TQM4M9073
Through Line
Applications
General Purpose Wireless
RF bypass paths
Microwave Radio
Test & Measurement
Scientific Instruments
16-pin 3x3mm leadless SMT package
Product Features
DC – 6 GHz
50 ohm port impedance
Low insertion loss, <0.1dB at 2.14GHz
1.2:1 VSWR at 2.14 GHz
Surface Mountable
Functional Block Diagram
General Description
The TQM4M9073 is a passive low-loss through line that
operates from 0 to 6.0 GHz. At 2.14 GHz, input and
output return loss is greater than 22 dB and typical
insertion loss is 0.1 dB. The product is housed in an
industry standard Pb-free / RoHS-compliant surface-
mount leadless package.
Pin Configuration
Pin #
2, 11
1, 3, 4, 5, 6, 7, 8, 9,
10, 12, 13, 14, 15, 16
Backside Paddle
Symbol
RF I/O
No Connect
No Connect
Typical Performance
Parameter
Frequency
Insertion Loss
Input/ Output Return Loss
Units
MHz
dB
dB
960
<0.1
32
Typical Value
2140
0.1
25
2500
0.13
23
3000
0.17
20
Ordering Information
Part No.
TQM4M9073
Description
Through Line
Standard T/R size = 2500 pcs. on a 7” reel
Datasheet: Rev D 12-14-10
© 2010 TriQuint Semiconductor, Inc.
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Disclaimer: Subject to change without notice
Connecting the Digital World to the Global Network
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TQM4M9073
Through Line
Specifications
Electrical Specifications
Parameter
Operational Frequency Range
Port Impedance
(0 to 6 GHz)
Insertion Loss
Return Loss
Conditions
T
LEAD
= +25ºC
f=2140 MHz
Min
0
Typical
50
0.1
25
Max
6
0.3
Units
GHz
Ω
dB
dB
Absolute Maximum Ratings
Parameter
Storage Temperature
Recommended Operating Temperature Range
Rating
-55 to +150
o
C
-40 to +150
o
C
Operation of this device outside the parameter ranges given above may cause
permanent damage
Insertion Loss vs Frequency
0
-0.1
-0.2
-10
0
Input / Output Return Loss vs Frequency
Insertion Loss (dB)
-0.4
-0.5
-0.6
-0.7
-0.8
-0.9
-1
0
0.5
1
1.5
2
2.5
3
Return Loss (dB)
-0.3
-20
-30
-40
-50
0
0.5
1
1.5
2
2.5
3
Frequency (GHz)
Frequency (GHz)
Note: Insertion loss data represents TQM4M9073 performance with PCB losses de-embedded. Insertion loss measured on a
PCB will exhibit the loss contributions of the PCB material.
Pin Description
Pin
2, 11
1, 3, 4, 5, 6, 7, 8,
9, 10, 12, 13, 14,
15, 16
Backside paddle
Symbol
RF I/O
NC
Description
RF through path (bi-directional)
No electrical connection. Land pads
should be provided for PCB mounting
integrity.
Datasheet: Rev D 12-14-10
© 2010 TriQuint Semiconductor, Inc.
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2 of 7
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Disclaimer: Subject to change without notice
Connecting the Digital World to the Global Network
®
TQM4M9073
Through Line
Mechanical Information
Package Information and Dimensions
Package Style: 16-pin 3X3 leadless SMT
This package is lead-free/RoHS-compliant. The plating material on the leads is ENIG (Electroless Nickel Immersion Gold). It
is compatible with both lead-free (maximum 260 °C reflow temperature) and lead (maximum 245 °C reflow temperature)
soldering processes.
ASSEMBLY CODE.
4M9073
WW
XXXXXX
PART MARKING
Pin 1 Location: Upper Left Hand Corner
Line 1 – Pin 1 (orientation) dot & “TriQuint”
Line 2 – Product Name: “4M9073”
Line 3 – YYWW = Year/Week
Line 4 – Assembly Code
Datasheet: Rev D 12-14-10
© 2010 TriQuint Semiconductor, Inc.
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3 of 7
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Disclaimer: Subject to change without notice
Connecting the Digital World to the Global Network
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TQM4M9073
Through Line
Mounting Configuration
All dimensions are in millimeters (inches). Angles are in degrees.
Datasheet: Rev D 12-14-10
© 2010 TriQuint Semiconductor, Inc.
-
4 of 7
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Disclaimer: Subject to change without notice
Connecting the Digital World to the Global Network
®
TQM4M9073
Through Line
MANUFACTURING ENVIRONMENTS
COMPONENT HANDLING
All necessary special handling techniques shall be adopted in order to avoid contamination of metallization /
terminations. Examples include use of finger cots, plastic tweezers, etc.
PART PLACEMENT
A placement force of up to 500 grams is applied (using a 2.00 mm or a 0.080 inch diameter rod) to the center
of the part while remaining in its tape carrier.
COMPONENT SOLDERABILITY
Convection or Infrared Reflow
Part will comply with convection or infrared reflow soldering processes consistent with IPC/JEDEC J-STD-
020. TriQuint’s actual reflow profile for qualification is provided below:
Reflow Parameters
Average ramp-up rate (217
C to Peak)
Preheat Time (150
C to 200
C)
Time above 217
C
Peak Temperature
Time within 5
C of actual Peak Temperature
Ramp-down Rate
Time 25
C to Peak Temperature
IPC/JEDEC J-STD-020
3
C/second max.
60-180 seconds
60-150 seconds
260 +0/-5
C
20-40 seconds
6
C/second max.
8 minutes max.
TriQuint Actual
0.57
C/second
150 seconds
126 seconds
259
C
30 seconds
0.875
C/second
7 minutes max.
MATERIAL PACKAGING AND SHIPMENT
In the absence of customer specific requirements called out in the purchase order, material packaging and shipping
requirements shall be a defined in the paragraph and in TriQuint’s standard procedure for the packaging and shipment of
ICs in tape and reel.
GENERAL TAPE AND REEL REQUIREMENTS
Carrier and cover tape physical dimensions
Datasheet: Rev D 12-14-10
© 2010 TriQuint Semiconductor, Inc.
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Disclaimer: Subject to change without notice
Connecting the Digital World to the Global Network
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