New Product Bulletin
Tin/Lead “L” Termination Ceramic Chip Capacitors
KEMET's line of Tin/Lead termination commercial MLCC surface mount capacitors is designed to meet the
needs of commercial, high reliability, and military customer applications where Tin/Lead plating is required. As the
bulk of the electronics industry rapidly marches to RoHS compliance, KEMET realizes the importance of providing
the Tin/Lead terminated products for our valued high reliability and military customers.
KEMET Tin/Lead MLCC surface mount capacitors are available in standard EIA case sizes from 0402 to 2225
and standard capacitance values in X5R, X7R, and C0G dielectrics. Voltage ratings range from 6.3V to 200V.
KEMET's Tin/Lead electroplating process is designed to meet a 5% minimum lead content in the termination of the
component. To order the Tin/Lead terminations, indicate an "L" in the 14th digit of the part number. For additional
dielectrics and voltage ratings please contact the factory or local Sales personnel.
Applications
•
Military Products
• Space Quality Products
• High Reliability Telecommunication Equipment
Outline Drawing
W
T
S
ELECTRODES
L
B
NICKEL PLATE
CONDUCTIVE METALLIZATION
Sn/Pb
PLATE
Table 1 – Dimensions - Millimeters (Inches)
Metric Code
1005
1608
2012
3216
3225
4532
4564
5650
5664
EIA Size Code
0402
0603
0805
1206
1210
1812
1825
2220
2225
L - Length
1.0 (.04)
± .05 (.002)
1.6 (.063)
± 0.15 (.006
2.0 (0.079)
± 0.2 (0.008)
3.2 (0.126)
± 0.2 (0.008)
3.2 (0.126)
± 0.2 (0.008)
4.5 (0.177)
± 0.3 (0.012)
4.5 (0.177)
± 0.3 (0.012)
5.6 (.220)
± 0.4 (.016)
5.6 (.220)
± 0.4 (.016)
W - Width
0.5 (.02)
± .05 (.002)
0.8 (.032)
± 0.15 (.006)
1.2 (0.049
± 0.2 (0.008)
1.6 (0.063)
± 0.2 (0.008)
2.5 (0.098)
± 0.2 (0.008)
3.2 (0.126)
± 0.3 (0.012)
6.4 (0.250)
± 0.4 (0.016)
5.0 (.197)
± 0.4 (.016)
6.3 (.248)
± 0.4 (.016)
B - Bandwidth
0.20 (0.008)
-0.40 (0.016)
0.35 (.014)
± 0.15 (.006)
0.5 (0.02)
± 0.25 (0.010)
0.5 (0.02)
± 0.25 (0.010)
0.5 (0.02)
± 0.25 (0.010)
0.6 (0.024)
± 0.35 (0.014)
0.6 (0.024)
± 0.35 (0.014)
0.6 (0.024)
± .35 (0.014)
0.6 (0.024)
± .35 (0.014)
Band Separation
0.3 (.012)
0.7 (.028)
0.75 (0.030)
N/A
N/A
N/A
N/A
N/A
N/A
Note: For thickness dimensions, see Tables 2 and 3.
F-9037 08/05
Capacitor Ordering Information
C
Style
C - Ceramic
Size Code
See Table 1.
0805
C
103
K
5
R
A
L
Specification
C - Standard
Capacitance Code, pF
First two digits represent significant figures.
Third digit specifies number of zeros. 100 pF = 101.
Capacitance Tolerance
B = ±0.10pF; C = ±0.25pF; D = ±0.5pF
F = ±1%; G = ±2%; J = ±5%,
K = ±10%, M = ±20%
End Metallization
L = SnPb plated nickel barrier
(SnPb 5% minimum)
Failure Rate Level
A = Not Applicable
Temperature Characteristic
Designated by Capacitance
Change over Temperature Range
G – C0G (NP0) (± PPM/°C)
R – X7R (±15%) (-55°C +125°C)
P – X5R (±15%) (-55°C +85°C)
Voltage
1 = 100V; 2 = 200V; 5 = 50V;
3 = 25V; 4 = 16V; 8 = 10V;
9 = 6.3 V
General Performance Characteristics & Electrical Parameters
EIA Case Sizes
Capacitance Range
Test Parameters
0402, 0603, 0805, 1206, 1210, 1812, 1825, 2220, 2225
0.5pF – 47.0μF
Capacitance and Dissipation Factor measured at: C0G – 1kHz and 1 Vrms if capacitance
1000pF and 1MHz and 1 Vrms if capacitance
≤1000pF.
X7R – 1kHz and 1 Vrms if capaci-
tance
≤10μF
and 120Hz and 0.5 Vrms if capacitance >10μF.
X7R/C0G: -55°C to +125°C; X5R: -55°C to +85°C; with no bias capacitance shift limited to
±15% over that range.
B = ±.10pF; C = ± 0.25pF; D = ±0.5pF; F = ±1%; G = ±2%; J = ±5%, K = ±10%, M = ±20%
C0G – 0% maximum; X7R – 2.0% maximum % capacitance loss/decade hour; X5R – 5.0%
6.3; 10; 16; 25; 50; 100; 200 Volts
500MΩ−μF or 50GΩ, whichever is less
2.5 times rated DC voltage
Operating Temperature Range
Capacitance Tolerances
Aging Rate
Voltage Rating
25°C IR @ Rated Voltage
Dielectric Strength (DWV)
These chips are supplied unmarked. If required, they can be laser-marked as an extra cost option. Details on the
marking format are included in KEMET Surface Mount Catalog F3102.
Marking
Soldering Process
The 0402 size is suitable for solder reflow only. The 0603, 0805 and 1206 sizes are suitable for either reflow or
wave soldering. Sizes 1210 and larger should be limited to reflow soldering only.
Recommended Solder Pad Dimensions
T - Total Length S - Separation
Chip Size
mm
0402
0603
0805
1206
1210
1812
1825
2220
2225
2.14
2.78
3.30
4.50
4.50
5.90
5.90
7.00
7.00
in.
0.084
0.109
0.130
0.177
0.177
0.232
0.232
0.275
0.275
mm
0.28
0.68
0.70
1.50
1.50
2.30
2.30
3.30
3.30
in.
0.011
0.027
0.028
0.059
0.059
0.091
0.091
0.13
0.13
mm
0.74
1.08
1.60
2.00
2.90
3.70
6.90
5.50
6.80
in.
0.029
0.043
0.063
0.079
0.114
0.146
0.272
0.216
0.268
mm
0.93
1.05
1.30
1.50
1.50
1.80
1.80
1.85
1.85
in.
0.037
0.041
0.051
0.059
0.059
0.071
0.071
0.073
0.073
W - Pad Width L - Pad Length
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • (864) 963-6300 • www.kemet.com
Integrated technical exchanges
京公网安备 11010802033920号
EEWORLD
