128KX8 EEPROM 5V, 150ns, CDIP32, HERMETIC SEALED, CERDIP-32
Parameter Name | Attribute value |
Objectid | 2026332190 |
Parts packaging code | DIP |
package instruction | DIP, |
Contacts | 32 |
Reach Compliance Code | unknown |
ECCN code | 3A001.A.2.C |
Maximum access time | 150 ns |
Other features | AUTOMATIC WRITE; DATA RETENTION: 10 YEARS |
Data retention time - minimum | 10 |
JESD-30 code | R-GDIP-T32 |
JESD-609 code | e0 |
length | 42.2 mm |
memory density | 1048576 bit |
Memory IC Type | EEPROM |
memory width | 8 |
Number of functions | 1 |
Number of terminals | 32 |
word count | 131072 words |
character code | 128000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
organize | 128KX8 |
Package body material | CERAMIC, GLASS-SEALED |
encapsulated code | DIP |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Programming voltage | 5 V |
Certification status | Not Qualified |
Filter level | MIL-STD-883 |
Maximum seat height | 5.9 mm |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | MILITARY |
Terminal surface | TIN LEAD |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 15.24 mm |
Maximum write cycle time (tWC) | 10 ms |
5962-3826705MXX | |
---|---|
Description | 128KX8 EEPROM 5V, 150ns, CDIP32, HERMETIC SEALED, CERDIP-32 |
Objectid | 2026332190 |
Parts packaging code | DIP |
package instruction | DIP, |
Contacts | 32 |
Reach Compliance Code | unknown |
ECCN code | 3A001.A.2.C |
Maximum access time | 150 ns |
Other features | AUTOMATIC WRITE; DATA RETENTION: 10 YEARS |
Data retention time - minimum | 10 |
JESD-30 code | R-GDIP-T32 |
JESD-609 code | e0 |
length | 42.2 mm |
memory density | 1048576 bit |
Memory IC Type | EEPROM |
memory width | 8 |
Number of functions | 1 |
Number of terminals | 32 |
word count | 131072 words |
character code | 128000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
organize | 128KX8 |
Package body material | CERAMIC, GLASS-SEALED |
encapsulated code | DIP |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Programming voltage | 5 V |
Certification status | Not Qualified |
Filter level | MIL-STD-883 |
Maximum seat height | 5.9 mm |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | MILITARY |
Terminal surface | TIN LEAD |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 15.24 mm |
Maximum write cycle time (tWC) | 10 ms |