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WS256K32L-25HC

Description
256Kx32 SRAM MODULE
File Size186KB,8 Pages
ManufacturerETC1
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WS256K32L-25HC Overview

256Kx32 SRAM MODULE

WS256K32-XXX
HI-RELIABILITY PRODUCT
256Kx32 SRAM MODULE
FEATURES
s
Access Times 20, 25, 35ns
s
MIL-STD-883 Compliant Devices Available
s
Packaging
PRELIMINARY*
s
2V Data Retention devices available
(WS256K32L-XXX low power version only)
s
Commercial, Industrial and Military Temperature Range
s
5 Volt Power Supply
s
Low Power CMOS
s
TTL Compatible Inputs and Outputs
s
Weight
WS256K32N-XHX - 13 grams typical
WS256K32-XG4X - 20 grams typical
* This data sheet describes a product under development, not fully
characterized, and is subject to change without notice.
• 66 pin, PGA Type, 1.185 inch square, Hermetic
Ceramic HIP (Package 401)
• 68 lead, 40mm, Hermetic CQFP (Package 501)
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Organized as 256Kx32, User Configurable as 512Kx16
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Upgradable to 512Kx32 for future expansion
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Data I/O Compatible with 3.3V devices
FIG. 1
1
I/O
8
I/O
9
PIN CONFIGURATION FOR WS256K32N-XHX
TOP VIEW
12
NC
NC
GND
I/O
11
A
10
A
11
A
12
V
CC
CS
1
NC
I/O
3
22
33
23
I/O
15
I/O
14
I/O
13
I/O
12
OE
NC
WE
1
I/O
7
I/O
6
I/O
5
I/O
4
I/O
24
I/O
25
I/O
26
A
6
A
7
NC
A
8
A
9
I/O
16
I/O
17
I/O
18
44
34
V
CC
NC
NC
I/O
27
A
3
A
4
A
5
WE
2
CS
2
GND
I/O
19
55
45
I/O
31
I/O
30
I/O
29
I/O
28
A
0
A
1
A
2
I/O
23
I/O
22
I/O
21
I/O
20
66
16
16
PIN DESCRIPTION
56
I/O
0
-
31
A
0-17
WE
1-2
CS
1-2
Data Inputs/Outputs
Address Inputs
Write Enables
Chip Selects
Output Enable
Power Supply
Ground
Not Connected
I/O
10
A
13
A
14
A
15
A
16
A
17
I/O
0
I/O
1
I/O
2
11
OE
BLOCK DIAGRAM
WE
1
CS
1
OE
A
0-17
WE
2
CS
2
V
CC
GND
NC
256K x 16
256K x 16
I/O
0-15
I/O
16-31
October 2000 Rev. 2
1
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
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