Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
SPB08P06P G
MA000723232
PG-TO263-3-2
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
non noble metal
noble metal
non noble metal
non noble metal
inorganic material
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
lead
silver
tin
iron
phosphorus
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7439-92-1
7440-22-4
7440-31-5
7439-89-6
7723-14-0
7440-50-8
Issued
Weight*
Weight
[mg]
1.145
0.304
0.091
304.026
0.745
10.358
113.940
566.248
9.657
0.228
0.001
1.228
0.032
0.026
0.548
0.165
547.666
Average
Mass
[%]
0.07
0.02
0.01
19.53
0.05
0.67
7.32
36.38
0.62
0.01
0.00
0.08
0.00
0.00
0.04
0.01
35.19
28. August 2013
1556.41 mg
Sum
[%]
0.07
Average
Mass
[ppm]
735
196
59
19.56
0.05
195338
479
6655
73207
44.37
0.62
363816
6204
147
0.01
1
789
21
0.08
17
352
106
35.24
351878
352336
1000000
827
147
443679
6204
195593
479
Sum
[ppm]
735
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com