Standard SRAM, 8KX8, 85ns, CMOS, PDSO28
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Objectid | 101236854 |
package instruction | SOJ, SOJ28,.34 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Maximum access time | 85 ns |
I/O type | COMMON |
JESD-30 code | R-PDSO-J28 |
JESD-609 code | e0 |
memory density | 65536 bit |
Memory IC Type | STANDARD SRAM |
memory width | 8 |
Humidity sensitivity level | 3 |
Number of terminals | 28 |
word count | 8192 words |
character code | 8000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 8KX8 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | SOJ |
Encapsulate equivalent code | SOJ28,.34 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE |
Parallel/Serial | PARALLEL |
power supply | 5 V |
Certification status | Not Qualified |
Maximum standby current | 0.00005 A |
Minimum standby current | 2 V |
Maximum slew rate | 0.045 mA |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | J BEND |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
L7C185WC85 | L7C185IMB85 | L7C185NC45 | L7C185NC85 | L7C185PC85 | L7C185CC45 | L7C185DC45 | |
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Description | Standard SRAM, 8KX8, 85ns, CMOS, PDSO28 | Memory IC | SRAM, 8KX8, 45ns, CMOS, PDIP28, DIP-28 | Standard SRAM, 8KX8, 85ns, CMOS, PDIP28 | SRAM, 8KX8, 85ns, CMOS, PDIP28, DIP-28 | Standard SRAM, 8KX8, 45ns, CMOS, CDIP28, 0.300 INCH, CERAMIC, DIP-28 | Standard SRAM, 8KX8, 45ns, CMOS, CDIP28 |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
package instruction | SOJ, SOJ28,.34 | , | DIP, | DIP, DIP28,.6 | DIP, | DIP, DIP28,.3 | DIP, DIP28,.3 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknow | unknown | unknown |
ECCN code | EAR99 | - | - | - | EAR99 | EAR99 | EAR99 |
Maximum access time | 85 ns | - | 45 ns | 85 ns | 85 ns | - | 45 ns |
JESD-30 code | R-PDSO-J28 | - | R-PDIP-T28 | R-PDIP-T28 | R-PDIP-T28 | - | R-XDIP-T28 |
JESD-609 code | e0 | - | e0 | e0 | e0 | - | e0 |
memory density | 65536 bit | - | 65536 bit | 65536 bit | 65536 bi | - | 65536 bit |
memory width | 8 | - | 8 | 8 | 8 | - | 8 |
Humidity sensitivity level | 3 | 3 | 3 | 3 | 3 | - | 3 |
Number of terminals | 28 | - | 28 | 28 | 28 | - | 28 |
word count | 8192 words | - | 8192 words | 8192 words | 8192 words | - | 8192 words |
character code | 8000 | - | 8000 | 8000 | 8000 | - | 8000 |
Operating mode | ASYNCHRONOUS | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | - | ASYNCHRONOUS |
Maximum operating temperature | 70 °C | - | 70 °C | 70 °C | 70 °C | - | 70 °C |
organize | 8KX8 | - | 8KX8 | 8KX8 | 8KX8 | - | 8KX8 |
Package body material | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | CERAMIC |
encapsulated code | SOJ | - | DIP | DIP | DIP | - | DIP |
Package shape | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR |
Package form | SMALL OUTLINE | - | IN-LINE | IN-LINE | IN-LINE | - | IN-LINE |
Parallel/Serial | PARALLEL | - | PARALLEL | PARALLEL | PARALLEL | - | PARALLEL |
Nominal supply voltage (Vsup) | 5 V | - | 5 V | 5 V | 5 V | - | 5 V |
surface mount | YES | - | NO | NO | NO | - | NO |
technology | CMOS | - | CMOS | CMOS | CMOS | - | CMOS |
Temperature level | COMMERCIAL | - | COMMERCIAL | COMMERCIAL | COMMERCIAL | - | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) |
Terminal form | J BEND | - | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | - | THROUGH-HOLE |
Terminal location | DUAL | - | DUAL | DUAL | DUAL | - | DUAL |
Maker | - | LOGIC Devices | LOGIC Devices | LOGIC Devices | LOGIC Devices | - | - |