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R5F21364MNFP

Description
IC,MICROCONTROLLER,16-BIT,R8C CPU,CMOS,QFP,64PIN,PLASTIC
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size567KB,61 Pages
ManufacturerRenesas Electronics Corporation
Websitehttps://www.renesas.com/
Download Datasheet Parametric View All

R5F21364MNFP Overview

IC,MICROCONTROLLER,16-BIT,R8C CPU,CMOS,QFP,64PIN,PLASTIC

R5F21364MNFP Parametric

Parameter NameAttribute value
Objectid1125518388
Parts packaging codeQFP
Contacts64
Reach Compliance Codecompliant
Has ADCYES
Address bus width
bit size16
CPU seriesR8C
maximum clock frequency20 MHz
DMA channelNO
External data bus width
JESD-30 codeS-PQFP-G64
length10 mm
Number of I/O lines59
Number of terminals64
Maximum operating temperature85 °C
Minimum operating temperature-20 °C
PWM channelYES
Package body materialPLASTIC/EPOXY
encapsulated codeLQFP
Encapsulate equivalent codeQFP64,.47SQ,20
Package shapeSQUARE
Package formFLATPACK
power supply2/5 V
Certification statusNot Qualified
RAM (bytes)1536
rom(word)16384
ROM programmabilityFLASH
speed20 MHz
Maximum slew rate15 mA
Maximum supply voltage5.5 V
Minimum supply voltage2.7 V
Nominal supply voltage3 V
surface mountYES
technologyCMOS
Temperature levelOTHER
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationQUAD
width10 mm
uPs/uCs/peripheral integrated circuit typeMICROCONTROLLER
Datasheet
R8C/36M Group
RENESAS MCU
R01DS0086EJ0100
Rev.1.00
Jun 15, 2011
1.
1.1
Overview
Features
The R8C/36M Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions
for a high level of efficiency. With 1 Mbyte of address space, and it is capable of executing instructions at high
speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.
Power consumption is low, and the supported operating modes allow additional power control. These MCUs are
designed to maximize EMI/EMS performance.
Integration of many peripheral functions, including multifunction timer and serial interface, reduces the number of
system components.
The R8C/36M Group has data flash (1 KB × 4 blocks) with the background operation (BGO) function.
1.1.1
Applications
Electronic household appliances, office equipment, audio equipment, consumer equipment, etc.
R01DS0086EJ0100 Rev.1.00
Jun 15, 2011
Page 1 of 58
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