LV/LV-A/LVX/H SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20, 4.40 MM, PLASTIC, MO-153, SOT-360-1, TSSOP-20
| Parameter Name | Attribute value |
| package instruction | TSSOP, |
| Reach Compliance Code | unknown |
| Other features | WITH DUAL OUTPUT ENABLE |
| series | LV/LV-A/LVX/H |
| JESD-30 code | R-PDSO-G20 |
| JESD-609 code | e4 |
| length | 6.5 mm |
| Logic integrated circuit type | BUS DRIVER |
| Number of digits | 8 |
| Number of functions | 1 |
| Number of ports | 2 |
| Number of terminals | 20 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -40 °C |
| Output characteristics | 3-STATE |
| Output polarity | TRUE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | TSSOP |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| propagation delay (tpd) | 46 ns |
| Maximum seat height | 1.1 mm |
| Maximum supply voltage (Vsup) | 3.6 V |
| Minimum supply voltage (Vsup) | 1 V |
| Nominal supply voltage (Vsup) | 3.3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | AUTOMOTIVE |
| Terminal surface | NICKEL PALLADIUM GOLD |
| Terminal form | GULL WING |
| Terminal pitch | 0.65 mm |
| Terminal location | DUAL |
| width | 4.4 mm |
| 935175050118 | 935088030112 | 74LV541PW,118 | 74LV541PW,112 | 74LV541DB,118 | 74LV541DB,112 | 74LV541N,112 | 74LV541D,112 | 74LV541D,118 | |
|---|---|---|---|---|---|---|---|---|---|
| Description | LV/LV-A/LVX/H SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20, 4.40 MM, PLASTIC, MO-153, SOT-360-1, TSSOP-20 | LV/LV-A/LVX/H SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDIP20, 0.300 INCH, PLASTIC, MS-001, SOT-146-1, DIP-20 | IC BUF NON-INVERT 3.6V 20TSSOP | IC BUF NON-INVERT 3.6V 20TSSOP | IC BUF NON-INVERT 3.6V 20SSOP | IC BUF NON-INVERT 3.6V 20SSOP | IC BUFFER NON-INVERT 3.6V 20DIP | IC BUFFER NON-INVERT 3.6V 20SO | IC BUFFER NON-INVERT 3.6V 20SO |
| package instruction | TSSOP, | DIP, | 4.40 MM, PLASTIC, MO-153, SOT-360-1, TSSOP-20 | 4.40 MM, PLASTIC, MO-153, SOT-360-1, TSSOP-20 | 5.30 MM, PLASTIC, MO-150, SOT-339-1, SSOP-20 | 5.30 MM, PLASTIC, MO-150, SOT-339-1, SSOP-20 | DIP, DIP20,.3 | SOP, SOP20,.4 | 7.50 MM, PLASTIC, MS-013, SOT-163-1, SOP-20 |
| Reach Compliance Code | unknown | unknown | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| Other features | WITH DUAL OUTPUT ENABLE | WITH DUAL OUTPUT ENABLE | WITH DUAL OUTPUT ENABLE | WITH DUAL OUTPUT ENABLE | WITH DUAL OUTPUT ENABLE | WITH DUAL OUTPUT ENABLE | WITH DUAL OUTPUT ENABLE | WITH DUAL OUTPUT ENABLE | WITH DUAL OUTPUT ENABLE |
| series | LV/LV-A/LVX/H | LV/LV-A/LVX/H | LV/LV-A/LVX/H | LV/LV-A/LVX/H | LV/LV-A/LVX/H | LV/LV-A/LVX/H | LV/LV-A/LVX/H | LV/LV-A/LVX/H | LV/LV-A/LVX/H |
| JESD-30 code | R-PDSO-G20 | R-PDIP-T20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | R-PDIP-T20 | R-PDSO-G20 | R-PDSO-G20 |
| JESD-609 code | e4 | e4 | e4 | e4 | e4 | e4 | e4 | e4 | e4 |
| length | 6.5 mm | 26.73 mm | 6.5 mm | 6.5 mm | 7.2 mm | 7.2 mm | 26.73 mm | 12.8 mm | 12.8 mm |
| Logic integrated circuit type | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| Number of digits | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of ports | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| Number of terminals | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Output polarity | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | TSSOP | DIP | TSSOP | TSSOP | SSOP | SSOP | DIP | SOP | SOP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | IN-LINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | IN-LINE | SMALL OUTLINE | SMALL OUTLINE |
| propagation delay (tpd) | 46 ns | 46 ns | 46 ns | 46 ns | 46 ns | 46 ns | 46 ns | 46 ns | 46 ns |
| Maximum seat height | 1.1 mm | 4.2 mm | 1.1 mm | 1.1 mm | 2 mm | 2 mm | 4.2 mm | 2.65 mm | 2.65 mm |
| Maximum supply voltage (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| Minimum supply voltage (Vsup) | 1 V | 1 V | 1 V | 1 V | 1 V | 1 V | 1 V | 1 V | 1 V |
| Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| surface mount | YES | NO | YES | YES | YES | YES | NO | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| Terminal surface | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal form | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | GULL WING |
| Terminal pitch | 0.65 mm | 2.54 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| width | 4.4 mm | 7.62 mm | 4.4 mm | 4.4 mm | 5.3 mm | 5.3 mm | 7.62 mm | 7.5 mm | 7.5 mm |
| Maker | - | NXP | NXP | NXP | NXP | NXP | NXP | NXP | NXP |
| Brand Name | - | - | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor |
| Is it Rohs certified? | - | - | conform to | conform to | conform to | conform to | conform to | conform to | conform to |
| Parts packaging code | - | - | TSSOP2 | TSSOP2 | SSOP2 | SSOP2 | DIP | SOP | SOP |
| Contacts | - | - | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| Manufacturer packaging code | - | - | SOT360-1 | SOT360-1 | SOT339-1 | SOT339-1 | SOT146-1 | SOT163-1 | SOT163-1 |
| Control type | - | - | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW |
| Load capacitance (CL) | - | - | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| MaximumI(ol) | - | - | 0.008 A | 0.008 A | 0.008 A | 0.008 A | 0.008 A | 0.008 A | 0.008 A |
| Humidity sensitivity level | - | - | 1 | 1 | 1 | 1 | - | 1 | 1 |
| Encapsulate equivalent code | - | - | TSSOP20,.25 | TSSOP20,.25 | SSOP20,.3 | SSOP20,.3 | DIP20,.3 | SOP20,.4 | SOP20,.4 |
| method of packing | - | - | TAPE AND REEL | TUBE | TAPE AND REEL | TUBE | TUBE | TUBE | TAPE AND REEL |
| Peak Reflow Temperature (Celsius) | - | - | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
| power supply | - | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Prop。Delay @ Nom-Sup | - | - | 27 ns | 27 ns | 27 ns | 27 ns | 27 ns | 27 ns | 27 ns |
| Certification status | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum time at peak reflow temperature | - | - | 30 | 30 | 30 | 30 | 30 | 30 | 30 |
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