Chip Multilayer Ceramic Capacitors for Camera Flash circuit only
GR731CW0BB473KW03_ (1206, X7T:Murata, 47000pF, DC350V)
_: packaging code
1.Scope
Reference Sheet
This product specification is applied to Chip Multilayer Ceramic Capacitors used for Camera Flash circuit.
Do not use these products in any automotive power train or safety equipment including battery chargers for electric vehicles and plugin hybrids.
2.MURATA Part NO. System
(Ex.)
GR7
31
(1)L/W
Dimensions
C
(2)T
Dimensions
W0
(3)Temperature
Characteristics
BB
(4)Rated
Voltage
473
(5)Nominal
Capacitance
K
(6)Capacitance
Tolerance
W03
(7)Murata’s Control
Code
L
(8)Packaging Code
3. Type & Dimensions
(1)-1 L
3.2±0.2
(1)-2 W
1.6±0.2
(2) T
1.6±0.2
e
0.3 min.
(Unit:mm)
g
1.2 min.
4.Rated value
(3) Temperature Characteristics
(Public STD Code):X7T(Murata)
Temp. coeff
Temp. Range
or Cap. Change
(Ref.Temp.)
(4)
Rated
Voltage
(6)
(5) Nominal
Capacitance
Capacitance
Tolerance
Specifications and Test
Methods
(Operating
Temp. Range)
-33 to 22 %
・Soldering
Method
Flow / Reflow
-55 to 125 °C
(25 °C)
DC 350 V
47000 pF
±10 %
-55 to 125 °C
5.Package
mark
L
K
(8) Packaging
f180mm
Reel
EMBOSSED W8P4
f330mm
Reel
EMBOSSED W8P4
Packaging Unit
2000 pcs./Reel
8000 pcs./Reel
Product specifications in this catalog are as of Sep.28,2018,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.
GR731CW0BB473KW03-01
1
■
Specifications and Test Methods
No
1
2
3
Appearance
Dimension
Voltage proof
Item
Specification
No defects or abnormalities.
Within the specified dimensions.
No defects or abnormalities.
Visual inspection.
Using calipers and micrometers.
Measurement Point :
Test Voltage
:
Applied Time
:
Between the terminations
DC500V
1 to 5 s
Test Method
(Ref. Standard:JIS C 5101, IEC60384）
Charge/discharge current : 50mA max.
4
Charge and
Discharge cycle
Capacitance
Change
D.F.
0.05 max.
Within +/-15%
Appearance
No defects or abnormalities.
Test temperature
Discharge voltage
Discharge cycle
Discharge frequency
Exposure Time
:
:
:
:
:
25°C
below figure
100k cycle
100Hz
24+/-2h at room condition*.
1 cycle
1周期
350V
700Vpp
0V
0V
I.R.
C0.01µF : 10 MΩ•µF or more
C < 0.01 µ F : 1000 M Ω or
more
½Pretreatment
Apply test voltage(DC350V) for 1h+/-5min at test temperature.
Remove and let sit for 24+/-2h at room condition*.
Voltage proof No defects.
5
Insulation Resistance(I.R.)
C0.01µF : 100 MΩ•µF or more
C < 0.01µF : 10000 MΩ or more
Measurement Point
:
Measurement Voltage :
Charging Time
:
Between the terminations
DC250+/-25V
60+/-5s
Measurement Temperature: Room Temperature
6
7
8
Capacitance
Dissipation Factor (D.F.)
Temperature
Characteristics
of Capacitance
No bias
Shown in Rated value.
0.025 max.
W0 : Within +22/-33%
(-55°C to +125°C)
Measurement Temperature: Room Temperature
Measurement Frequency
Measurement Voltage
: 1.0+/-0.1kHz
:AC1.0+/-0.2V(r.m.s.)
The capacitance change should be measured after 5 min.
at each specified temp. stage.
Capacitance value as a reference is the value in step 3.
Step
1
2
Apply DC350V W0 : Within +/-10%
bias
(-55°C to +125°C)
Temperature(C)
Reference Temp.+/-2
Min.Operating Temp. +/-3
Reference Temp. +/-2
Max.Operating Temp. +/-3
Reference Temp. +/-2
3
4
5
½Pretreatment
Perform a heat treatment at 150+0/-10°C for 1h+/-5min and then
let sit for 24+/-2h at room condition*.
9
Vibration
Appearance
Capacitance
No defects or abnormalities.
Within the specified initial value.
Solder the capacitor on the test substrate A shown in "Complement of Test
method”.
Kind of Vibration
Total amplitude
D.F.
Within the specified initial value.
:
:
A simple harmonic motion
10Hz to 55Hz to 10Hz (1min)
1.5mm
This motion should be applied for a period of 2h in each 3 mutually
perpendicular directions(total of 6h).
10 Solderability
95% of the terminations is to be soldered evenly and
continuously.
Test Method
Preheat
Solder
Solder Temp.
Immersion time
:
:
:
:
:
Solder bath method
Solution of rosin ethanol 25(wt)%
80℃ to 120℃ for 10s to 30s
Sn-3.0Ag-0.5Cu (Lead Free Solder)
245+/-5℃
2+/-0.5s
25+/-2.5mm/s.
Flux :
Immersing in speed :
*Room Condition : Temperature:15 to 35°C, Relative humidity:45 to 75%, Atmosphere pressure:86 to 106kPa
JEMCGS-03042B
2
No
11 Resistance
to
Soldering
Heat
Item
Appearance
Capacitance
Change
D.F.
Specification
No defects or abnormalities.
Within +/-10%
Test Method
Solder
Solder Temp.
Immersion time
Within the specified initial value.
Exposure Time
Preheat
Test Method
(Ref. Standard:JIS C 5101, IEC60384）
:
:
:
:
:
:
Solder bath method
Sn-3.0Ag-0.5Cu (Lead Free Solder)
260+/-5℃
10+/-1s
25+/-2.5mm/s.
24+/-2h at room condition*.
GR731 size max.:120℃ to 150℃ for 1 min
Immersing in speed :
I.R.
Within the specified initial value.
½Pretreatment
Perform a heat treatment at 150+0/-10°C for 1h+/-5min and then
let sit for 24+/-2h at room condition*.
Voltage proof No defects.
12 Adhesive Strength
of Termination
No removal of the terminations or other defect
should occur.
Solder the capacitor on the test substrate A shown in "Complement of Test
method”.
10N
10+/-1s
Applied Direction : In parallel with the test substrate and vertical with the
capacitor side.
13 Substrate
Bending test
Capacitance
Change
Within +/-12.5%
Appearance
No defects or abnormalities.
Solder the capacitor on the test substrate B shown in "Complement of Test
method”.
Then apply the force in the direction shown in “Test Method of Substrate
Bending test” of “Complement of Test method”.
Flexure
Holding Time
Soldering Method
14 Temperature
Sudden Change
Capacitance
Change
Within +/-7.5%
Appearance
No defects or abnormalities.
:
:
:
1mm
5+/-1s
Reflow soldering
Fix the capacitor to the supporting Test substrate A (glass epoxy board)
shown in “Complement of Test method”.
Perform the 5 cycles according to the four heat treatments
shown in the following table.
Step
1
Temp.(C)
Min.Operating Temp.+0/-3
Room Temp
Max.Operating Temp.+3/-0
Room Temp
Time
(min)
30+/-3
2 to 3
30+/-3
2 to 3
D.F.
Within the specified initial value.
2
3
4
I.R.
Within the specified initial value.
Exposure Time
:
24+/-2h at room condition*.
Voltage proof No defects.
½Pretreatment
Perform a heat treatment at 150+0/-10°C for 1h+/-5min and then
let sit for 24+/-2h at room condition*.
15
High
Temperature
High
Humidity
(Steady)
Appearance
Capacitance
Change
D.F.
I.R.
No defects or abnormalities.
Within +/-15%
Fix the capacitor to the supporting Test substrate A (glass epoxy board)
shown in “Complement of Test method”.
Test Temperature
Test Humidity
Test Time
:
:
:
:
:
40+/-2℃
90% to 95%RH
500+24/-0h
DC Rated Voltage
24+/-2h at room condition*.
0.05 max.
C0.01µF : 10 MΩ•µF or more
C < 0.01µF : 1000 MΩ or more
Applied Voltage
Exposure Time
½Pretreatment
Apply test voltage for 1h+/-5min at test temperature.
Remove and let sit for 24+/-2h at room condition*.
Fix the capacitor to the supporting Test substrate A (glass epoxy board)
shown in “Complement of Test method”.
Test Temperature
Test Time
Applied Voltage
:
:
:
:
Max. Operating Temp. +/-3℃
1000+48/-0h
DC350V
24+/-2h at room condition*.
Voltage proof No defects.
16 Durability
Appearance
Capacitance
Change
D.F.
0.05 max.
No defects or abnormalities.
Within +/-15%
Charge/discharge current : 50mA max.
Exposure Time
I.R.
C0.01µF : 10 MΩ•µF or more
C < 0.01µF : 1000 MΩ or more
½Pretreatment
Apply test voltage for 1h+/-5min at test temperature.
Remove and let sit for 24+/-2h at room condition*.
Voltage proof No defects.
*Room Condition : Temperature:15 to 35°C, Relative humidity:45 to 75%, Atmosphere pressure:86 to 106kPa
JEMCGS-03042B
3
Complement of Test Method
1.Test substrate
The test substrate should be Substrate A or Substrate B as described in “Specifications and Test methods”.
The specimen should be soldered by the conditions as described below.
Soldering Method : Reflow soldering
Solder : Sn-3.0Ag-0.5Cu
(1) Test Substrate A
½Land
Dimensions
Chip Capacitor
Land
Type
GR721
GR731
b
½Material
a
1.2
2.2
Dimension (mm)
b
4.0
5.0
c
c
1.65
2.0
a
Solder Resist
: Glass Epoxy Board
½Thickness
: 1.6mm
½Thickness
of copper foil : 0.035mm
(1) Test Substrate B
a
d
c
40
Type
(f4.5)
b
100
1.6
Copper foil
Solder resist
½Material
: Glass Epoxy Board
½Thickness
of copper foil : 0.035mm
GR721
GR731
a
1.2
2.2
Dimension of pettern (mm)
b
c
4.0
1.65
5.0
2.0
d
1.0
1.0
(unit : mm)
2. Test Method of Substrate Bending test
a) Support state
(b) Test state
Test
Substrate
B
20
Test Substrate B
a
Support stand(f5)
45+/-2
45+/-2
50 min.
Capacitor
b
Test stand
Support stand
Pressure stick
(unit : mm)
b:+/-5
gap between support stand center and test stand center
a:+/-2 gap between support stand center and test stand
·Material of Test stand and pressure stick
The
material shoud be a metal where a remarkable transformation and the distortion are not caused even if it is pressurized.
·Pressurizing speed
The
pressurizing speed is pressurized at the speed of about 1mm/s until the flexure reaches a regulated value.
Pressure stick
F
Capacitor
R5
L
45
45
Support
Support
stand
JEMCGS-03042B
4
Package
(1) Appearance of taping
(a) Paper Tape
Bottom Tape (Thickness: Around 50m) is attached below Base Tape with sprocket and put Top Tape
(Thickness: Around 50m) on capacitor.
(b) Plastic Tape
Cover Tape (Thickness: Around 60m) is put on capacitor on Base Tape (Blister carrier Tape).
(c) The sprocket holes are to the right as the Tape is pulled toward the user.
(2) Packed chips
Capacitor
(3) Dimensions of Tape
(a) Type A (Dimensions of chip : Apply to 1.6x0.8 , 2.0x1.25 , 3.2x1.6 , 3.2x2.5)
1.75±0.1
f
1.5+0.1/-0
4.0±0.1
4.0±0.1
(Plastic Tape)
0.25±0.1(T≦2.0mm)
0.3±0.1(T=2.5mm)
(Paper Tape)
2.0±0.05
3.5±0.05
2.5 max.
(T≦2.0mm)
3.7 max.
(T=2.5mm)
8.0±0.3
B
1.1 max.
A
(Unit : mm)
Dimensions of chip
[L×W]
1.6×0.8
2.0×1.25
3.2×1.6
3.2×2.5
A*
1.05
1.45
2.0
2.9
B*
1.85
2.25
3.6
3.6
Dimensions
of A,B : Nominal value
(b) Type B (Dimensions of chip : Apply to 4.5x2.0)
f
1.5+0.1/-0
4.0±0.1
4.0±0.1
1.75±0.1
2.0±0.05
0.3±0.1
12.0±0.3
5.5±0.05
B
3.7max.
A
(Unit : mm)
Dimensions of chip
[L×W]
4.5×2.0
A*
2.5
B*
5.1
Dimensions
of A,B : Nominal value
JEMCGP-03074B
5
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