IC,PROM,1KX4,TTL,DIP,18PIN,PLASTIC
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Objectid | 1167340924 |
package instruction | DIP, DIP18,.3 |
Reach Compliance Code | not_compliant |
ECCN code | EAR99 |
Maximum access time | 45 ns |
JESD-30 code | R-PDIP-T18 |
JESD-609 code | e0 |
memory density | 4096 bit |
Memory IC Type | OTP ROM |
memory width | 4 |
Number of terminals | 18 |
word count | 1024 words |
character code | 1000 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 1KX4 |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Encapsulate equivalent code | DIP18,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Certification status | Not Qualified |
surface mount | NO |
technology | TTL |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |