B3D090L-C
Order Code:
Gas Discharge Tube
Features
Surface Mounting Design 7.6×5.0×5.8mm
High Current Handling Capability 5,000A @ 8/20
μ
s
Low Capacitance and Insertion Loss
Quick Response and Long Service Life
Moisture sensitivity level
：
Level 1
B3D090L-C
Version: A0 2013-09-17
Exterior
SMD
Application information
RS485/232/422
`
Package (Top View)
1
2
3
Agency Approvals
Icon
Description
Compliance with 2011/65/EU
Compliance with IEC61249-2-21:2003
Mean lead free
UL Certificated E232249
Schematic Symbol
1
3
2
Electrical Parameter
DC Breakdown Voltage 1)2)
Impulse Spark-over Voltage
Impulse Discharge Current 3)
Arc Voltage
Insulation Resistance
Capacitance at 1MHz
Weight
Operating
And Storage
Temperature
Marking
100V/s
At 1kV/μs
At 1kV/μs
8/20μs
At 1A
DC=50V
V
DC=
0.5V
68-112
for 99 % of measured values
700
Typical values of distribution
5,000
~8
≥1
≤1.5
~1.1
-40-90
Bencent Logo YY MM B3D090L-C（YY：year
of production，MM：month of production）
600
V
V
V
A
V
GΩ
pF
g
℃
1) At delivery AQL 0.65 level II GB/T 2828.1-2003
2) In ionized mode
3) Terms and waveforms in accordance with ITU-T Rec. K. 12; IEC 61643-21
1/3
www.bencent.com.cn
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications
B3D090L-C
Order Code:
Gas Discharge Tube
Part Numbering System
B3D
(1)
090
(2)
L
( 3)
-C
(4)
B3D090L-C
Version: A0 2013-09-17
Product Characteristics
Lead Material
Body Material
Terminal Finish
Copper
Ceramics
100% Matte-Tin Plated
(1) Bencent 3-Electrode SMD Gas Discharge Tube
7.6×5.0×5.8mm
(2) DC Breakdown Voltage, e.g., 090=90V
(3) Surge Rating @8/20
μ
s, L=5,000A
（
Total Impulse
Discharge Current 5,000A @ 8/20
μ
s
）
(4)
“
-C
”
Means it is Suitable for High-Speed SMT
Environmental Reliability Characteristics
Testing items
High Temperature Storage Test
Low Temperature Storage Test
Vibration
Resistance of soldering heat
Technical standards
Temperature: 85℃
Time:2H
Temperature: -40℃
Time:2H
Frequency：10-500Hz
Amplitude：0.15mm
Time：45min
Temperature: 260±5℃
Time of dip soldering：10s，1time
Note: Up-screen program can be specified by customer’s request via contacting Bencent service
Solderability test
Solderability
Product Dimensions
A
B
C
D
E
Solder Pot Temperature:
Solder Dwell Time:
245℃±5℃
4-6 seconds
REF
A
B
F
G
mm
7.6±0.3
0.5±0.2
1.6±0.2
0.5±0.2
5.0±0.2
5.0±0.2
5.8±0.3
mm
9.6
1.5
1.5
5.0
inch
0.299±0.012
0.020±0.008
0.063±0.008
0.020±0.008
0.197±0.008
0.197±0.008
0.228±0.012
inch
0.378
0.059
0.059
0.197
C
D
E
F
Recommended Soldering Pad
A
B
C
G
REF
A
B
C
D
D
2/3
www.bencent.com.cn
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications
B3D090L-C
Order Code:
Gas Discharge Tube
Reflow Profile
Reflow Condition
Temperature Min
Pre
Heat
Temperature Max
Time
（min
to max）
Pb-Free assembly
150°C
200°C
60 – 180 secs
3°C/second max
3°C/second max
217°C
60 – 150 seconds
260+0/-5 °C
~10 seconds
6°C/second max
8 minutes Max.
260°C
25
time to peak temper ature
Time
B3D090L-C
Version: A0 2013-09-17
t
P
T
P
Ramp-up
T
L
Critical Zone
T
L
to T
P
Average ramp up rate（Liquids）Tamp
（T
L
）
to peal
T
S
(max) to T
L
- Ramp-up Rate
- Temperature (T
L
)
Reflow
(Liquids)
- Temperature (T
L
)
Peak Temperature (T
P
)
Time within 5°C of actual peak
Temperature (tp)
Ramp-down Rate
Time 25°C to peak Temperature (T
P
)
Do not exceed
T
L
Temperature
T
S(max)
Ramp-down
Preheat
T
S(min)
t
S
Package
Reel
Information
REF
A
B
d
P0
P1
P
E
F
W
D
D1
D2
W1
Reel
(PCS)
1,000
Per Carton
(PCS)
16,000
mm
5.4±0.1
8.4±0.1
Φ1.5±0.1
4.0±0.1
2.0±0.1
8.0±0.1
1.75±0.1
7.5±0.1
16.0±0.3
Φ330.0
Φ50Min
Φ13±0.15
16.8±2.0
inch
0.216±0.004
0.331±0.004
Φ0.059±0.004
0.157±0.004
0.079±0.004
0.315±0.004
0.069±0.004
0.295±0.004
0.630±
0.012
Φ13.0
Φ1.97Min
0.512±0.006
0.661±0.079
Outline
TAPING
Reel Diameter (mm)
330
Carton Size(mm)
L
360
W
360
H
380
3/3
www.bencent.com.cn
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications
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