Flash, 512KX16, 70ns, PBGA45,
Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Objectid | 114814202 |
Reach Compliance Code | compliant |
ECCN code | EAR99 |
Maximum access time | 70 ns |
Spare memory width | 8 |
startup block | BOTTOM |
command user interface | YES |
Universal Flash Interface | YES |
Data polling | YES |
JESD-30 code | R-PBGA-B45 |
memory density | 8388608 bit |
Memory IC Type | FLASH |
memory width | 16 |
Number of departments/size | 8,15 |
Number of terminals | 45 |
word count | 524288 words |
character code | 512000 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 512KX16 |
Package body material | PLASTIC/EPOXY |
encapsulated code | FBGA |
Encapsulate equivalent code | BGA45,9X11,16/8 |
Package shape | RECTANGULAR |
Package form | GRID ARRAY, FINE PITCH |
Parallel/Serial | PARALLEL |
power supply | 1.8 V |
Certification status | Not Qualified |
ready/busy | YES |
Department size | 8K,64K |
Maximum standby current | 0.00003 A |
Maximum slew rate | 0.03 mA |
Nominal supply voltage (Vsup) | 1.8 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal form | BALL |
Terminal pitch | 0.2 mm |
Terminal location | BOTTOM |
switch bit | YES |
type | NOR TYPE |
S29AS008J70LFI042 | S29AS008J70LFI033 | S29AS008J70LFI043 | |
---|---|---|---|
Description | Flash, 512KX16, 70ns, PBGA45, | Flash, 512KX16, 70ns, PBGA45, | Flash, 512KX16, 70ns, PBGA45, |
Is it Rohs certified? | conform to | conform to | conform to |
Objectid | 114814202 | 114814201 | 114814203 |
Reach Compliance Code | compliant | compliant | compliant |
ECCN code | EAR99 | EAR99 | EAR99 |
Maximum access time | 70 ns | 70 ns | 70 ns |
Spare memory width | 8 | 8 | 8 |
startup block | BOTTOM | TOP | BOTTOM |
command user interface | YES | YES | YES |
Universal Flash Interface | YES | YES | YES |
Data polling | YES | YES | YES |
JESD-30 code | R-PBGA-B45 | R-PBGA-B45 | R-PBGA-B45 |
memory density | 8388608 bit | 8388608 bit | 8388608 bit |
Memory IC Type | FLASH | FLASH | FLASH |
memory width | 16 | 16 | 16 |
Number of departments/size | 8,15 | 8,15 | 8,15 |
Number of terminals | 45 | 45 | 45 |
word count | 524288 words | 524288 words | 524288 words |
character code | 512000 | 512000 | 512000 |
Maximum operating temperature | 85 °C | 85 °C | 85 °C |
Minimum operating temperature | -40 °C | -40 °C | -40 °C |
organize | 512KX16 | 512KX16 | 512KX16 |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | FBGA | FBGA | FBGA |
Encapsulate equivalent code | BGA45,9X11,16/8 | BGA45,9X11,16/8 | BGA45,9X11,16/8 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL |
power supply | 1.8 V | 1.8 V | 1.8 V |
Certification status | Not Qualified | Not Qualified | Not Qualified |
ready/busy | YES | YES | YES |
Department size | 8K,64K | 8K,64K | 8K,64K |
Maximum standby current | 0.00003 A | 0.00003 A | 0.00003 A |
Maximum slew rate | 0.03 mA | 0.03 mA | 0.03 mA |
Nominal supply voltage (Vsup) | 1.8 V | 1.8 V | 1.8 V |
surface mount | YES | YES | YES |
technology | CMOS | CMOS | CMOS |
Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
Terminal form | BALL | BALL | BALL |
Terminal pitch | 0.2 mm | 0.2 mm | 0.2 mm |
Terminal location | BOTTOM | BOTTOM | BOTTOM |
switch bit | YES | YES | YES |
type | NOR TYPE | NOR TYPE | NOR TYPE |