K6F1008S2A-YI70T datasheet, PDF

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K6F1008S2A-YI70T: DescriptionStandard SRAM, 128KX8, 70ns, CMOS, PDSO32; Categorystorage storage; File Size173KB，10 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/

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K6F1008S2A-YI70T Overview

Standard SRAM, 128KX8, 70ns, CMOS, PDSO32

K6F1008S2A-YI70T Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Objectid	102331315
package instruction	TSSOP, TSSOP32,.56,20
Reach Compliance Code	compliant
ECCN code	EAR99
Maximum access time	70 ns
I/O type	COMMON
JESD-30 code	R-PDSO-G32
JESD-609 code	e0
memory density	1048576 bit
Memory IC Type	STANDARD SRAM
memory width	8
Number of terminals	32
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	128KX8
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	TSSOP
Encapsulate equivalent code	TSSOP32,.56,20
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial	PARALLEL
power supply	2.5 V
Certification status	Not Qualified
Maximum standby current	0.000001 A
Minimum standby current	1.5 V
Maximum slew rate	0.02 mA
Nominal supply voltage (Vsup)	2.5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	DUAL

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K6F1008S2A Family

Document Title

128Kx8 bit Super Low Power and Low Voltage CMOS Static RAM

CMOS SRAM

Revision History

Revision No.

0.0

1.0

History

Design target

Finalize

- Change V

: 1.0 to 1.5V

- Change I

test condition : V

=1.2 to 1.5V

Draft Data

November 3, 1998

February 26, 1999

Remark

Advance

Final

The attached datasheets are provided by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserves the right to change the specifications and

products. SAMSUNG Electronics will answer to your questions. If you have any questions, please contact the SAMSUNG branch offices.

Revision 1.0

February 1999

K6F1008S2A-YI70T Related Products

	K6F1008S2A-YI70T	K6F1008S2A-FI100	K6F1008S2A-FI10	K6F1008S2A-YI700	K6F1008S2A-FI700	K6F1008S2A-YI100	K6F1008S2A-YI70	K6F1008S2A-YI10	K6F1008S2A-FI70
Description	Standard SRAM, 128KX8, 70ns, CMOS, PDSO32	Standard SRAM, 128KX8, 100ns, CMOS, PBGA48, 6 X 7 MM, 0.75 MM PITCH, FBGA-48	Standard SRAM, 128KX8, 100ns, CMOS, PBGA48, 6 X 7 MM, 0.75 MM PITCH, FBGA-48	Standard SRAM, 128KX8, 70ns, CMOS, PDSO32, 8 X 13.40 MM, STSOP1-32	Standard SRAM, 128KX8, 70ns, CMOS, PBGA48, 6 X 7 MM, 0.75 MM PITCH, FBGA-48	Standard SRAM, 128KX8, 100ns, CMOS, PDSO32, 8 X 13.40 MM, STSOP1-32	Standard SRAM, 128KX8, 70ns, CMOS, PDSO32, 8 X 13.40 MM, STSOP1-32	Standard SRAM, 128KX8, 100ns, CMOS, PDSO32, 8 X 13.40 MM, STSOP1-32	Standard SRAM, 128KX8, 70ns, CMOS, PBGA48, 6 X 7 MM, 0.75 MM PITCH, FBGA-48
package instruction	TSSOP, TSSOP32,.56,20	TFBGA,	TFBGA, BGA36,6X8,30	TSSOP,	TFBGA,	TSSOP,	TSOP1, TSSOP32,.56,20	TSOP1, TSSOP32,.56,20	TFBGA, BGA36,6X8,30
Reach Compliance Code	compliant	unknown	compliant	unknown	unknown	unknown	compliant	compliant	compli
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	70 ns	100 ns	100 ns	70 ns	70 ns	100 ns	70 ns	100 ns	70 ns
JESD-30 code	R-PDSO-G32	R-PBGA-B48	R-PBGA-B48	R-PDSO-G32	R-PBGA-B48	R-PDSO-G32	R-PDSO-G32	R-PDSO-G32	R-PBGA-B48
memory density	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bi
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	8	8	8	8	8	8	8	8	8
Number of terminals	32	48	48	32	48	32	32	32	48
word count	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words
character code	128000	128000	128000	128000	128000	128000	128000	128000	128000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
organize	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TSSOP	TFBGA	TFBGA	TSSOP	TFBGA	TSSOP	TSOP1	TSOP1	TFBGA
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Nominal supply voltage (Vsup)	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	GULL WING	BALL	BALL	GULL WING	BALL	GULL WING	GULL WING	GULL WING	BALL
Terminal pitch	0.5 mm	0.75 mm	0.75 mm	0.5 mm	0.75 mm	0.5 mm	0.5 mm	0.5 mm	0.75 mm
Terminal location	DUAL	BOTTOM	BOTTOM	DUAL	BOTTOM	DUAL	DUAL	DUAL	BOTTOM
Is it Rohs certified?	incompatible	-	incompatible	-	-	-	incompatible	incompatible	incompatible
I/O type	COMMON	-	COMMON	-	-	-	COMMON	COMMON	COMMON
JESD-609 code	e0	-	e0	-	-	-	e0	e0	e0
Output characteristics	3-STATE	-	3-STATE	-	-	-	3-STATE	3-STATE	3-STATE
Encapsulate equivalent code	TSSOP32,.56,20	-	BGA36,6X8,30	-	-	-	TSSOP32,.56,20	TSSOP32,.56,20	BGA36,6X8,30
power supply	2.5 V	-	2.5 V	-	-	-	2.5 V	2.5 V	2.5 V
Maximum standby current	0.000001 A	-	0.000001 A	-	-	-	0.000001 A	0.000001 A	0.000001 A
Minimum standby current	1.5 V	-	1.5 V	-	-	-	1.5 V	1.5 V	1.5 V
Maximum slew rate	0.02 mA	-	0.02 mA	-	-	-	0.02 mA	0.02 mA	0.02 mA
Terminal surface	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	-	-	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Maker	-	SAMSUNG	SAMSUNG	-	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG
Parts packaging code	-	BGA	BGA	TSOP1	BGA	TSOP1	TSOP1	TSOP1	BGA
Contacts	-	48	48	32	48	32	32	32	48
length	-	7 mm	7 mm	11.8 mm	7 mm	11.8 mm	11.8 mm	11.8 mm	7 mm
Number of functions	-	1	1	1	1	1	1	1	1
Maximum seat height	-	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm
Maximum supply voltage (Vsup)	-	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
Minimum supply voltage (Vsup)	-	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V
width	-	6 mm	6 mm	8 mm	6 mm	8 mm	8 mm	8 mm	6 mm

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