EEPROM Module, 32KX32, 90ns, Parallel, CMOS, CQFP68, 23.90 MM, CERAMIC, LQFP-68
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Objectid | 1985371855 |
package instruction | 23.90 MM, CERAMIC, LQFP-68 |
Reach Compliance Code | unknown |
Maximum access time | 90 ns |
Other features | USER CONFIGURABLE AS 128K X 8 |
Spare memory width | 16 |
JESD-30 code | S-CQFP-G68 |
JESD-609 code | e4 |
length | 23.88 mm |
memory density | 1048576 bit |
Memory IC Type | EEPROM MODULE |
memory width | 32 |
Number of functions | 1 |
Number of terminals | 68 |
word count | 32768 words |
character code | 32000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 32KX32 |
Package body material | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | QFP |
Package shape | SQUARE |
Package form | FLATPACK |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Programming voltage | 5 V |
Certification status | Not Qualified |
Maximum seat height | 3.56 mm |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | GOLD |
Terminal form | GULL WING |
Terminal pitch | 1.27 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 23.88 mm |
Maximum write cycle time (tWC) | 10 ms |