MT3003N-UV-A
Absolute Maximum Ratings at Ta=25℃
Parameter
Power Dissipation
Reverse Voltage
D.C. Forward Current
Reverse (Leakage) Current
Peak Current(1/10Duty Cycle,0.1ms Pulse Width.)
Operating Temperature Range
Storage Temperature Range
Soldering Temperature(1.6mm from body)
Electrostatic discharge
3.0mm ROUND LED
LAMP
Symbol
P
D
V
R
If
Ir
If(Peak)
Topr
Tstg
Tsol
ESD
Rating
120
5
30
50
100
-25 to +85
-40 to +100
Unit
mW
V
mA
μA
mA
℃
℃
Dip Soldering : 260
℃
for 5 sec.
Hand Soldering : 350
℃
for 3 sec.
6000
V
Electrical and Optical Characteristics:
Parameter
Luminous Intensity
Forward Voltage
Peak Wavelength
Reverse (Leakage) Current
Viewing Angle
Spectrum Line Halfwidth
Symbol
I
V
Vf
λp
Ir
2θ1/2
Condition
If=20mA
If=20mA
If=20mA
Vr=5V
If=20mA
If=20mA
Min.
35.0
Typ.
70.0
3.2
400
Max.
Unit
mcd
4.0
V
nm
50
30
15
µA
deg
nm
∆
λ
Notes:1. The datas tested by IS tester.
2. Customer’s special requirements are also welcome.
VER.: 01
Date: 2013/08/02
Page:
2/4
MT3003N-UV-A
Precautions:
TAKE NOTE OF THE FOLLOWING IN USE OF LED
1.
Temperature in use
3.0mm ROUND LED
LAMP
Since the light generated inside the LED needs to be emitted to outside efficiently, a resin with
high light transparency is used; therefore, additives to improve the heat resistance or moisture
resistance (silica gel , etc) which are used for semiconductor products such as transistors
cannot be added to the resin.
Consequently, the heat resistant ability of the resin used for LED is usually low; therefore,
please be careful on the following during use.
Avoid applying external force, stress, and excessive vibration to the resins and terminals at
high temperature. The glass transition temperature of epoxy resin used for the LED is
approximately 120-130℃.
At a temperature exceeding this limit, the coefficient of liner expansion of the resin doubles or
more compared to that at normal temperature and the resin is softened.
If external force or stress is applied at that time, it may cause a wire rupture.
2. Soldering
Please be careful on the following at soldering.
After soldering, avoided applying external force, stress, and excessive vibration until the
products go to cooling process (normal temperature), <Same for products with terminal leads>
(1)
(2)
Soldering measurements:
Distance between melted solder side to bottom of resin shall be 1.6mm or longer.
Dip soldering :
Pre-heat: 90℃ max. (Backside of PCB), Within 60 seconds.
Solder bath: 260±5℃ (Solder temperature), Within 5 seconds.
(3)
Hand soldering: 350℃ max. (Temperature of soldering iron tip), Within 3 seconds.
3. Insertion
Pitch of the LED leads and pitch of mounting holes need to be same.
4. Others
Since the heat resistant ability of the LED resin is low, SMD components are used on the same
PCB, please mount the LED after adhesive baking process for SMD components. In case
adhesive baking is done after LED lamp insertion due to a production process reason, make
sure not to apply external force, stress, and excessive vibration to the LED and follow the
conditions below.
Baking temperature: 120℃ max.
Baking time: Within 60 seconds.
If soldering is done sequentially after the adhesive baking, please perform the soldering after cooling down
the LED to normal temperature.
VER.: 01
Date: 2013/08/02
Page:
4/4
Power technology
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