BCP56 datasheet, PDF - EEWORLD Datasheet

BCP56: File Size1MB，4 Pages; ManufacturerJCET; Websitehttp://www.cj-elec.com/; Jiangsu Changdian Technology Co., Ltd. focuses on semiconductor packaging and testing business, providing customers at home and abroad with a full range of solutions such as chip testing, packaging design, packaging testing, etc. The company was successfully listed on the Shanghai Main Board in 2003, becoming the first semiconductor packaging and testing listed company in China. It now has a national enterprise technology center and a postdoctoral research workstation. It is a national key high-tech enterprise, a supporting unit of the National Engineering Laboratory for High-density Integrated Circuits, and the chairman unit of the Integrated Circuit Packaging Technology Innovation Strategic Alliance.

Discrete devices: diodes (switching diodes, Schottky diodes (Schottky rectifiers), voltage regulator diodes, Pin diodes, TVS diodes, rectifier diodes, fast recovery diodes); transistors (Darlington tubes, digital transistors, MOSFETs); thyristors: silicon-controlled rectifiers, triacs; composite tubes: transistors + field-effect tubes, dual transistors, dual digital transistors, digital transistors + transistors, transistors + diodes, field-effect tubes + diodes, dual field-effect tubes. Voltage regulator circuit; energy-saving lamp charger switch tube

Lead frame: TO series (TO); SOD series (SOD); SOT series (TSOT, SOT); FBP series (WBFBP); QFN series (QFNWB, DFNWB, DFNFC, QFNFC); QFP series (LQFP: PQFP: PLCC: TQFP); SIP series (SIP, HSIP, FSIP); SOP series (SOP, HSOP, SSOP, MSOP, HTSOP, TSSOP); DIP series (DIP, FDIP, SDIP); PDFN series; PQFN series; MIS series (MISFC, MISWB)

Nine core technologies: Through Silicon Via (TSV) packaging technology; SiP RF packaging technology; wafer-level 3D rewiring packaging process technology; copper bump interconnection technology; high-density FC-BGA packaging and testing technology (Flip Chip BGA); multi-turn array four-sided pinless packaging and testing technology; package body 3D stacking technology; 50μm or less ultra-thin chip 3D stacking packaging technology; MEMS multi-chip packaging technology; MIS packaging technology (pre-encapsulated interconnection system); BGA packaging technology, etc.

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BCP56 Parametric

Parameter Name	Attribute value
Transistor type	NPN
Collector-emitter breakdown voltage (Vceo)	80V
Collector current (Ic)	1A
Power(Pd)	1.5W
Collector-emitter saturation voltage (VCE(sat)@Ic,Ib)	500mV@500mA,50mA
DC current gain (hFE@Ic,Vce)	100@150mA,2V
Characteristic frequency (fT)	100MHz
Operating temperature	-

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JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD

SOT-223 Plastic-Encapsulate Transistors

BCP54,55,56

TRANSISTOR (NPN)

SOT-223

FEATURES

For AF driver and output stages

High collector current

Low collector-emitter saturation voltage

Complementary types: BCP51 ... BCP53 (PNP)

MAXIMUM RATINGS (T

=25℃ unless otherwise noted)

Symbol

CBO

CEO

EBO

θJA

stg

Parameter

Collector-Base Voltage

Collector-Emitter Voltage

Emitter-Base Voltage

Collector Current -Continuous

Collector Power Dissipation

Thermal Resistance Junction to Ambient

Storage Temperature Range

BCP54

BCP55

1.5

83.3

-65~+150

BCP56

100

1. BASE

2. COLLECTOR

3. EMITTER

Unit

℃/W

℃

ELECTRICAL CHARACTERISTICS (T

=25℃ unless otherwise specified)

Parameter

Collector-base breakdown voltage

BCP54

BCP55

BCP56

Collector-emitter breakdown voltage

BCP54

BCP55

BCP56

Base-emitter breakdown voltage

Collector cut-off current

(BR)EBO

CBO

FE(1)

DC current gain

FE(2)

FE(3)

Collector-emitter saturation voltage

Base-emitter voltage

Transition frequency

CE(sat)

= 10μA,I

= 30 V, I

= 2V, I

=5mA

= 2V, I

=150m A

= 2V, I

=500m A

=500mA,I

=50mA

=2V, I

=500m A

=10V,I

=50mA,f=100MHz

100

0.5

MHz

250

(BR)CEO

= 10mA,I

(BR)CBO

= 0.1mA,I

Symbol

Test conditions

Min

100

Max

Unit

CLASSIFICATION OF h

FE(2)

Rank

Range

Marking

www.cj-elec.com

BCP54-10, BCP55-10, BCP56-10

63-160

BCP54-10, BCP55-10, BCP56-10

BCP54-16, BCP55-16, BCP56-16

100-250

BCP54-16, BCP55-16, BCP56-16

G,Jan,2017

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