tuas Lane, Jurong Town • Singapore 638610
65-68615444 • Fax: 65-68614777
Email: sales@methode.com.sg • Web: www.methode.com/mefe/index.html
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