3D2D4G72UB3416-I-8G datasheet, PDF

3D2D4G72UB3416-I-8G: DescriptionDDR DRAM Module, 64MX72, 0.4ns, CMOS, PBGA208; Categorystorage storage; File Size227KB，2 Pages; Manufacturer3D PLUS

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3D2D4G72UB3416-I-8G Overview

DDR DRAM Module, 64MX72, 0.4ns, CMOS, PBGA208

Parameter Name	Attribute value
Objectid	114178812
package instruction	BGA, BGA208,11X19,40
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	0.4 ns
Maximum clock frequency (fCLK)	400 MHz
I/O type	COMMON
JESD-30 code	R-PBGA-B208
memory density	4831838208 bit
Memory IC Type	DDR DRAM MODULE
memory width	72
Number of terminals	208
word count	67108864 words
character code	64000000
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	64MX72
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Encapsulate equivalent code	BGA208,11X19,40
Package shape	RECTANGULAR
Package form	GRID ARRAY
power supply	1.8 V
Certification status	Not Qualified
refresh cycle	8192
Maximum slew rate	0.45 mA
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM

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