Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPA60R190E6
MA001108574
PG-TO220-3-111
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
non noble metal
noble metal
non noble metal
non noble metal
inorganic material
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
antimony
silver
tin
iron
phosphorus
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-36-0
7440-22-4
7440-31-5
7439-89-6
7723-14-0
7440-50-8
Issued
Weight*
Weight
[mg]
7.592
0.687
0.206
686.221
2.497
2.199
206.700
890.567
7.942
0.305
0.001
0.369
0.923
2.400
0.433
0.130
432.110
Average
Mass
[%]
0.34
0.03
0.01
30.62
0.11
0.10
9.22
39.73
0.35
0.01
0.00
0.02
0.04
0.11
0.02
0.01
19.28
29. August 2013
2241.28 mg
Sum
[%]
0.34
Average
Mass
[ppm]
3387
307
92
30.66
0.11
306174
1114
981
92224
49.05
0.35
397346
3543
136
0.01
1
165
412
0.17
1071
193
58
19.31
192796
193047
1000000
1648
136
490552
3543
306573
1114
Sum
[ppm]
3387
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com