Data Sheet
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LEADFRAME
CERAMIC/HERMETIC
Ceramic/Hermetic
Common Package Families
Ceramic Ball Grid Array (CBGA)
Ceramic Pin Grid Array (CPGA)
Ceramic Land Grid Array (CLGA)
Ceramic Quad Flat Pack (CQFP)
Ceramic SOIC (CSOIC)
CerDip
CerPak
“J”Cerquad
Leaded Chip Carrier (LDCC)
Leadless Chip Carrier (LCC)
Low Cost Pin Grid Array (LCPGA)
Plastic Pin Grid Array (PPGA)
Side Braze
Flatpack
Flatpack with Ceramic Bar (FPCB)
Wafer backgrinding
Die attach cure/organic burn out up to 425°C
Eutectic bonding
Glass or solder seal up to 435°C
Temperature cycling
Centrifuge
Tin plating
Pin D testing
Laser or ink marking
Fine leak testing
Gross leak testing
Ceramic/Hermetic Package Assembly
Ceramic/Hermetic packages are commonly used for
applications requiring high performance and high reliability.
They can generally withstand higher temperatures than
traditional plastic packages, and the relatively low CTE of
ceramic materials and the cavity construction also make
ceramic/hermetic packages ideal for extremely stress-
sensitive devices such as MEMs sensors.
Amkor supports a wide range of assembly options for
ceramic/hermetic packages, including commercial,
automotive, and military/aerospace process flows. The
assembly line is highly customizable, allowing assembly of
a large variety of commonly used ceramic/hermetic
packages.
Process Options
Services and Support
Amkor has a broad base of resources available to help our
customers bring quality new products to market quickly and
at low cost.
• Full package characterization
• Thermal, mechanical stress and electrical performance
modeling
• Turnkey assembly, test and drop ship
• World class reliability testing and failure analysis
Material Options
• Aluminum or gold wire interconnect
• Ag glass or epoxy die attach
Note that ceramic package base and lid can be purchased from several well
known suppliers and should be consigned to Amkor for production assembly.
Contact your Amkor account management team for more details.
Visit Amkor Technology online for locations and
to view the most current product information.
With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. Amkor
shall not be responsible for any loss or damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend
or modify Amkor’s warranty on any product beyond that set forth in its standard terms and conditions of sale. Amkor reserves the right to make changes in its product and specifications at any time and
without notice. © 2013, Amkor Technology Incorporated. All Rights Reserved.
DS830A
Rev Date: 8/12
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