o
Part Numbering
CERAFILr for FM
(Part Number)
qProduct
ID
Product ID
SF
wOscillation/Number
of Elements
Code
E
T
V
K
Oscillation/Number of Elements
2 Elements Thickness Expander mode
3 Elements Thickness Expander mode
2 Elements Thickness Expander mode
(2nd Harmonic)
2 Elements Thickness Expander mode
(3rd Over Tone)
Ceramic Filters
SF
q
E
w
LF
e
10M7 F
r
A
A0
u
-B0
i
yCenter
Frequency/Tolerance
Code
A
B
C
D
E
H
V
W
K
Z
M
eStructure/Size
Code
Lp
Cp
Structure/Size
Lead Type
Chip Type
uSeries
Code
A0
rNominal
Center Frequency
Expressed by four-digit alphanumerics. The unit is in hertz (Hz).
Decimal point is expressed by capital letter "M" in case of MHz.
iPackaging
Code
-B0
t3dB
Bandwidth
Code
C
D
E
F
G
H
J
K
L
M
N
3dB Bandwidth
450kHz min
350kHz min
330kHz
280kHz
230kHz
180kHz
150kHz
110kHz
80kHz
50kHz
35kHz
-R0
-R1
-A0
-A1
Packaging
Bulk
Embossed Taping ø180mm
Embossed Taping ø330mm
1500pcs. /Radial Taping H
0
=18mm
1000pcs. /Radial Taping H
0
=18mm
Series
Two-digit alphanumerics express series
F
Center Frequency
Center Frequency mentioned by specification
Tolerance
±30kHz
t y
-30kHz shifted from center frequency of code "A"
±30kHz
+30kHz shifted from center frequency of code "A"
±30kHz
-60kHz shifted from center frequency of code "A"
±30kHz
+60kHz shifted from center frequency of code "A"
±30kHz
Center Frequency mentioned by specification
±25kHz
-50kHz shifted from center frequency of code "H"
±25kHz
+50kHz shifted from center frequency of code "H"
±25kHz
Center Frequency mentioned by specification
Combination of A, B, C, D, E
Combination of A, B, C
Nominal Center Frequency
±20kHz
—
—
—
3dB bandwidth of "F" signifies the frequency difference (both + and -)
from reference frequency which is nominal center frequency.
p
is expressed "A" or subsequent code, which indicates the
structure/size.
Radial taping is applied to lead type and embossed taping to chip
type. With non-standard products, two-digit alphanumerics indicating
"Individual Specification" are added between "
u
Series" and
"
i
Packaging".
PCB Design
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