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SQS16A3601DQLF13

Description
RESISTOR, NETWORK, FILM, ISOLATED, 0.75W, SURFACE MOUNT, QSOP, ROHS COMPLIANT
CategoryPassive components    The resistor   
File Size101KB,3 Pages
ManufacturerTT Electronics
Environmental Compliance  
Download Datasheet Parametric View All

SQS16A3601DQLF13 Overview

RESISTOR, NETWORK, FILM, ISOLATED, 0.75W, SURFACE MOUNT, QSOP, ROHS COMPLIANT

SQS16A3601DQLF13 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
package instruction,
Reach Compliance Codecompliant
ECCN codeEAR99
Other featuresPRECISION
Component power consumption0.1 W
The first element resistor3600 Ω
JESD-609 codee3
Manufacturer's serial numberS
Installation featuresSURFACE MOUNT
Network TypeISOLATED
Number of components1
Number of functions8
Number of terminals16
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
method of packingTR, 13 INCH
Rated power dissipation(P)0.75 W
Rated temperature70 °C
Resistor typeARRAY/NETWORK RESISTOR
surface mountYES
technologyTHIN FILM
Temperature Coefficient25 ppm/°C
Temperature coefficient tracking5 ppm/°C
Terminal surfaceMatte Tin (Sn)
Terminal shapeGULL WING
Tolerance0.5%
Operating Voltage100 V
S SERIES
Thin Film Resistor Network
Isolated and Bussed Circuits
RoHS compliant available
FEATURES
Precision Nichrome Resistors on Silicon
Industry Standard Packaging
Ratio Tolerances
TCR Tracking Tolerances
JEDEC 95
< ±0.05%
< ±5 ppm/°
C
SCHEMATICS
ELECTRICAL
1
Standard Resistance Range, Ohms
Resistor Tolerances
Ratio Tolerances
TCR
Operating Temperature Range
Interlead Capacitance
Insulation Resistance
Maximum Operating Voltage
Noise, Maximum (MIL-STD-202, Method 308)
Resistor Power Rating at 70°
C
2
1K to 100K (Isolated)
1K to 30K (Bussed)
±0.1%
±0.05%
Reference TCR table
-55°C to +125°C
<2pF
≥10,000
Megohms
100Vdc or
√PR
-25dB
0.1 watts
1
2
Specifications subject to change without notice.
E24 codes available.
BI Technologies Corporation
4200 Bonita Place
Fullerton, CA 92835 USA
Website:
www.bitechnologies.com
August 25, 2006
page 1 of 3
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