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K6R4016V1D-KI08T

Description
Standard SRAM, 256KX16, 8ns, CMOS, PDSO44
Categorystorage    storage   
File Size225KB,12 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
Environmental Compliance
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K6R4016V1D-KI08T Overview

Standard SRAM, 256KX16, 8ns, CMOS, PDSO44

K6R4016V1D-KI08T Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Objectid107691393
package instructionSOJ, SOJ44,.44
Reach Compliance Codeunknown
ECCN code3A991.B.2.A
Maximum access time8 ns
I/O typeCOMMON
JESD-30 codeR-PDSO-J44
memory density4194304 bit
Memory IC TypeSTANDARD SRAM
memory width16
Number of terminals44
word count262144 words
character code256000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize256KX16
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeSOJ
Encapsulate equivalent codeSOJ44,.44
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Parallel/SerialPARALLEL
power supply3.3 V
Certification statusNot Qualified
Maximum standby current0.005 A
Minimum standby current3 V
Maximum slew rate0.09 mA
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formJ BEND
Terminal pitch1.27 mm
Terminal locationDUAL
PRELIMPreliminaryPPPPPPPPPINARY
K6R4016V1D
Document Title
256Kx16 Bit High Speed Static RAM(3.3V Operating).
Operated at Commercial and Industrial Temperature Ranges.
CMOS SRAM
Revision History
Rev No.
Rev. 0.0
Rev. 0.1
Rev. 0.2
Rev. 0.3
History
Initial release with Preliminary.
Add Low Ver.
Package dimensions modify on page 11.
Change ICC , ISB, ISB1
Item
I
CC(Commercial)
8ns
10ns
12ns
15ns
8ns
10ns
12ns
15ns
I
SB
I
SB1(L-ver.)
Previous
110mA
90mA
80mA
70mA
130mA
115mA
100mA
85mA
30mA
0.5mA
Current
80mA
65mA
55mA
45mA
100mA
85mA
75mA
65mA
20mA
1.2mA
Draft Data
Aug. 20. 2001
Sep. 19. 2001
Sep. 28. 2001
Oct. 09. 2001
Remark
Preliminary
Preliminary
Preliminary
Preliminary
I
CC(Industrial)
Rev. 0.4
1. Correct AC parameters : Read & Write Cycle
2. Change Data Retention Current :
from 0.45mA to 1.1mA when Vcc=3.0V
from 0.35mA to 0.9mA when Vcc=2.0V
3. Limit L-Ver. to 48 TBGA Package
1. Delete 12ns,15ns speed bin.
2. Change Icc for Industrial mode.
Item
8ns
I
CC(Industrial)
10ns
Nov.23. 2001
Preliminary
Rev. 1.0
Dec.18. 2001
Previous
100mA
85mA
Current
90mA
75mA
Final
Rev. 2.0
Rev. 2.1
Rev. 2.2
Rev. 2.3
Rev. 3.0
Rev. 4.0
1. Add tBA,tBLZ,tBHZ,tBW AC parematers.
1. Correct the Package dimensions(48-TBGA)
1. Add the tPU and tPD into the waveform.
1. Change the current parameters (Isb1 L-ver, Idr)
1. Add the Lead Free Package type.
1. Change the Idr parameters
previous
Current
Idr(2V)
1.2mA
1.4mA
Idr(3V)
1.8mA
2.0mA
Feb. 14. 2002
Oct. 23. 2002
Mar. 10, 2003
June. 12, 2003
June. 20, 2003
Mar. 15, 2004
Final
Final
Final
Final
Final
Final
The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the
specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions on the parameters of this device. If you have any ques-
tions, please contact the SAMSUNG branch office near your office, call or contact Headquarters.
-1-
Rev 4.0
Mar. 2004

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Description Standard SRAM, 256KX16, 8ns, CMOS, PDSO44 Standard SRAM, 256KX16, 8ns, CMOS, PBGA48 Standard SRAM, 256KX16, 10ns, CMOS, PDSO44 Standard SRAM, 256KX16, 8ns, CMOS, PDSO44 Standard SRAM, 256KX16, 8ns, CMOS, PDSO44 Standard SRAM, 256KX16, 8ns, CMOS, PDSO44 Standard SRAM, 256KX16, 8ns, CMOS, PDSO44 Standard SRAM, 256KX16, 10ns, CMOS, PDSO44
Is it Rohs certified? conform to incompatible incompatible incompatible incompatible conform to incompatible conform to
package instruction SOJ, SOJ44,.44 FBGA, BGA48,6X8,30 SOJ, SOJ44,.44 TSOP, TSOP44,.46,32 TSOP, TSOP44,.46,32 TSOP, TSOP44,.46,32 SOJ, SOJ44,.44 SOJ, SOJ44,.44
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown
Maximum access time 8 ns 8 ns 10 ns 8 ns 8 ns 8 ns 8 ns 10 ns
I/O type COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 code R-PDSO-J44 R-PBGA-B48 R-PDSO-J44 R-PDSO-G44 R-PDSO-G44 R-PDSO-G44 R-PDSO-J44 R-PDSO-J44
memory density 4194304 bit 4194304 bit 4194304 bit 4194304 bit 4194304 bit 4194304 bit 4194304 bit 4194304 bit
Memory IC Type STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM
memory width 16 16 16 16 16 16 16 16
Number of terminals 44 48 44 44 44 44 44 44
word count 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words
character code 256000 256000 256000 256000 256000 256000 256000 256000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 70 °C 85 °C 70 °C 85 °C 85 °C 70 °C 85 °C
Minimum operating temperature -40 °C - -40 °C - -40 °C -40 °C - -40 °C
organize 256KX16 256KX16 256KX16 256KX16 256KX16 256KX16 256KX16 256KX16
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SOJ FBGA SOJ TSOP TSOP TSOP SOJ SOJ
Encapsulate equivalent code SOJ44,.44 BGA48,6X8,30 SOJ44,.44 TSOP44,.46,32 TSOP44,.46,32 TSOP44,.46,32 SOJ44,.44 SOJ44,.44
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE GRID ARRAY, FINE PITCH SMALL OUTLINE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
power supply 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum standby current 0.005 A 0.005 A 0.0014 A 0.005 A 0.005 A 0.005 A 0.005 A 0.005 A
Minimum standby current 3 V 3 V 2 V 3 V 3 V 3 V 3 V 3 V
Maximum slew rate 0.09 mA 0.08 mA 0.075 mA 0.08 mA 0.09 mA 0.09 mA 0.08 mA 0.075 mA
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL COMMERCIAL INDUSTRIAL COMMERCIAL INDUSTRIAL INDUSTRIAL COMMERCIAL INDUSTRIAL
Terminal form J BEND BALL J BEND GULL WING GULL WING GULL WING J BEND J BEND
Terminal pitch 1.27 mm 0.75 mm 1.27 mm 0.8 mm 0.8 mm 0.8 mm 1.27 mm 1.27 mm
Terminal location DUAL BOTTOM DUAL DUAL DUAL DUAL DUAL DUAL
Objectid 107691393 - - 107691405 107691409 107691425 107691373 107691395
ECCN code 3A991.B.2.A - - 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A
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