EEWORLDEEWORLDEEWORLD

Part Number

Search

S2010CPG2674D20

Description
Fixed Resistor, Metal Glaze/thick Film, 1W, 2670000ohm, 150V, 0.5% +/-Tol, 200ppm/Cel, Surface Mount, 2010, CHIP, ROHS COMPLIANT
CategoryPassive components    The resistor   
File Size122KB,1 Pages
ManufacturerState of the Art Inc.
Environmental Compliance  
Download Datasheet Parametric View All

S2010CPG2674D20 Overview

Fixed Resistor, Metal Glaze/thick Film, 1W, 2670000ohm, 150V, 0.5% +/-Tol, 200ppm/Cel, Surface Mount, 2010, CHIP, ROHS COMPLIANT

S2010CPG2674D20 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
Objectid1618117857
package instruction, 2010
Reach Compliance Codecompliant
ECCN codeEAR99
JESD-609 codee4
Manufacturer's serial number2010
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature150 °C
Package shapeRECTANGULAR PACKAGE
method of packingBULK
Rated power dissipation(P)1 W
Rated temperature70 °C
resistance2670000 Ω
Resistor typeFIXED RESISTOR
size code2010
surface mountYES
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient200 ppm/°C
Terminal surfaceGold (Au)
Terminal shapeWRAPAROUND
Tolerance0.5%
Operating Voltage150 V
2010 Thick Film Chip Resistor
Standard Grade, Wraparound
PERFORMANCE CHARACTERISTICS
Resistance Range
Tolerances (1)
TCR
Thermal Resistance
Maximum Power
Maximum Voltage
(1)+/- 0.5% limited availability
1
W-40
M
W
0.5%,1%, 2%, 5%,10%
±100, ±200, ±300 ppm
48.4°C/W
1000 mW
150 Volts
GLASS
PASSIVATION
RESISTOR
FILM
96% ALUMINA CHIP
WRAPAROUND
TERMINATIONS
CURRENT NOISE
TEMPERATURE RISE (°C)
POWER DISSIPATION
fiber epoxy board
ceramic board
ENVIRONMENTAL PERFORMANCE (2)
Thermal Shock
Low Temperature Operation
Short-time Overload
Resistance to Bonding Exposure
Moisture Resistance
High Temperature Exposure
Life Test
±0.03%
±0.03%
±0.03%
±0.03%
±0.05%
±0.05%
See Chart
POWER DISSIPATION (WATTS)
LIFE TEST
POWER DERATING
(2)Typical resistance change, test methods and criteria
per MIL-PRF-55342.
PART NUMBERING
S 2010 C P X 150 J 20 - TR
PACKAGING CODE: - TR = Tape/Reel - W = Waffle Carrier (Default packaging is Bulk)
TEMPERATURE CHARACTERISTIC: 10: ±100 ppm 20: ±200 ppm 30: ±300 ppm
TOLERANCE: F: 1% G: 2% J: 5% K: 10% M: 20%
RESISTANCE VALUE:
Four digits are used for tolerances of 1% or lower, three digits are used above 1%. Leading digits are significant while the last digit
specifies the number of zeros to add. The letter "R" is used to represent the decimal for fractional ohmic values. Example: 5R6 is 5.6
ohms.
TERMINATION FINISH: X: Sn60 over Nickel (Solderable) C: Silver bearing (Epoxy bondable-RoHS) G: Gold (Epoxy bondable-RoHS)
Y: Silver over Nickel (Solderable -RoHS) Z: Gold over Nickel (Solderable-RoHS)
PRODUCT DESIGNATION: P: Thick film on alumina U: Untrimmed alumina (10% & 20% tolerance only)
TERMINATION TYPE: C: Wraparound termination
SIZE CODE
GRADE: S: Standard Production H: High Reliability (For Screening options, contact the factory)
MECHANICAL
INCHES
MILLIMETERS
.252
MINIMUM
RECOMMENDED
MOUNTING
PADS
(INCHES)
Length
Width
Thickness
Top Term
Bottom Term
Gap
Approx. Weight
.202 (.200 - .210)
.094 (.093 - .100)
.028 (.023 - .033)
.020 (.015 - .025)
.019 (.015 - .025)
.164 (.160 - .168)
.0323 grams
5.13
2.38
0.71
0.51
0.48
4.17
(5.08 - 5.33)
(2.36 - 2.54)
(0.58 - 0.84)
(0.38 - 0.64)
(0.38 - 0.64)
(4.06 - 4.27)
.100
.154
.049
“Specifications subject to change without notice.”
STATE OF THE ART, INC.
2470 Fox Hill Road, State College, PA 16803-1797
Phone (814) 355-8004
www.resistor.com
Fax (814) 355-2714
Toll Free 1-800-458-3401
02/08/08
LIN bus and its application in automotive hierarchical network 3
. The power module is mainly composed of the voltage regulator SA57022 produced by PHILIPS. SA57022 can be turned on or off through the ON/OFF pin. It cooperates with the LIN transceiver to realize th...
frozenviolet Automotive Electronics
[National Technology N32G430] 4. Make a simple and easy-to-use multi-task scheduling system
【National Technology N32G430】3. Timer - Domestic chip exchange - Electronic Engineering World - Forum (eeworld.com.cn) [Purpose] When I first learned microcontrollers, delays were all implemented usin...
lugl4313820 Domestic Chip Exchange
[Anxinke UWB indoor positioning module NodeMCU-BU01] 02. AT command distance measurement
1. NodeMCU-BU01 development board jumper settings The NodeMCU-BU01 development board has an STM32 MCU as the main control chip, which integrates the AT debugging command function to facilitate online ...
xld0932 RF/Wirelessly
Electromagnetic radiation from power line communication systems indoors
Monday, July 17, 2006 10:18:07Electromagnetic radiation from power line communication systems indoors Indoor radiated emission associated with power line communications systems1 Introduction In recent...
fighting Analog electronics
LPC11XX driver 1602 program_12MHz
[size=4]LCD.c文件:[/size] [size=4] [/size] [size=4]#include "LPC11XX.h"[/size] [size=4]#include "gpio.h"[/size] [size=4]#include "main.h"[/size] [size=4]#include "Delay.h"[/size] [size=4]#include "LCD.h...
Jacktang Microcontroller MCU
How to adjust the copper distance of the mounting hole position
Dear experts, I want to increase the copper coverage distance around the via installation so that the copper coverage is outside the yellow circle, but the copper coverage distance on the edge should ...
fangui PCB Design

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号