|
TLV320DAC3203IRGET |
TLV320DAC3203IRGER |
TLV320DAC3203IYZKR |
Description |
Ultra Low Power Stereo Audio Codec With Integrated Headphone Amplifiers 24-VQFN -40 to 85 |
Ultra Low Power Stereo Audio Codec With Integrated Headphone Amplifiers 24-VQFN -40 to 85 |
Ultra Low Power Stereo Audio Codec With Integrated Headphone Amplifiers 25-DSBGA -40 to 85 |
Brand Name |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Is it lead-free? |
Lead free |
Lead free |
Lead free |
Is it Rohs certified? |
conform to |
conform to |
conform to |
package instruction |
HVQCCN, LCC24,.16SQ,20 |
HVQCCN, LCC24,.16SQ,20 |
VFBGA, BGA25,5X5,20 |
Reach Compliance Code |
compli |
compli |
compli |
ECCN code |
EAR99 |
EAR99 |
EAR99 |
Factory Lead Time |
6 weeks |
6 weeks |
6 weeks |
channel separation |
92 dB |
92 dB |
92 dB |
Commercial integrated circuit types |
VOLUME CONTROL CIRCUIT |
VOLUME CONTROL CIRCUIT |
VOLUME CONTROL CIRCUIT |
JESD-30 code |
S-PQCC-N24 |
S-PQCC-N24 |
S-XBGA-B25 |
JESD-609 code |
e4 |
e4 |
e1 |
Humidity sensitivity level |
2 |
2 |
1 |
Number of terminals |
24 |
24 |
25 |
Maximum operating temperature |
85 °C |
85 °C |
85 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
Nominal output power |
0.047 W |
0.047 W |
0.047 W |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
UNSPECIFIED |
encapsulated code |
HVQCCN |
HVQCCN |
VFBGA |
Encapsulate equivalent code |
LCC24,.16SQ,20 |
LCC24,.16SQ,20 |
BGA25,5X5,20 |
Package shape |
SQUARE |
SQUARE |
SQUARE |
Package form |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
Peak Reflow Temperature (Celsius) |
260 |
260 |
260 |
power supply |
1.8 V |
1.8 V |
1.8 V |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Maximum seat height |
1 mm |
1 mm |
1 mm |
Maximum supply voltage (Vsup) |
1.95 V |
1.95 V |
1.95 V |
Minimum supply voltage (Vsup) |
1.5 V |
1.5 V |
1.5 V |
surface mount |
YES |
YES |
YES |
technology |
CMOS |
CMOS |
CMOS |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
Terminal surface |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Tin/Silver/Copper (Sn/Ag/Cu) |
Terminal form |
NO LEAD |
NO LEAD |
BALL |
Terminal pitch |
0.5 mm |
0.5 mm |
0.5 mm |
Terminal location |
QUAD |
QUAD |
BOTTOM |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
length |
4 mm |
4 mm |
- |
width |
4 mm |
4 mm |
- |
Maker |
- |
Texas Instruments |
Texas Instruments |
Nominal noise index |
- |
94 dB |
94 dB |